A liquid crystal polyester composition contains: a liquid crystal polyester in an amount of 100 parts by mass as well as a fibrous filler and a plate-like filler in an amount of not less than 65 parts by mass and not more than 100 parts by mass in total. The fibrous filler in the composition has a number average fiber diameter of not less than 5 μm and not more than 15 μm and a number average fiber length of more than 200 μm and less than 400 μm. The mass ratio of the fibrous filler to the plate-like filler in the composition is not less than 3 and not more than 15. The flow starting temperature of the composition is not lower than 250° C. and lower than 314° C.

An encapsulated lead frame has a core element with multiple elongated conductor tracks arranged next to one another. The lead frame also has first partial encapsulations formed by a first encapsulation of the core element in first sub-regions and second partial encapsulations formed by a second encapsulation of the core element in second sub-regions. The first and second partial encapsulations enclose the core element as an overall encapsulation. The first partial regions are spaced apart from one another and each of the first partial encapsulations respectively surrounds only one single conductor track. This configuration avoids gaps that may form at interfaces between a first and second partial encapsulation, may extend between two adjacent conductor tracks, and may allow conductive fluid to accumulate therein and form short-circuits between adjacent conductor tracks. The encapsulated frame is used in a transmission control device. A method for producing an encapsulated lead frame is disclosed.

The present invention relates to the technical field of wire-rod production equipment, in particular relates to an automatic production line for conductive tape and a manufacturing method for conductive tape, Automatic production of conductive tape brings about high production efficiency and low cost; it not only conducts pretreatment and corresponding detections of the conductors in the production process but also conducts follow-up treatment and corresponding detections of the conductive tape and thus improves the production quality of the conductive tape; in addition, it marks the abnormality position of the conductive tape which is abnormal during the withstand voltage detection so that the operator can accurately find out the abnormal section of the conductive tape.

A method of manufacturing a polymer composite having an embedded functionality includes the following steps: providing a dry non-conductive fiber fabric having a nominal weight from 25-600 g/m.sup.2; selecting a paste having viscosity below 600 Pa-s, the paste being a conductive paste, dielectric paste and/or a sensing paste; and applying the selected paste on the dry non-conductive fiber woven fabric by either screen-printing or micro-dispensing, thus making a printed functionality. The method further includes the step of forming a laminate having the dry non-conductive fiber woven fabric having the printed functionality and at least one additional fabric or core; and obtaining a polymer composite from the laminate.

The disclosure provides a preform layered body and a layered container produced by biaxial stretch-blow forming of the layered body. In this preform layered body, an RFID tag has been inserted between an inner-layer-use mouth part and an outer-layer-use mouth part that are to remain unaltered, with no biaxial stretch-blow forming performed thereon, as a container mouth part for a layered container. Since the container mouth part does not become exposed to the high temperature and high pressure for stretch-blow forming purposes, abuses to the RFID tag, such as damage, breakage, and deformation, which arise from the heating, pressurization, and stretching during the stretch-blow forming, can be avoided reliably. In addition, labor-saving and counterfeit prevention effect can be anticipated by causing the RFID tag to hold product information.

A method for additive manufacturing using releasable inks on a substrate mold includes applying a surface treatment to a surface of a mold defining an article for manufacturing, and depositing an ink including particles or fibers of a trace material onto the surface treatment. The particles are coated with a functionalization agent based on a surface energy of the surface treatment for providing a release on demand of the printed trace. The deposited ink is cured to evaporate a solvent carrier, and sintered to bond or melt the particles or fiber together r. The article is molded by adding a molding substance to the mold over the trace, and releasing the molded article from the mold, such that the trace adheres to either the mold or the article based on the functionalization agent providing the trace greater adhesion to the mold or the article to effect the release on demand.

The present disclosure provides an in-mold injection molding process for a Printed Circuit Board Assembly (PCBA) soft material, including the following steps: 1) preheating a Polyethylene Terephthalate (PET) thin film; 2) printing patterns; 3) preparing a diaphragm A; 4) laminating a diaphragm on a Flexible Printed Circuit (FPC) board; 5) scraping printing ink; 6) scraping an adhesive; 7) preparing an inner diaphragm B; and 8) placing prepared diaphragm A and FPC board laminated diaphragm in a mold cavity of an injection mold of a Haitian 130T injection molding machine, preheating injection mold to 30° C., and injecting Thermoplastic Polyurethane (TPU) resin through an injection hole, so that diaphragm A is on an outer side of a product mobile phone protective shell, FPC board laminated diaphragm is on an inner side of the product mobile phone protective shell, and temperature of the TPU resin is at 180° C.

Systems and methods for lighting system lens heating are described. The systems and methods include a substantially clear thermoplastic substrate; and a conductive ink or film circuit on the thermoplastic substrate.

This method for manufacturing a resin structure (1) is provided with: a step for arranging a sheet (30) having a smooth surface (31) having a maximum height roughness of 3 μm or less, inside a forming mold (40) such that the smooth surface (31) faces an internal space (44) of the forming mold (40); a step for molding a resin molded body (10) to which the sheet (30) is adhered, by filling the internal space (44) with a resin; a step for separating the resin molded body (10) from the sheet (30), thereby forming a first region (11) having a maximum height roughness of 3 μm or less on at least a portion of the surface of the resin molded body (10); and a step for using a fluid conductive ink to form a wiring (20) on the first region (11).

An assembly, the assembly including: a substrate; an injection molded structural electronic component; and a layer of polymer that partially encapsulates the substrate and the injection molded structural electronic component and unifies the substrate and the injection molded structural electronic component into one component.