A radio wave absorber includes a resistive layer, an electroconductive layer, and a dielectric layer. The resistive layer has a first main surface with a plurality of first openings formed at equal intervals. The electroconductive layer has a second main surface with a plurality of second openings formed at equal intervals. The dielectric layer is disposed between the resistive layer and the electroconductive layer. In the radio wave absorber, a value obtained by dividing a larger value out of a first ratio and a second ratio by a smaller value out of the first ratio and the second ratio is 1.3 or more. The first ratio is a ratio (G.sub.R/W.sub.R) of a size G.sub.R of the first opening to a distance W.sub.R between the first openings. The second ratio is a ratio (G.sub.C/W.sub.C) of a size G.sub.C of the second opening to a distance W.sub.C between the second openings.

A high-frequency-dielectric-heating-adhesive-sheet includes: a first adhesive layer containing a first thermoplastic resin; a second adhesive layer containing a second thermoplastic resin; and an intermediate layer, a ratio DPM/DP1 of dielectric property DPM of the intermediate layer to dielectric property DP1 of the first adhesive layer and a ratio DPM/DP2 of the dielectric property DPM of the intermediate layer to dielectric property DP2 of the second adhesive layer are each less than one, and the dielectric property DP1, the dielectric property DP2, and the dielectric property DPM are values of dielectric property (tanδ/ε’r) of the first adhesive layer, the second adhesive layer, and the intermediate layer, respectively. tanδ denotes a dielectric dissipation factor at 23° C. and a frequency of 40.68 MHz and ε‘r denotes a relative permittivity at 23° C. and the frequency of 40.68 MHz.

An impedance matching film 10 includes a plurality of domains 11. Each of the domains 11 has a plurality of openings 12 having different shapes. The pluralities of openings 12 are periodically arranged in a specific direction along main surfaces 10f of the impedance matching film 10. Each of sizes of the domains 11 in the specific direction is 50 μm or more.

A lightning strike dispersion structure may include a composite component having an outboard surface, wherein the composite component is electrically nonconductive. The lightning strike dispersion structure may include a metal sheet coupled to and extending across a minority portion of the outboard surface of the composite component, wherein the metal sheet is electrically conductive. The lightning strike dispersion structure may also include a metal stud coupled to and in electrical contact with the metal sheet, the metal stud extending completely through the composite component, wherein the metal stud is electrically conductive.

An electronic component housing defining an EMI shield and an ESD protection cover includes a polymeric core formed from a first polymeric material with a reinforcement material and an overmolded outer layer formed from a second polymeric material with between about 2 wt. % and about 30 wt. % graphene. The reinforcement material provides structural reinforcement to the electronic component housing and is at least one of carbon fiber, glass, talc, mineral filler, and combinations thereof, the overmolded outer layer defines a housing skin disposed on the polymeric core.

An electronic component housing defining an EMI shield and an ESD protection cover includes a polymeric core formed from a first polymeric material with a reinforcement material and an overmolded outer layer formed from a second polymeric material with between about 2 wt. % and about 30 wt. % graphene. The reinforcement material provides structural reinforcement to the electronic component housing and is at least one of carbon fiber, glass, talc, mineral filler, and combinations thereof, the overmolded outer layer defines a housing skin disposed on the polymeric core.

A heated composite structure and a method for forming a heated composite structure. The structure includes carbon fibers embedded within a thermoplastic matrix. The carbon fibers are connected with first and second electrodes that are configured to be connected with an electric source such that applying current to the electrodes causes current to flow through the embedded carbon fibers to provide resistive heating sufficient to heat the composite structure to impede formation of ice on the composite structure.

A layered structure for forming charging terminals for high power applications. In some embodiments, the layered structure may include a substrate and a contact layer disposed over at least a portion of the substrate. The substrate may have a conductivity greater than 40% International Annealed Copper Standard (IACS). The contact layer may demonstrate a coefficient of friction of less than 1.4, such as from 0.1 to 1.4, as measured in accordance with American Society of Testing and Materials (ASTM) G99-17. The contact layer may include a precious-metal-based alloy, such as a silver-samarium alloy.

A layered structure for forming charging terminals for high power applications. In some embodiments, the layered structure may include a substrate and a contact layer disposed over at least a portion of the substrate. The substrate may have a conductivity greater than 40% International Annealed Copper Standard (IACS). The contact layer may demonstrate a coefficient of friction of less than 1.4, such as from 0.1 to 1.4, as measured in accordance with American Society of Testing and Materials (ASTM) G99-17. The contact layer may include a precious-metal-based alloy, such as a silver-samarium alloy.

A stacked body includes a first resin layer including a thermoplastic first resin as a main material, a pattern including a conductor layer on one principal surface of the first resin layer, and a second resin layer including a thermoplastic second resin as a main material. The first resin layer is softer than the second resin layer. The first resin layer has a lower dielectric constant than the second resin layer. A pattern including the conductor layer is at least partially embedded in the first resin layer, and includes a portion in contact with the first resin layer along a layer direction (X-Y plane) of the first resin layer and a portion in contact with the first resin layer along a stacking direction (X-Z plane) of the first resin layer, the second resin layer, and the pattern including the conductor layer.