A press system capable of achieving a reduced number of man-hours required for generation of a motion is provided. A controller automatically generates a press motion based at least on a feed-allowable height, a touch position, and a work end position, automatically generates a feeder motion based at least on a feed-allowable height and a feed length, and automatically generates a synthesized motion by synthesizing the press motion and the feeder motion.

A press device subjects a material to pressing using an upper die and a lower die. The press device includes a slide, a bolster disposed below the slide, a servomotor configured to drive the slide, a plurality of capacitor units, and a control unit. The upper die can be attached to a lower face of the slide. The lower die can be placed on the bolster. The capacitor units include a plurality of electric double layer capacitors. The plurality of capacitor units are configured to be able to supply stored electric power to the servomotor. The control unit executes an operation mode in which pressing is performed using capacitor units other than unused capacitor units when the plurality of capacitor units have been set so that at least a portion of the capacitor units are not used.

A press apparatus including: a frame including a support surface, the support surface allowing a lower die support for supporting a lower die to rest on the support surface in close contact therewith; a press shaft configured to support an upper die facing the lower die from vertically above the lower die and to vertically move the upper die relative to the frame in a state where the lower die support rests on the support surface; a chip discharge mechanism configured to rotate the lower die support around a horizontal axis; a force detection unit configured to detect a pressing force of the lower die support against the support surface; and a control unit configured to control the chip discharge mechanism so that the pressing force detected by the force detection unit is equal to or larger than a predetermined threshold.

A press machine includes: a learning-model generating unit that uses one data from among data collected from sensors, as an objective variable, and uses data other than the one data as an explanatory variable to perform machine learning to generate a learning model for the one data, the generation being performed for all the data; a predicted-value calculating unit that inputs an actually measured value of data other than one data from among the data collected from the sensors, into the learning model for the one data to calculate a predicted value of the one data, the calculation being performed for all the data; a degree-of-abnormality calculating unit that calculates a degree of abnormality based on a difference between an actually measured value and a predicted value of the data; and a degree-of-abnormality outputting unit that outputs the calculated degree of abnormality.

A method for planning movements for a servo press and a movement controller configured to plan movements for a servo press and an associated computer program product, wherein a minimum transfer time and a minimum return time are taken into account in a movement cycle for a transport apparatus.

A press device includes a press device main body and a main breaker to supply or stop power from an external power supply to the press device main body. The press device main body includes a slide, a bolster disposed below the slide, a servomotor configured to drive the slide, a power storage unit able to supply stored power to the servomotor, a discharge unit configured to discharge a charge stored in the power storage unit, and a first contactor. An upper die can be mounted on the slide. A lower die can be disposed on the bolster. The first contactor interrupts an electrical connection between the power storage unit and the discharge unit in an energized state and electrically connects the power storage unit and the discharge unit in a non-energized state. The first contactor is supplied with power for energization from the external power source without passing through the main breaker.

A heat press for decorating substrates includes a support frame, a lower platen assembly supported on the support frame, and a linkage assembly having at least an upper link arm pivotally coupled with the support frame for movement to and between first and second positions. An upper platen assembly is coupled with the support frame by the linkage assembly for movement relative to the lower platen assembly to and between an open condition away from the lower platen assembly, and a closed condition adjacent the lower platen assembly, as the upper link arm is moved to and between the first and second positions. A linear actuator cooperates with the linkage assembly to further move the upper platen assembly in the closed condition in a direction to clamp an upper platen against a lower platen by moving an actuator rod from an extended position toward a retracted position.

A control system includes a load detector, a determination unit, and a drive control unit. The load detector detects a load of a slide. The load of the slide includes a positive load due to a pressing force of the slide during pressing and a negative load at the time of a breakthrough. The determination unit determines whether to execute emergency stopping of the slide based on the positive load and the negative load detected by the load detector. The drive control unit controls the driving of the slide based on the determination result of the determination unit.

An apparatus and a method for detecting a failure in a press for punching semiconductor devices are provided, where the method comprises the steps of locating a semiconductor device between a first die-set part and a second die-set part comprised in the press, and moving the first die-set part and the second die-set part relative to each other for punching the semiconductor device therebetween. The method further comprises the steps of monitoring a parameter with a sensor attached to the first die-set part and/or the second die-set part at different positions of the first die-set part when it is moving relative to the second die set part while punching the semiconductor device, and comparing a present variation of the parameter at different positions of the first die-set part relative to the second die-set part against an expected variation of the parameter at positions of the first die-set part relative to the second die-set part during normal operation of the press when there is no failure while punching the semiconductor device. The method also comprises the step of determining that a failure has occurred in the press when the present variation of the parameter is different from the expected variation of the parameter.

A method for monitoring the position and assessing the correct position P.sub.i of a work slide (5) of a wedge drive tool (2) in a press (11), without a position sensor. The slide (5) of the wedge drive tool (2) is actuated from an end position (X.sub.E) back to the starting position (X.sub.A) of the slide (5) by a spring (10). The spring (10) is arranged in the wedge drive tool (2). The press (11) is opened from a lower press position to an upper press position while a slide bed (5B) of the wedge drive tool (2) is relieved. The position of the slide (5) is indirectly detected in that at least the restoring force of the spring (10) is detected and evaluated.