A method of manufacturing a medical component includes molding a first member of the medical component from an elastomeric material. The first member includes a first end defined by a closed base wall, an opposing second end which is an open end, a sidewall extending between the first and second ends, and an internal recess to receive at least one electronic device. The method further includes positioning the electronic device within the recess of the first member to form an assembly, such that the electronic device is received in an inverted open cavity defined by the sidewall. The method further includes applying a protective film on the second end of the first member, such that the protective film covers an exposed surface of the electronic device. In addition, the method includes overmolding the assembly with the elastomeric material to form the medical component having the electronic device embedded therein.

A blood pressure monitor cuff is formed by stacking an outer circumferential layer arranged on a side opposite to that of a measurement site and a fluid bladder arranged on the measurement site side. The outer circumferential layer and the fluid bladder are formed of an elastomer material. Two edge portions in a lengthwise direction of the outer circumferential layer protrude in a thickness direction toward the measurement site. The fluid bladder includes a base layer that opposes the outer circumferential layer and a top layer overlapping with the base layer, and the edge portions of the base layer and the top layer are welded together forming a bladder shape. Additional sheets are welded in the thickness direction to the welded edge portions of the top layer and the base layer. The fluid bladder is arranged between the two edge portions of the outer circumferential layer in the width direction.

The method for producing a strip of material with an integrated electronic component comprises the following steps according to the present invention: feeding a material web, cutting a first piece of material from the material web, lifting the first piece of material, applying an electronic component to the material web, once again feeding the material web with the electronic component located on it, cutting a piece of material from the material web to obtain a second piece of material on which the electronic component is located, and applying the first piece of material to the second piece of material so that the electronic component is accommodated between the first piece of material and the second piece of material.

An electronic device of the present invention comprises: an exterior housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a display of which at least a part is exposed through the first surface; and a polymer plate which forms at least a part of the second surface of the housing. The polymer plate comprises: at least one opaque layer; at least one polymer layer that is translucent or transparent and is disposed on the at least one opaque layer; and a coating layer that is disposed on the at least one polymer layer and has a hardness greater than or equal to a selected hardness. Each of the at least one opaque layer, the at least one polymer layer, and the coating layer may comprise a first surface, and a second surface extending from the first surface so that at least a part thereof is bent. Other embodiments are also possible.

A component for a water bearing appliance, wherein the component comprises a first polymeric material and a second polymeric material. The first polymeric material constitutes the external surface of the component and completely covers the second polymeric material. The first polymeric material and the second polymeric material have different characteristics.

A robotic device having in-mold electronics is provided. According to one or more aspects, a robotic device includes an electronic computing unit for controlling the robotic device and a molded part. The molded part includes a thermoformed first film, structural layer, electronic circuit, and a functional component. The molded structural layer is arranged under the first film. The thermoformed second film arranged under the structural layer. The electronic circuit arranged over the second film and adjacent the structural layer. The electronic circuit includes a functional component communicably coupled to the electronic computing unit. The first film is arranged to cover the structural layer, the second film, and the electronic circuit to define an exposed surface of the molded part.

A semiconductor device of embodiments includes: a die pad; a semiconductor chip fixed on the die pad; and a sealing resin covering the semiconductor chip and at least a part of the die pad. The sealing resin has a first protruding portion provided on one side surface and a second protruding portion provided on another side surface. The cross-sectional area of the first protruding portion is equal to or more than 10% of the maximum cross-sectional area of the sealing resin. The cross-sectional area of the second protruding portion is equal to or more than 10%; of the maximum cross-sectional area. The maximum cross-sectional area is equal to or more than 6 mm.sup.2.

An adhesive member includes: a first pin portion to be inserted into a first hole formed in a first adherend member; a second pin portion which is to be inserted into a second hole formed in a second adherend member to be adhered to the first adherend member, and is formed coaxially with the first pin portion; and a flange portion which is formed using an adhesive, and is mounted to a side surface of the first pin portion or a side surface of the second pin portion in a flange shape.

The present disclosure relates to a housing having an interior and an exterior. The housing includes a first housing piece and a second housing piece that are coupled together by a joint. The joint includes a bonding material and the joint is configured such that when the bonding material is pressurized during formation of the joint the bonding material is predisposed to move toward the interior of the housing as compared to the exterior of the housing.

A process for producing an electrical conductor structure that involves embedding at least one metallic conductor track and at least one heating conductor in an electrically insulating substrate, and producing an electric current in the heating conductor so that a first layer of the substrate and a second layer of the substrate fuse in an area surrounding the heating conductor, to seal an interface between the two layers. A conductor structure is also disclosed, in particular in the form of an implantable electrode lead.