A method for manufacturing an electromechanical structure, including producing conductors on a flat film; estimating a strain a plurality of locations of the flat film will undergo during formation thereof into a three-dimensional film; attaching electronic elements on the flat film at selected locations of the plurality of locations of the flat film, wherein the estimated strain of the selected locations of the plurality of locations is less than the estimated strain in other locations of the plurality of locations; forming the flat film into the three-dimensional film; and injection molding material on the three-dimensional film.

Provided is a resin molded article which makes it possible to prevent breakage of a resin and collar loss at joint sections. A resin molded article (1) is formed by resin injection, and comprises a main body (2) and a joint section (3) integrally formed at an outer wall surface (4) of the main body (2) and having a cylindrical section (11) configured to insert therethrough the joint member for attaching the main body (2) to a mating member (6). The joint section (3) is formed to be asymmetric about a perpendicular plane (19) which passes through the central axis (18) of the cylindrical sections (11), and is perpendicular to the outer wall surface (4) of the main body (2).

A measurement system including: a radial external hole on a cover of a railway axle-box on the side of an edge of the cover facing towards a rolling bearing of the axle-box; a smaller axial hole made on the edge of the cover facing towards a ring of the bearing and opening in the radial hole; a cup-shaped body accommodated in the radial hole; a fork shaped spring integrally carried by a bottom wall of the cup-shaped body, projecting in front of the axial hole; a temperature probe slidingly accommodated within the axial hole and including a tubular element incorporating an electrical temperature sensor and an electric cable protruding from a first end of the tubular element accommodated within the cup-shaped body; and an abutting element removably coupled to the first end to cooperate with the spring, which pushes a second end of the probe out of the axial hole.

A housing of an electronic device includes a substrate defining an external surface and internal surface of the housing, at least one sidewall extending from the substrate, and abrasion-resistant members at least partly embedded in the substrate and extending beyond the external surface. The abrasion-resistant members may be formed from metal or ceramic. The substrate comprises a moldable matrix. The abrasion-resistant members are harder than the moldable matrix.

A mold for encapsulating a Pin-Fin type power module with resin is disclosed. The power module includes a DBC or IMS, power chips and multiple terminals provided on a first surface of the DBC or IMS and a Pin-Fin structure provided on a second surface of the DBC or IMS. The mold further includes: a cavity for containing the power module; multiple terminal protecting elements corresponding to the terminals, respectively, each for receiving at least a part of a terminal; and an injection hole provided on the bottom of the mold or on the side wall of the mold, The first surface faces the bottom of the mold and the injection hole is below the first surface when the power module is placed in the cavity. A method for manufacturing a power module is also provided.

To solve the above problem, a pouch forming apparatus according to an embodiment of the present invention includes: a die in which a forming space is recessed inward from a top surface thereof; a partition wall partitioning the forming space into first and second forming spaces; a stripper disposed above the die and configured to descend to contact the die with the pouch film therebetween to fix the pouch film to be seated on a top surface of the die; and an electromagnetic force generation part disposed above the forming space and configured to generate electromagnetic force and configured to apply the electromagnetic force to the forming space.

An improved backsheet used in the construction of solar panels is disclosed. A method of manufacturing the backsheet and solar panel comprising the backsheet, including coextrusion processes are also disclosed. Additionally, a photovoltaic solar panel module comprising the backsheet is disclosed. The backsheet may comprise an exterior layer, a middle layer, and an interior layer. The exterior layer, middle layer, and interior layer may be adjoined, adhered, or affixed via a co-extrusion process, thereby eliminating the need for the use of adhesives for bonding the layers of the backsheet together. There is also disclosed a backsheet which may comprise an exterior layer, an intermediate exterior layer, a middle layer, an intermediate interior layer, and an interior layer. The exterior layer, intermediate exterior layer, middle layer, intermediate interior layer, and interior layer may be adjoined, adhered, or affixed via a co-extrusion process, thereby eliminating the need for the use of adhesives for bonding the layers of the backsheet together. The backsheets improve upon the efficiency, strength, weather resistance, cost, and useful life of the solar panels in which the backsheets are incorporated.

A laser welded structure is formed by laser welding together a resin molded body formed from a thermoplastic polymer alloy containing a crystalline resin and an amorphous resin and a metal body made of a metal. A glass transition temperature of the amorphous resin is lower than a melting start temperature of the crystalline resin.

Disclosed is a method for fabricating a semiconductor package. A mold press with upper and lower chases is used. A molded underfill (MUF) material is dispensed on a bottom surface of a mold cavity to form a first dispensed pattern with a serpentine shape. A base substrate on which die stacks are mounted is loaded on the upper chase. The mold cavity in which the die stacks are inserted is closed and MUF material flows between the die stacks to impregnate the die stacks.

An example antenna device may includes a base member, an antenna that is attached to the base member, and a cover member that is attached to surround at least a part of the base member and at least a part of the antenna. A first part of the base member that is attached to the cover member has a melting temperature equal to or lower than that of the cover member. A second part of the base member to which the antenna is attached has a higher melting temperature than the cover member.