Patent classifications
B32B7/025
HIGH-FREQUENCY DIELECTRIC HEATING ADHESIVE SHEET
A high-frequency dielectric heating adhesive sheet includes: a first adhesive layer; a second adhesive layer; and an intermediate layer located between the first adhesive layer and the second adhesive layer, the first adhesive layer containing a first thermoplastic resin and a first dielectric filler configured to generate heat in response to a high-frequency wave, the second adhesive layer containing a second thermoplastic resin and a second dielectric filler configured to generate heat in response to the high-frequency wave, the intermediate layer containing no dielectric filler in response to the high-frequency wave.
Material for reducing exposure to ionizing radiation
A material for reducing exposure to ionizing radiation. One exemplary embodiment comprises a felt layer; a foil layer; a first adhesive film layer disposed between the outer felt layer and the foil layer; a radiation shield layer; a second adhesive film layer disposed between the foil layer and radiation shield layer; and a foam layer disposed on the surface of the radiation shield layer opposite the second adhesive film layer. The material may be installed in commercial aircraft, corporate aircraft, flight suits, helmets, military uniforms, rotary aircraft, spacecraft, and the like. For example, the material disclosed herein may be provided as a headliner in an aircraft, or alternatively may be used to line the entire interior of an aircraft. In one or more embodiments, the material may be secured to a surface using a hook and loop attachment mechanism.
Material for reducing exposure to ionizing radiation
A material for reducing exposure to ionizing radiation. One exemplary embodiment comprises a felt layer; a foil layer; a first adhesive film layer disposed between the outer felt layer and the foil layer; a radiation shield layer; a second adhesive film layer disposed between the foil layer and radiation shield layer; and a foam layer disposed on the surface of the radiation shield layer opposite the second adhesive film layer. The material may be installed in commercial aircraft, corporate aircraft, flight suits, helmets, military uniforms, rotary aircraft, spacecraft, and the like. For example, the material disclosed herein may be provided as a headliner in an aircraft, or alternatively may be used to line the entire interior of an aircraft. In one or more embodiments, the material may be secured to a surface using a hook and loop attachment mechanism.
RESIN LAYERED PRODUCT, DIELECTRIC LAYER, METAL FOIL WITH RESIN, CAPACITOR ELEMENT, AND PRINTED WIRING BOARD WITH BUILT-IN CAPACITOR
There is provided a resin laminate including a first layer composed of a first resin composition and a second layer composed of a second resin composition. The first resin composition includes a resin component including an epoxy resin, a diamine compound, and a polyimide resin, and a complex metal oxide including at least two selected from Ba, Ti, etc. of 60 to 85 parts by weight based on 100 parts of the first resin composition, and the content of the polyimide resin is 20 to 60 parts by weight based on 100 parts of the resin component. The second resin composition includes a resin component including an epoxy resin and a diamine compound but is free of polyimide resin, and a complex metal oxide including at least two selected from Ba, Ti, etc. of 70 to 90 parts by weight based on 100 parts of the second resin composition.
RESIN LAYERED PRODUCT, DIELECTRIC LAYER, METAL FOIL WITH RESIN, CAPACITOR ELEMENT, AND PRINTED WIRING BOARD WITH BUILT-IN CAPACITOR
There is provided a resin laminate including a first layer composed of a first resin composition and a second layer composed of a second resin composition. The first resin composition includes a resin component including an epoxy resin, a diamine compound, and a polyimide resin, and a complex metal oxide including at least two selected from Ba, Ti, etc. of 60 to 85 parts by weight based on 100 parts of the first resin composition, and the content of the polyimide resin is 20 to 60 parts by weight based on 100 parts of the resin component. The second resin composition includes a resin component including an epoxy resin and a diamine compound but is free of polyimide resin, and a complex metal oxide including at least two selected from Ba, Ti, etc. of 70 to 90 parts by weight based on 100 parts of the second resin composition.
METHOD FOR PRODUCING LAMINATE AND TOUCH PANEL SENSOR
Provided are a method for producing a laminate, including a step 1 of preparing a laminate precursor having a base material, a first transparent conductive portion, and a photosensitive composition layer in this order, a step 2 of pattern-exposing the photosensitive composition layer with scattered light from a side of the photosensitive composition layer opposite to a side on which the base material is provided, and a step 3 of developing the pattern-exposed photosensitive composition layer to form a patterned cured layer; and an application thereof.
Electromagnetic wave absorber and electromagnetic wave absorber-attached molded article
An electromagnetic wave absorber (1) includes a dielectric layer (10), a resistive layer (20), and an electrically conductive layer (30). The resistive layer (20) is disposed on one principal surface of the dielectric layer (10). The electrically conductive layer (30) is disposed on the other principal surface of the dielectric layer (10) and has a sheet resistance lower than a sheet resistance of the resistive layer (20). The resistive layer (20) is a layer that includes tin oxide or titanium oxide as a main component or a layer that is made of indium tin oxide including 40 weight % or more of tin oxide.
Electromagnetic wave absorber and electromagnetic wave absorber-attached molded article
An electromagnetic wave absorber (1) includes a dielectric layer (10), a resistive layer (20), and an electrically conductive layer (30). The resistive layer (20) is disposed on one principal surface of the dielectric layer (10). The electrically conductive layer (30) is disposed on the other principal surface of the dielectric layer (10) and has a sheet resistance lower than a sheet resistance of the resistive layer (20). The resistive layer (20) is a layer that includes tin oxide or titanium oxide as a main component or a layer that is made of indium tin oxide including 40 weight % or more of tin oxide.
COMPOSITE STRUCTURES WITH EMBEDDED ELECTRICAL GRIDS
A composite structure of a cargo body and a method of making the same are disclosed. The composite structure includes at least one electrical grid embedded within fiber-reinforced polymer (FRP) layers. The embedded electrical grid includes a plurality of conductive fibers and a plurality of insulating fibers integrated into a polymer matrix of the FRP layers. The embedded electrical grid may be used for power distribution, structural strengthening and stiffness, and/or puncture detection.
IMPEDANCE MATCHING FILM AND RADIO WAVE ABSORBER
An impedance matching film 10a has a plurality of openings 11. The plurality of openings 11 are formed at equal intervals in a specific direction along main surfaces 10f of the impedance matching film 10a. The impedance matching film 10a has a sheet resistance of 300 to 700Ω/□. A size G of each opening 11 in the specific direction is 50 μm or more and 1000 μm or less. In the impedance matching film 10a, a cross-sectional resistance value R.sub.s is 1MΩ/m or more. The cross-sectional resistance value R.sub.s is determined by dividing a specific resistance of a material forming the impedance matching film 10a by a product of a thickness of the impedance matching film 10a and a distance between the nearest openings 11.