Arrays of integrated analytical devices and their methods for production are provided. The arrays are useful in the analysis of highly multiplexed optical reactions in large numbers at high densities, including biochemical reactions, such as nucleic acid sequencing reactions. The integrated devices allow the highly sensitive discrimination of optical signals using features such as spectra, amplitude, and time resolution, or combinations thereof. The arrays and methods of the invention make use of silicon chip fabrication and manufacturing techniques developed for the electronics industry and highly suited for miniaturization and high throughput.

The present invention provides a method for producing a resin molded article through which air bubbles are not easily formed during imprint molding when a curable composition is applied to a mold having a pattern shaped section. The method for producing a resin molded article is a method for producing a resin molded article through imprint molding, the method including; a specific curable composition application process such as the curable composition application process (1) below, in which a curable composition having a contact angle of 50? or less on a mold having a pattern shaped section is applied to a portion of the mold uncoated with the curable composition; and a curing process in which the curable composition applied to the mold is cured to obtain a resin molded article; (1) a curable composition application process including a microparticle application step in which the curable composition is applied such that a particle size of microparticles of the curable composition when adhering to the mold is 0.5 mm or less.

Aimed at providing a method for molding a thermoplastic resin product and a molding apparatus therefor that enable productivity, transfer quality or the like to be improved. Provided is a method for molding a thermoplastic resin product that includes a heating step, a transfer step, a cooling step and a mold-releasing step, and wherein, in the heating step, a stamper is irradiated with infrared rays in a state where a cooling member is not irradiated with infrared rays, and at least in the final stage of the transfer step, the stamper and the cooling member are brought into contact.

Aimed at providing a method for molding a thermoplastic resin product and a molding apparatus therefor that enable productivity, transfer quality or the like to be improved. Provided is a method for molding a thermoplastic resin product that includes a heating step, a transfer step, a cooling step and a mold-releasing step, and wherein, in the heating step, a stamper is irradiated with infrared rays in a state where a cooling member is not irradiated with infrared rays, and at least in the final stage of the transfer step, the stamper and the cooling member are brought into contact.

Aimed at providing a method for molding a thermoplastic resin product and a molding apparatus therefor that enable productivity, transfer quality or the like to be improved. Provided is a method for molding a thermoplastic resin product that includes a heating step, a transfer step, a cooling step and a mold-releasing step, and wherein, in the heating step, a stamper is irradiated with infrared rays in a state where a cooling member is not irradiated with infrared rays, and at least in the final stage of the transfer step, the stamper and the cooling member are brought into contact.

A headset for virtual reality applications includes an optical element configured to modify light from an electronic display in the headset and to direct the modified light to a user. The optical element may include a Fresnel lens secured to a lens by securing the Fresnel lens to a mold and inserting a casting material into the mold so the casting material forms the lens and a portion of the casting material exists on and past an edge of the Fresnel lens. This encases the edge of the Fresnel lens in the casting material, securing the Fresnel lens to the lens.

Arrays of integrated analytical devices and their methods for production are provided. The arrays are useful in the analysis of highly multiplexed optical reactions in large numbers at high densities, including biochemical reactions, such as nucleic acid sequencing reactions. The integrated devices allow the highly sensitive discrimination of optical signals using features such as spectra, amplitude, and time resolution, or combinations thereof. The arrays and methods of the invention make use of silicon chip fabrication and manufacturing techniques developed for the electronics industry and highly suited for miniaturization and high throughput.

A lens assembly and a method of making the assembly are described. The lens assembly includes a first lens and a second lens slidably coupled with the first lens. The second lens includes a silicone material and has a Fresnel pattern surface. Also described is a display device including the lens assembly and an array of light emitting devices coupled with the lens assembly for outputting light through the lens assembly.

Provided is a curable composition which has chargeability into silicone molds and curability at excellent levels, less causes the silicone molds to swell, and allows the silicone molds to have better durability and a longer service life in repeated use. The curable composition according to the present invention contains curable compounds and a cationic initiator and is used for production of an optical component by molding using silicone molds. The curable compounds include (A) a cycloaliphatic epoxy compound in a content of 10 weight percent or more of the totality of all the curable compounds contained in the curable composition. Of the totality of all the curable compounds contained in the curable composition, 10 to 50 weight percent is a curable compound or compounds having a molecular weight of 400 or more.

Provided is a fine and highly heat-resistant optical component having a coating layer on part thereof. The optical component according to the present invention includes a cured product of a curable composition of an epoxy compound (A); and at least one coating layer having a thickness of 0.1 mm or less on part of the cured product. The optical component has a maximum thickness of 2 mm or less and a maximum width in a plan view of 10 mm or less. This optical component is produced through the steps 1, 2, and 3 as follows. In the step 1, the curable composition is charged into a mold having two or more optical-component concave patterns, and at least one of light and heat is applied to give a cured product having two or more optical-component forms. In the step 2, the cured product is separated to give separated articles. In the step 3, a coating layer or layers is formed on the separated articles.