An information handling system, comprising: a voltage source; a thermally regulated structure, including: a thermal fabric layer, the thermal fabric layer having a porosity; a laminate layer coupled to the thermal fabric layer, wherein a shape of the laminate layer controls the porosity of the thermal fabric layer; a temperature sensor configured to detect a first temperature of the information handling system; a thermal management controller to perform operations comprising: determining that the first temperature is above a threshold; in response, calculating a voltage to apply to the thermally regulated structure based on the first temperature; and providing a command to the voltage source to apply the voltage to the laminate layer of the thermally regulated structure to adjust a shape of the laminate layer such the porosity of the thermal fabric provides an emissivity of the thermally regulated structure to thermally radiate heat from the thermally regulated structure.

An information handling system, comprising: a voltage source; a thermally regulated structure, including: a thermal fabric layer, the thermal fabric layer having a porosity; a laminate layer coupled to the thermal fabric layer, wherein a shape of the laminate layer controls the porosity of the thermal fabric layer; a temperature sensor configured to detect a first temperature of the information handling system; a thermal management controller to perform operations comprising: determining that the first temperature is above a threshold; in response, calculating a voltage to apply to the thermally regulated structure based on the first temperature; and providing a command to the voltage source to apply the voltage to the laminate layer of the thermally regulated structure to adjust a shape of the laminate layer such the porosity of the thermal fabric provides an emissivity of the thermally regulated structure to thermally radiate heat from the thermally regulated structure.

Embodiments disclosed herein include a stitched filtering fabric including a barrier layer configured to inhibit air flow through the filtering fabric, a yarn stitched through and forming a plurality of stitch holes in the barrier layer, and a first yarn layer comprising interlocking loops of the yarn. The barrier layer is configured to direct air flow through the yarn within the stitched holes.

Layered nonwoven textile containing a first layer (T) of filaments, which contains endless filaments containing a first carrier polymer (A1) and a first binding polymer (B1), which forms at least a part of surface of said endless filaments and which has a melting temperature at least 5° C. lower than the first carrier polymer (A1), wherein the first layer (T) of filaments contains bonding points in a spaced arrangement, wherein the bonding points interconnect the filaments and are formed by the first binding polymer (B1), a second layer (M) of filaments, which contains filaments containing a carrier material, the stiffness of which is lower than the stiffness of the first carrier polymer (A1), and a second binding polymer (B2), which has a melting temperature at least 5° C., preferably at least 10° C., lower than the carrier material and the first carrier polymer (A1), wherein the second layer (M) of filaments contains bonding points in a spaced arrangement, wherein the bonding points interconnect the filaments of the second layer (M) and are formed by the second binding polymer (B1).

Layered nonwoven textile containing a first layer (T) of filaments, which contains endless filaments containing a first carrier polymer (A1) and a first binding polymer (B1), which forms at least a part of surface of said endless filaments and which has a melting temperature at least 5° C. lower than the first carrier polymer (A1), wherein the first layer (T) of filaments contains bonding points in a spaced arrangement, wherein the bonding points interconnect the filaments and are formed by the first binding polymer (B1), a second layer (M) of filaments, which contains filaments containing a carrier material, the stiffness of which is lower than the stiffness of the first carrier polymer (A1), and a second binding polymer (B2), which has a melting temperature at least 5° C., preferably at least 10° C., lower than the carrier material and the first carrier polymer (A1), wherein the second layer (M) of filaments contains bonding points in a spaced arrangement, wherein the bonding points interconnect the filaments of the second layer (M) and are formed by the second binding polymer (B1).

A radiative cooling device that is in a state in which a radiative surface is colored is provided. A radiative cooling device CP includes an infrared radiative layer A that radiates infrared light IR from a radiative surface H, a light reflective layer B that is disposed on the side opposite to the radiative surface H with respect to the infrared radiative layer A, and a color portion X. The infrared radiative layer A is a resin material layer J that has a thickness adjusted so as to emit a heat radiation energy greater than an absorbed solar energy in a wavelength range from 8 μm to 14 μm, and the color portion X contains a colorant that absorbs light in the visible range

A radiative cooling device that is in a state in which a radiative surface is colored is provided. A radiative cooling device CP includes an infrared radiative layer A that radiates infrared light IR from a radiative surface H, a light reflective layer B that is disposed on the side opposite to the radiative surface H with respect to the infrared radiative layer A, and a color portion X. The infrared radiative layer A is a resin material layer J that has a thickness adjusted so as to emit a heat radiation energy greater than an absorbed solar energy in a wavelength range from 8 μm to 14 μm, and the color portion X contains a colorant that absorbs light in the visible range

Provided is a laminated film for easy material recycling and with excellent rigidity and thermal shrinkage resistance. The laminated film includes, in sequence, a layer A containing an ethylene polymer (A) containing 80 mol % or more of a structural unit derived from ethylene, a layer B containing an ethylene polymer (B) containing 70 mol % or more of a structural unit derived from ethylene and an inorganic filler, a layer C containing an ethylene polymer (C) containing 70 mol % or more of a structural unit derived from ethylene, at least one layer selected from the group consisting of a barrier layer and an adhesive layer, and a layer D containing an ethylene polymer (D) containing 70 mol % or more of a structural unit derived from ethylene.

A polymer film and laminated glass manufactured using the polymer film. The polymer film includes a first and second layer, and a third layer disposed between the first and second layers, and the two surfaces of the third layer are in contact with the first and second layers, respectively. The surface of the first layer that is not in contact with the third layer is a first surface, and the surface of the second layer not in contact with the third layer is a second surface, wherein the first surface has a void volume (Vv) value at a material ratio of 10% ranging from 3 μm.sup.3/μm.sup.2 to 30 μm.sup.3/μm.sup.2 and a dale void volume (Vvv) at a material ratio of 80% less than 2 μm.sup.3/μm.sup.2, and the ratio of the maximum pit height (Sv) of the first surface to the thickness of the first layer is 0.2 or less.

To provide a quantum dot-containing resin sheet or film, a method for producing the same, and a wavelength conversion member that can, in particular, solve the problem of aggregation of the quantum dots and the problem with the use of a scattering agent, suppress a decrease in light conversion efficiency, and improve the light conversion efficiency of a resin molded product containing quantum dots. The quantum dot-containing resin sheet or film of the present invention includes a stack of a plurality of resin layers, at least one of the resin layers containing quantum dots, and the plurality of resin layers is integrally molded through co-extrusion.