A material can have a layered structure with at least a first layer, including a carbon-based material or a substrate of a material other than a carbon-based material, a second layer, including a carbon-based material, and a third, intermediate layer that separates and interconnects the first and second layers. The carbon-based material includes at least 50 at. % carbon, has a hexagonal lattice and the layer or layers including the carbon-based material has/have a thickness of 1-20 times the size of a carbon atom. The intermediate layer is a layer that includes a salt having ions that include at least two separate cyclic, planar groups that are capable of forming π-π-stacking with the material of the second layer and that the third, intermediate layer is connected to at least the second layer by π-π-stacking caused by said cyclic planar groups of the salt ions.

A sound insulating material, a sound insulating plate, and a partition structure of a train carriage are provided. The sound insulating material comprises the following components in weight ratio: 2-8 parts of tricalcium silicate; 4-10 parts of calcium hydroxide; 10-30 parts of aluminosilicate; 4-10 parts of alumina; 5-15 parts of iron oxide; 10-30 parts of a binder; and 5-10 parts of a curing agent, wherein the binder is at least two of lithium silicate, sodium silicate and calcium silicate; the curing agent is at least one of lithium oxide, magnesium oxide and silica; and the mixture of the aluminosilicate, alumina and iron oxide expands at 1000° C.-1350 ° C. to form particles. The sound insulating plate made of this material is lightweight and has a sound insulation capacity of 35-42 dB.

A method of forming a dry floor assembly includes cleaning an upper layer with methyl ethyl ketone (MEK) prior to bonding the upper layer to a carbon wicking layer. Said cleaning removes release agent from the upper layer. The method also includes bonding the upper layer to the carbon wicking layer after said cleaning.

A display device includes a substrate which includes an active area including a plurality of sub pixels and a non-active area, and is formed of one of transparent conductive oxide or an oxide semiconductor layer, an insulating layer on the substrate, a plurality of thin film transistors which is on the insulating layer and includes an active layer having a channel region, a gate electrode, a source electrode, and a drain electrode and a plurality of light emitting diodes disposed in the plurality of sub pixels on the insulating layer, wherein the substrate includes a plurality of holes which overlap with at least a part of the active layer.

Described herein are methods for continuous production of an exfoliated two-dimensional (2D) material comprising passing a 2D material mixture through a convergent-divergent nozzle, the 2D material mixture comprising a 2D layered material and a compressible fluid. The method of the present disclosure employs physical compression and expansion of a flow of high-pressure gases, leaving the 2D layered material largely defect free to produce an exfoliated 2D layered in a simple, continuous, and environmentally friendly manner.

A display device and a manufacturing method of a display device are provided. A display device includes: a substrate; a semiconductor layer on the substrate; a source electrode and a drain electrode on the semiconductor layer; an auxiliary electrode on a same layer as the source electrode and the drain electrode; a first electrode electrically connected with the source electrode or the drain electrode; a light emitting element layer on the first electrode; and a second electrode on the light emitting element layer, and the auxiliary electrode includes at least one groove located inside the auxiliary electrode.

A curable resin or adhesive composition includes at least one monomer, a photoinitiator capable of initiating polymerization of the monomer when exposed to light, and at least one energy converting material, preferably a phosphor, capable of producing light when exposed to radiation (typically X-rays). The material is particularly suitable for bonding components at ambient temperature in situations where the bond joint is not accessible to an external light source. An associated method includes: placing a polymerizable adhesive composition, including a photoinitiator and energy converting material, such as a down-converting phosphor, in contact with at least two components to be bonded to form an assembly; and, irradiating the assembly with radiation at a first wavelength, capable of conversion (down-conversion by the phosphor) to a second wavelength capable of activating the photoinitiator, to prepare items such as inkjet cartridges, wafer-to-wafer assemblies, semiconductors, integrated circuits, and the like.

A sound damping wallboard for installation on an installed wallboard, a sound damping wallboard system, and a method of constructing a sound damping wallboard on a building structure are disclosed. The sound damping wallboard includes a gypsum layer having a gypsum layer inner surface and a gypsum layer outer surface, a first sound damping layer disposed at the gypsum layer inner surface and having a first sound damping layer inner surface opposite the gypsum layer inner surface, a first encasing layer disposed at the gypsum layer outer surface, a second encasing layer disposed at the first sound damping layer inner surface, and a second sound damping layer disposed at the second encasing layer opposite the first sound damping layer inner surface.

A composite molded cargo body panel including a core, an interior skin secured to a first side of the core having a thickness, and exterior skin secured to a second side of the core, and a recess. The core thickness at the recess is reduced compared to a maximum core thickness, and the recess defines a support surface. A pocket is formed in the recess, with the core thickness at the pocket being less than the core thickness at the recess. A logistics insert is attached to the support surface of recess so that, at the recess, the logistics insert extends across the pocket.

A carrier substrate to be used, when manufacturing a member for an electronic device on a surface of a substrate, by being bonded to the substrate, includes at least a first glass substrate. The first glass substrate has a compaction described below of 80 ppm or less. Compaction is a shrinkage in a case of subjecting the first glass substrate to a temperature raising from a room temperature at 100° C./hour and to a heat treatment at 600° C. for 80 minutes, and then to a cooling to the room temperature at 100° C./hour.