Techniques are described for additive manufacturing, e.g., 3D printing, stretchable tactile sensors. As described, the techniques may allow the stretchable tactile sensors to be 3D printed under ambient conditions via nanocomposite inks. In various embodiments, sinter-free inks are described with adjustable viscosities and electrical conductivities. Moreover, conductive compositions are described in which micron or submicron-sized silver particles are dispersed in a highly stretchable silicone elastomer. Techniques are described herein in which the inks are used 3D printing process to form tactile sensing platforms and integrated arrays.

The invention relates to potting compounds which cure to polyisocyanurate plastics, to the production of said potting compounds and to the use of the potting compounds for manufacturing electrical components.

A method of manufacturing a conductive element is disclosed. The method being executed by an additive manufacturing system and comprises: dispensing a modeling material on a receiving medium to form a layer, and dispensing a conductive ink on the layer of modeling material to form a conductive element. In some embodiments of the invention the modeling material comprises a sintering inducing agent, and in some embodiments of the present invention a sintering inducing composition is dispensed separately from the modeling material and separately from the conductive ink.

A thermoplastic resin sheet having hair-like bodies expressing good tactile sensation and surface quality, and a molded article thereof. The thermoplastic resin sheet is arranged regularly on at least one surface of a base layer, a continuous phase being formed without a structural boundary between the base layer and the hair-like bodies, wherein the hair-like bodies have an average height of 30 μm or more and 500 μm or less, the surface having the hair-like bodies has an L* value of 20 or less in an L*a*b* color system based on color difference measurement (JIS Z 8729), and the surface having the hairlike bodies has a 60-degree specular gloss (JIS Z 8741) of 1.5% or less.

A sheet-shaped insulating member including a thermoplastic resin fiber and an inorganic fiber is arranged on a surface of a magnet body. The insulating member is compressed while being heated to a temperature higher than or equal to a glass transition temperature of the thermoplastic resin fiber, so that the insulating member is thermocompression-bonded to the magnet body in a state in which the inorganic fiber is elastically compressed. A magnet is thus formed. With the magnet arranged in a slot of a rotor core, the magnet is heated to a temperature higher than or equal to the glass transition temperature of the thermoplastic resin fiber. This causes the inorganic fiber to restore elasticity, so that the magnet is fixed to the rotor core.

A protective member forming apparatus includes an ultraviolet radiation applying table that supports a workpiece on a support surface of a support plate thereof through which ultraviolet rays are transmittable, a delivery unit that holds a resin sheet to which the workpiece is fixed, to unload the workpiece from the ultraviolet radiation applying table, a resin supply unit that supplies an ultraviolet-curable liquid resin to the resin sheet placed on the support surface, a pressing unit that presses the workpiece from a reverse side thereof toward the liquid resin supplied to the resin sheet placed on the support surface, and an ionizer unit that ejects ionized air to the support surface of the ultraviolet radiation applying table.

A 3D printing method and a device for performing same are disclosed. In some examples, a 3D printing output method according to may include generating raw material data for at least one raw material to be used for printing a 3D object on the basis of a raw material characteristic requirement; designing the 3D object. The 3D printing method and a device may include performing a simulation on the 3D object designed on the basis of the raw material data and generating the 3D printing data for performing 3D printing on the 3D object on the basis of an evaluation criterion and the result of the simulation.

Wafer-level methods for manufacturing one or more uniform layers of material on one or more surfaces of a plurality of optoelectronic modules include assembling a wafer assembly, injecting a formable material into the wafer assembly, ejecting excess formable material form the wafer assembly, and hardening one or more formable material layers on one or more surfaces of the plurality of optoelectronic modules such that the hardened one or more formable material layers are the one or more uniform layers of material.

The invention relates to a press for encapsulating electronic components mounted on a carrier, comprising: at least two press parts displaceable relative to each other, a drive system for the displacement of the press parts, and an intelligent control adapted to control the drive system of the press parts wherein the drive system comprises at least two individual controllable actuators, the intelligent control further connects to plural displacement sensors for detecting the relative displacement of the press parts, and wherein the intelligent control is adapted to control the actuators of the drive system dynamically over time based on the measured values detected with the displacement sensors. The invention also relates to an actuator set to convert a prior art press into a press according to the present invention as well as to a method for encapsulating electronic components mounted on a carrier.

A structure includes a first substrate film and a functional electronics assembly. The first substrate film comprises a recess defining a volume. The functional electronics assembly comprises at least a first substrate, at least one electronics component on the first substrate, and at least one connection portion. The functional electronics assembly is connected to the first substrate film via the at least one connection portion. The at least one electronics component is arranged at least partly into the volume. At least part of the at least one electronics component is embedded into a first material arranged into the recess.