Patent classifications
B32B9/041
Hybrid metal composite structures, rocket motors and multi stage rocket motor assemblies including hybrid metal composite structures, and related methods
A hybrid metal composite (HMC) structure comprises tiers comprising fiber composite material structures, and additional tiers longitudinally adjacent one or more of the tiers and comprising perforated metallic structures and additional fiber composite material structures laterally adjacent the perforated metallic structures. Methods of forming an HMC structure, and related rocket motors and multi-stage rocket motor assemblies are also disclosed.
Substrate bonding method and laminated body production method
A substrate bonding method which enables forming a precision fine space using a method that is simpler and easier than conventional methods; and a laminated body production method that uses the substrate bonding method. This substrate bonding method includes disposing a first substrate on a photoresist pattern formed on a support film so as to bring the first substrate into contact with a surface of the photoresist pattern located on the side opposite to the support film, and pressure-bonding the support film, the photoresist pattern, and the first substrate; releasing the bonded support film after the pressure-bonding; and disposing a second substrate on the photoresist pattern so as to bring the second substrate into contact with the surface of the photoresist pattern located on the side opposite to the first substrate, and pressure-bonding the first substrate, the photoresist pattern, and the second substrate.
Electroless palladium plating solution and palladium film
An electroless palladium plating liquid containing at least hydrazine or a salt thereof as a reducing agent, which has excellent bath stability in the vicinity of acidity to neutrality range, long-term stability, and is capable of suppressing the Pd film deposition rate decrease caused by elution of etching resist. An electroless palladium plating solution of the invention includes a palladium compound, hydrazine or its salt, at least one selected from a group consisting of a compound represented by the following formula (1) or its salt and a compound represented by the following formula (2) or its salt; and a pH of 8 or less, NH.sub.2NHCOR.sub.1 (1), (NH.sub.2NHCO).sub.2(R.sub.2)n (2), wherein R.sub.1 represents H, NH.sub.2, an alkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, NHNH.sub.2, or an aromatic group, wherein each of these groups may have a substituent; R.sub.2 represents (CH.sub.2) or an aromatic group, wherein each of these groups may have a substituent; and n represents an integer of 0 to 10.
INSTRUMENT COMPRISING A VACCUM CHAMBER
An instrument having a vacuum chamber, wherein a wall of the vacuum chamber includes a layer of carbon fiber reinforced thermoset having a thickness in a range of 1-10 mm, a first and a second layer of ceramic material having a thickness in a range of 40-60 μm, and a layer of aluminum having a thickness in a range of 0.5-10 mm. The first layer of ceramic material is positioned between the layer of carbon fiber reinforced thermoset and the layer of aluminum. The layer of aluminum is positioned between the first layer of ceramic material and the second layer of ceramic material. The second layer of ceramic material is positioned most to a side of an interior surface of the wall of the vacuum chamber.
BONDED STRUCTURE
A bonded structure includes a first bonded member having a first bonding surface, a second bonded member having a second bonding surface, and a bonding layer that bonds the first bonding surface and the second bonding surface. The bonding layer includes a stress relaxation layer containing a chain polymer, a first bonded molecular layer containing a first bonded molecule bonded to the first bonding surface, and a second bonded molecular layer containing a second bonded molecule bonded to the second bonding surface. A first end of the chain polymer is bonded to the first bonded molecule via a first binding molecule or without bonding via the first binding molecule. A second end of the chain polymer is bonded to the second bonded molecule via a second binding molecule or without bonding via the second binding molecule.
COPPER-CERAMIC BONDED BODY, INSULATED CIRCUIT BOARD, METHOD FOR PRODUCING COPPER-CERAMIC BONDED BODY, AND METHOD FOR PRODUCING INSULATED CIRCUIT BOARD
A copper-ceramic bonded body includes a copper member made of copper or a copper alloy, and a ceramic member made of silicon nitride, the copper member and the ceramic member being bonded to each other, in which a maximum length of a Mg—N compound phase which is present at a bonded interface between the copper member and the ceramic member is less than 100 nm, and in a unit length along the bonded interface, the number density of the Mg—N compound phase in a range of a length of 10 nm or more and less than 100 nm is less than 8 pieces/μm.
Ceramic Surface Modification Materials
Porous, binderless ceramic surface modification materials are described, and applications of use thereof. The ceramic surface material is in the form of an interconnected network of porous ceramic material on a substrate. The ceramic material may include a metal oxide, a metal hydroxide, and/or hydrates thereof, or a metal carbonate or metal phosphate, on a substrate surface. The substrate may be in the form of a metal or polymer particulate, powder, extrudate, or flakes.
MULTILAYER PLATE
A multilayer plate is disclosed which includes three layers. A carbon layer is covered by a metallic layer, and a substrate layer is covered at least partially by the carbon layer and the metallic layer. The metallic layer includes a first zone and a second zone. The first zone is a zone defined by the carbon layer and the second zone is a zone defined by carbon layer-free zone. The first zone has a higher thermal conductivity as the second zone. The multilayer plate can be used as a demonstration display for demonstrating the different thermal conductivity in the first zone compared to the second zone to a consumer.
PISTON INCLUDING A COMPOSITE LAYER APPLIED TO METAL SUBSTRATE
A piston for a heavy duty diesel engine including a composite layer forming at least a portion of a combustion surface is provided. The composite layer has a thickness greater than 500 microns and includes a mixture of components typically used to form brake pads, such as a thermoset resin, an insulating component, strengthening fibers, and an impact toughening additive. According to one example, the thermoset resin is a phenolic resin, the insulating component is a ceramic, the strengthening fibers are graphite, and the impact toughening additive is an aramid pulp of fibrillated chopped synthetic fibers. The composite layer also has a thermal conductivity of 0.8 to 5 W/m.Math.K. The body portion of the piston can include an undercut scroll thread to improve mechanical locking of the composite layer. The piston can also include a ceramic insert between the body portion and the composite layer.
PURE COPPER PLATE, COPPER/CERAMIC BONDED BODY, AND INSULATED CIRCUIT SUBSTRATE
A pure copper sheet of the present invention has a composition including 99.96 mass % or more of Cu, 10.0 mass ppm or less of a total content of Pb, Se, and Te, 3.0 mass ppm or more of a total content of Ag and Fe, and inevitable impurities as a balance, in which an average crystal grain size of crystal grains on a rolled surface is 10 μm or more, an aspect ratio of the crystal grain on the rolled surface is 2.0 or less, and an average crystal grain size of the crystal grains on the rolled surface after a pressure heat treatment performed under conditions of a pressure of 0.6 MPa, a heating temperature of 850° C., and a retention time at the heating temperature of 90 minutes is 500 μm or less.