A laminate body including a base material and a flat silicone sealing layer adhered thereto, generally without any voids, is provided. Also provided is a curable hot melt silicone composition layer with a particular curable hot melt silicone composition, providing a laminate body that does not readily cause stress on a substrate after the curable hot melt silicone composition is cured. A laminate body comprises a base material, and a curable hot melt silicone composition layer in contact with the base material. The curable hot melt silicone composition includes an organopolysiloxane resin containing siloxane units selected from a group containing T units or Q units making up at least 20 mol % or more of all siloxane units. The curable hot melt silicone composition generally has a melt viscosity as measured using a flow tester at a pressure of 2.5 MPa and at 100° C. of 5,000 Pa.Math.s or less.

A light path control member according to an embodiment comprises: a first substrate; a first electrode disposed on the first substrate; a second substrate disposed on the first substrate; a second electrode disposed under the second substrate; a light conversion part disposed between the first electrode and the second electrode; and an adhesive layer disposed between the second electrode and the light conversion part, wherein the light conversion part comprises alternately disposed partition wall portions and accommodating portions, the accommodating portions comprise a dispersion and a plurality of light absorbing particles disposed in the dispersion, and the log volume resistivity of the adhesive layer is 9 Ω.Math.cm to 15 Ω.Math.cm.

A ceramic circuit board includes a ceramic base material, a metal layer (first metal layer), and a marker portion. The marker portion is formed on the surface of the first metal layer. The surface of the metal layer (first metal layer) may be plated. When the surface of the metal layer (first metal layer) is plated, the marker portion may be formed on the plating.

A polymer bilayer includes a layer of a porous fluoropolymer directly overlying a layer of polyethylene. The polyethylene layer may be porous or dense and may include an ultra-high molecular weight polymer. The polymer bilayer may be co-integrated with structures (e.g., wearable devices) exposed to high thermal loads (>0-1000 W/m.sup.2) and provide passive cooling thereof. For instance, passive cooling of AR/VR glasses under different solar loads may be achieved by a polymer bilayer that is both highly reflective across solar heating wavelengths and highly emissive in the long-wavelength infrared. The high reflectance decreases energy absorption across the solar spectrum while the high emissivity promotes radiative heat transfer to the surroundings.

A polymer bilayer includes a layer of a porous fluoropolymer directly overlying a layer of polyethylene. The polyethylene layer may be porous or dense and may include an ultra-high molecular weight polymer. The polymer bilayer may be co-integrated with structures (e.g., wearable devices) exposed to high thermal loads (>0-1000 W/m.sup.2) and provide passive cooling thereof. For instance, passive cooling of AR/VR glasses under different solar loads may be achieved by a polymer bilayer that is both highly reflective across solar heating wavelengths and highly emissive in the long-wavelength infrared. The high reflectance decreases energy absorption across the solar spectrum while the high emissivity promotes radiative heat transfer to the surroundings.

A polymer bilayer includes a layer of a porous fluoropolymer directly overlying a layer of polyethylene. The polyethylene layer may be porous or dense and may include an ultra-high molecular weight polymer. The polymer bilayer may be co-integrated with structures (e.g., wearable devices) exposed to high thermal loads (>0-1000 W/m.sup.2) and provide passive cooling thereof. For instance, passive cooling of AR/VR glasses under different solar loads may be achieved by a polymer bilayer that is both highly reflective across solar heating wavelengths and highly emissive in the long-wavelength infrared. The high reflectance decreases energy absorption across the solar spectrum while the high emissivity promotes radiative heat transfer to the surroundings.

A polymer bilayer includes a layer of a porous fluoropolymer directly overlying a layer of polyethylene. The polyethylene layer may be porous or dense and may include an ultra-high molecular weight polymer. The polymer bilayer may be co-integrated with structures (e.g., wearable devices) exposed to high thermal loads (>0-1000 W/m.sup.2) and provide passive cooling thereof. For instance, passive cooling of AR/VR glasses under different solar loads may be achieved by a polymer bilayer that is both highly reflective across solar heating wavelengths and highly emissive in the long-wavelength infrared. The high reflectance decreases energy absorption across the solar spectrum while the high emissivity promotes radiative heat transfer to the surroundings.

An object of the present invention is to provide a laminate having a smaller transmission loss in a high frequency band.

A laminate having a metal layer and a resin layer in contact with at least one surface of the metal layer, in which a dielectric loss tangent of the resin layer at a temperature of 23° C. and a frequency of 28 GHz is less than 0.002, and an average length RSm at an interface between the metal layer and the resin layer in a cross-section along a thickness direction of the laminate is 1.2 μm or less.

An object of the present invention is to provide a laminate having a smaller transmission loss in a high frequency band.

A laminate having a metal layer and a resin layer in contact with at least one surface of the metal layer, in which a dielectric loss tangent of the resin layer at a temperature of 23° C. and a frequency of 28 GHz is less than 0.002, and an average length RSm at an interface between the metal layer and the resin layer in a cross-section along a thickness direction of the laminate is 1.2 μm or less.

A real wood sheet capable of being used for automatic wrapping, the real wood sheet including a wood layer; a mesh layer disposed on a surface of the wood layer; and a flexible layer disposed on a surface of the mesh layer such that the mesh layer is disposed between the wood layer and the flexible layer.