DISPLAY DEVICE
20230126073 · 2023-04-27
Inventors
- Joon Gu Lee (Seoul, KR)
- HYE JIN GWARK (Suwon-si, KR)
- ARONG KIM (Hwaseong-si, KR)
- Jae Ik Kim (Seoul, KR)
- Jungsun PARK (Yongin-si, KR)
- HEEMIN PARK (Hwaseong-si, KR)
- Yeon Hwa Lee (Hwaseong-si, KR)
- KYU H. HWANG (Seongnam-si, KR)
Cpc classification
B32B9/04
PERFORMING OPERATIONS; TRANSPORTING
H01L33/62
ELECTRICITY
B32B2307/20
PERFORMING OPERATIONS; TRANSPORTING
B32B15/04
PERFORMING OPERATIONS; TRANSPORTING
B32B2457/20
PERFORMING OPERATIONS; TRANSPORTING
H01L33/20
ELECTRICITY
H01L33/382
ELECTRICITY
H01L2933/0066
ELECTRICITY
International classification
H01L33/00
ELECTRICITY
H01L33/20
ELECTRICITY
Abstract
A display device and a manufacturing method of a display device are provided. A display device includes: a substrate; a semiconductor layer on the substrate; a source electrode and a drain electrode on the semiconductor layer; an auxiliary electrode on a same layer as the source electrode and the drain electrode; a first electrode electrically connected with the source electrode or the drain electrode; a light emitting element layer on the first electrode; and a second electrode on the light emitting element layer, and the auxiliary electrode includes at least one groove located inside the auxiliary electrode.
Claims
1. A display device comprising: a substrate; a semiconductor layer on the substrate; a source electrode and a drain electrode on the semiconductor layer; an auxiliary electrode on a same layer as the source electrode and the drain electrode; a first electrode electrically connected with the source electrode or the drain electrode; a light emitting element layer on the first electrode; and a second electrode on the light emitting element layer, wherein the auxiliary electrode comprises at least one groove located inside the auxiliary electrode.
2. The display device of claim 1, wherein the light emitting element layer and the second electrode are located in the groove of the auxiliary electrode, and the second electrode directly contacts a side surface of the second electrode in the groove of the auxiliary electrode.
3. The display device of claim 1, wherein the auxiliary electrode has an undercut structure in which a side surface is positioned inside a top surface, the light emitting element layer is in direct contact with the auxiliary electrode on the side surface of the auxiliary electrode, and a part of the second electrode and the auxiliary electrode directly contact on the side surface of the auxiliary electrode.
4. The display device of claim 3, wherein a region where the second electrode and the auxiliary electrode directly contact is farther from the substrate than a region where the light emitting element layer and the auxiliary electrode directly contact.
5. The display device of claim 1, wherein the auxiliary electrode comprises a first layer, a second layer, and a third layer, and a planar area of the second layer is narrower than planar areas of the first layer and the third layer.
6. The display device of claim 1, wherein a width of a groove of the at least one groove of the auxiliary electrode is wider than a thickness of the auxiliary electrode.
7. The display device of claim 1, wherein a width of a groove of the at least one groove of the auxiliary electrode is 1,000 Å to 20,000 Å.
8. The display device of claim 1, wherein a planar shape of the auxiliary electrode is polygonal or circular.
9. The display device of claim 1, wherein a planar shape of a groove of the at least one groove is linear, polygonal, or circular.
10. The display device of claim 1, wherein a planar shape of the auxiliary electrode and a planar shape of a groove of the at least one groove are the same.
11. A display device comprising: a substrate; a semiconductor layer on the substrate; a source electrode and a drain electrode on the semiconductor layer; a first electrode electrically connected with the source electrode or the drain electrode; a light emitting element layer on the first electrode; a second electrode on the light emitting element layer; and an auxiliary electrode on a same layer as the first electrode, wherein the auxiliary electrode comprises at least one groove located inside the auxiliary electrode.
12. The display device of claim 11, wherein the light emitting element layer and the second electrode are located in the groove of the auxiliary electrode, and the second electrode directly contacts a side surface of the auxiliary electrode in the groove of the auxiliary electrode.
13. The display device of claim 11, wherein the auxiliary electrode has an undercut structure in which a side surface is positioned inside a top surface, the light emitting element layer is in direct contact with the auxiliary electrode on the side surface of the auxiliary electrode, and a part of the second electrode ad the auxiliary electrode directly contacts the side surface of the auxiliary electrode.
14. The display device of claim 13, wherein a region where the second electrode and the auxiliary electrode directly contact is farther from the substrate than a region where the light emitting element layer and the auxiliary electrode directly contact.
15. The display device of claim 11, wherein a width of a groove of the at least one groove of the auxiliary electrode is wider than a thickness of the auxiliary electrode.
16. The display device of claim 11, wherein a width of a groove of the at least one groove of the auxiliary electrode is 1,000 Å to 20,000 Å.
17. The display device of claim 11, wherein a planar shape of the auxiliary electrode is polygonal or circular.
18. The display device of claim 11, wherein a planar shape of a groove of the at least one groove is linear, polygonal, or circular.
19. The display device of claim 11, wherein a planar shape of the auxiliary electrode and a planar shape of a groove of the at least one groove are the same.
20. A manufacturing method of a display device, the manufacturing method comprising: forming a semiconductor layer on a substrate; forming a source electrode and a drain electrode that are electrically connected with the semiconductor layer; forming a first electrode that is electrically connected with the source electrode or the drain electrode; and forming an auxiliary electrode on a same layer as the source electrode and the drain electrode or on a same layer as the first electrode, wherein the auxiliary electrode comprises one or more grooves.
21. The manufacturing method of the display device of claim 20, further comprising forming a light emitting element layer on the first electrode, wherein the light emitting element layer is deposited at a first angle with respect to a top surface of the auxiliary electrode.
22. The manufacturing method of the display device of claim 21, further comprising forming a second electrode on the light emitting element layer, wherein the second electrode is deposited at a second angle with respect to the top surface of the auxiliary electrode, and the second angle is smaller than the first angle.
23. The manufacturing method of the display device of claim 22, wherein, in the forming of the second electrode on the light emitting element layer, the second electrode directly contacts the auxiliary electrode at a side surface of the auxiliary electrode.
24. The manufacturing method of the display device of claim 23, wherein a region in which the second electrode and the auxiliary electrode directly contact is located farther from the substrate than a region in which the light emitting device layer and the auxiliary electrode directly contact each other.
25. The manufacturing method of the display device of claim 20, further comprising etching the auxiliary electrode to form an undercut structure in which a side surface of the auxiliary electrode is located more inward than a top surface of the auxiliary electrode.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0034]
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TABLE-US-00001 DESCRIPTION OF REFERENCE SYMBOLS SUB: substrate ACT: semiconductor layer AE: auxiliary electrode SE: source electrode DE: drain electrode 191: first electrode 270: second electrode 360: light emitting element layer DPA: display area NDA: non-display area ED: light emitting element
DETAILED DESCRIPTION
[0048] The present invention will be described more fully herein with reference to the accompanying drawings, in which some embodiments of the invention are shown. As those skilled in the art would realize, the described embodiments may be modified in various different ways.
[0049] The drawings and description are to be regarded as illustrative in nature and not restrictive. Like reference numerals designate like elements throughout the specification.
[0050] In addition, since the size and thickness of each configuration shown in the drawings may be arbitrarily indicated for better understanding and ease of description, the present invention is not necessarily limited to the drawings. In the drawings, the thickness of layers, films, panels, regions, etc., may be exaggerated for clarity. In addition, in the drawings, the thickness of some layers and regions may be exaggerated for better understanding and ease of description.
[0051] It is to be understood that when an element such as a layer, film, region, or substrate is referred to as being “on” another element, it may be directly on the other element or one or more intervening elements may also be present. In contrast, when an element is referred to as being “directly on” another element, there are no intervening elements present. Further, throughout the specification, the word “on” a target element is to be understood to mean positioned above or below the target element, and is not necessarily to be understood to mean positioned “at an upper side” based on a direction opposite to gravity.
[0052] In addition, unless explicitly described to the contrary, the word “comprise,” and variations such as “comprises” or “comprising,” are to be understood to imply the inclusion of stated elements but not the exclusion of any other elements.
[0053] Further, throughout the specification, the phrase “on a plane” means viewing a target portion from the top, and the phrase “on a cross-section” means viewing a cross-section formed by vertically cutting a target portion from the side.
[0054] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as terms commonly understood by those skilled in the art to which this invention belongs. Also, terms such as terms defined in commonly used dictionaries should be interpreted as having meaning consistent with meaning in the context of the related art, and unless the term is interpreted in an ideal or overly formal sense, they are explicitly defined here.
[0055] Herein, a display device according to an embodiment will be described with reference to the accompanying drawings.
[0056]
[0057] A plurality of pixels PX may be positioned in the display area DPA of a substrate SUB. Each pixel PX may include a light emitting element and thus may emit light. Referring to
[0058]
[0059]
[0060]
[0061] Referring to
[0062] The buffer layer BUF may include any of a silicon oxide (SiO.sub.x), a silicon nitride (SiN.sub.x), a silicon oxynitride (SiO.sub.xN.sub.y), and amorphous silicon (Si). The buffer layer BUF forms a smooth surface on an upper portion of the substrate SUB and blocks the penetration of impurity elements. However, the buffer layer BUF may be omitted depending on an embodiment.
[0063] A semiconductor layer ACT is positioned on the buffer layer BUF. The semiconductor layer ACT includes a channel area CA, and a source area SA and a drain area DA that are positioned at opposite sides of the channel area CA. The source area SA and the drain area DA are in a state of having conductivity by doping or plasma treatment. The semiconductor layer ACT may include amorphous silicon, crystalline silicon, or an oxide semiconductor.
[0064] A gate insulating layer GI is positioned on the semiconductor layer ACT.
[0065] The gate insulating layer GI may include any of a silicon oxide (SiO.sub.x), a silicon nitride (SiN.sub.x), and a silicon oxynitride (SiO.sub.xN.sub.y), and may be a single-layer or multi-layer structure thereof.
[0066] A gate electrode GAT is positioned on the gate insulating layer GI. The gate electrode GAT may include molybdenum (Mo), aluminum (AI), copper (Cu) and/or titanium (Ti), and may be a single-layer or multi-layer structure thereof.
[0067] An interlayer insulating layer ILD may be positioned on the gate electrode GAT. The interlayer insulating layer ILD may include any of a silicon oxide (SiO.sub.x), a silicon nitride (SiN.sub.x), and a silicon oxynitride (SiO.sub.xN.sub.y), and may be a single-layer or multi-layer structure thereof.
[0068] In an embodiment in which the interlayer insulating layer ILD is a double layer, the silicon oxide layer may be a lower layer, and the silicon nitride may be an upper layer.
[0069] A source electrode SE and a drain electrode DE may be positioned on the interlayer insulating layer ILD. The source electrode SE and the drain electrode DE respectively contact the source area SA and the drain area DA of the semiconductor layer ACT through an opening of the interlayer insulating layer ILD.
[0070] In an embodiment, the auxiliary electrode AE is positioned on a same layer as the source electrode SE and the drain electrode DE. In an embodiment, the source electrode SE, the drain electrode DE, and the auxiliary electrode AE may be formed by a same process and contain a same material. For example, the source electrode SE, the drain electrode DE, and the auxiliary electrode AE may include aluminum (AI), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), nickel (Ni), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), and/or copper (Cu), and the like, and may be a single-layer or multi-layer structure thereof. For example, the source electrode SE, the drain electrode DE, and the auxiliary electrode AE may have a triple-layered structure of a first layer containing a refractory metal, such as molybdenum, chromium, tantalum, and titanium, or an alloy thereof, a second layer containing an aluminum-based metal with low resistivity, a silver-based metal, a copper-based metal, and a third layer containing a refractory metal, such as molybdenum, chromium, tantalum, and titanium.
[0071]
[0072] In
[0073] In addition, referring to
[0074] An insulating layer VIA is positioned on the source electrode SE, the drain electrode DE, and the auxiliary electrode AE. The insulating layer VIA may include an organic insulation material, such as a general-purpose polymer such as any of polymethyl methacrylate (PMMA) or polystyrene (PS), polymer derivatives with phenolic groups, acryl-based polymers, imide-based polymers, polyimides, acryl-based polymers, siloxane-based polymers, and the like.
[0075] The insulating layer VIA may include a first opening OP1 overlapping the drain electrode DE, and a second opening OP2 overlapping the auxiliary electrode AE.
[0076] The first electrode 191 is formed on the insulating layer VIA and is connected with the drain electrode DE through the first opening OP1 of the insulating layer VIA. In an embodiment, the first electrode 191 may include one or more of Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, ITO, IZO, ZnO, and/or In.sub.2O.sub.3.
[0077] The first electrode 191 may be a reflective electrode, and may include a reflective film formed of Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, or a compound thereof, and a film positioned on the reflective film and formed of ITO, IZO, ZnO, or In.sub.2O.sub.3.
[0078] A partitioning wall 350 may be positioned on the first electrode 191.
[0079] The partitioning wall 350 may include an organic insulation material, such as a general-purpose polymer such as any of polymethyl methacrylate (PMMA) or polystyrene (PS), polymer derivatives with phenolic groups, acryl-based polymers, imide-based polymers, polyimides, acryl-based polymers, siloxane-based polymers, and the like.
[0080] The partitioning wall 350 may include a third opening OP3 overlapping the first electrode 191 and a fourth opening OP4 overlapping the auxiliary electrode AE. Although the fourth opening OP4 is illustrated to be wider than the second opening OP2, depending on embodiments, the second opening OP2 and the fourth opening OP4 may be formed concurrently through a same process. In this case, a side surface of the second opening OP2 and a side surface of the fourth opening OP4 may be connected to, or define, a single plane.
[0081] A light emitting element layer 360 may be positioned in the third opening OP3 of the partitioning wall 350. In an embodiment, the light emitting element layer 360 may include an electron injection layer, an electron transport layer, an emission layer, a hole transport layer, and a hole injection layer. The light emitting element layer 360 may be formed on side and top surfaces of the auxiliary electrode AE having an undercut structure.
[0082] The second electrode 270 may be positioned on the partitioning wall 350 and the light emitting element layer 360. The first electrode 191, the light emitting element layer 360, and the second electrode 270 may form a light emitting diode ED. The second electrode 270 may be formed on side and top surfaces of the auxiliary electrode AE, and may be deposited at a different angle from the light emitting element layer 360 to directly contact the auxiliary electrode AE.
[0083] Herein, the contact with the second electrode 270 in the auxiliary electrode AE will be described.
[0084] Referring to
[0085] Referring to
[0086] Thus, as shown in
[0087] Next, as shown in
[0088] Thus, as shown in
[0089] A method that enables the second electrode 270 to contact the auxiliary electrode AE at the side is economical because there is no need of removing the light emitting element layer 360 for contact between the second electrode 270 and the auxiliary electrode AE.
[0090]
[0091] Referring to
[0092] That is, in this case, a process for removing the light emitting element layer is additionally required compared to the embodiment of
[0093] However, in the display device according to an embodiment, the auxiliary electrode AE is formed in an undercut structure, and incident angles of the light emitting element layer 360 and the second electrode 270 are different on the side, and, thus, the second electrode 270 and auxiliary electrode AE directly contact each other at the sides of the second electrode 270 and the auxiliary electrode AE. This is economical since the removal process of the light emitting element layer 360 is not required.
[0094] However, when the auxiliary electrode AE and the second electrode 270 are in contact from the side, the contact area may be reduced compared to the top contact. However, in the display device according to an embodiment, a groove is formed inside the auxiliary electrode AE, and the contact area between the auxiliary electrode AE and the second electrode 270 is increased, even on the side of the inner groove. That is, the side area is increased by forming the internal groove in the auxiliary electrode AE, and the contact area of the second electrode 270 is maximized or increased through the side surfaces.
[0095]
[0096] Widths of auxiliary electrodes AE of
TABLE-US-00002 TABLE 1 Referred drawing FIG. 10 FIG. 12 Contact type Entire top area contact Side surface contact Contact structure
.Math. .Math. 20 μm 20 μm Contact area (pad 24 60 diameter 20 μm, 3,000 Å contact reference in Tip) Area ratio 100% 250%
[0097] As shown in Table 1, when the pad diameter was 20 μm and the contact area in the auxiliary electrode was 3,000 Å, the contact area of the embodiment of
[0098] As described above, the display device according to an embodiment forms a groove inside the auxiliary electrode AE, and the auxiliary electrode AE and the second electrode 270 additionally contact more in the inner groove, thereby increasing the contact area and effectively reducing the resistance of the second electrode 270.
[0099] The structure including the first groove H1 is shown in
[0100]
[0101] In an embodiment, a width of the inner groove positioned inside the auxiliary electrode AE may be greater than a height of the auxiliary electrode.
[0102] That is, when the width of the groove is smaller than the height of the auxiliary electrode, deposition may not sufficiently occur on the side surface of the auxiliary electrode at an angle.
[0103] In an embodiment, the height of the auxiliary electrode may be between 1,000 Å and 20,000 Å. In addition, the width of the inner groove may be 1,000 Å to 20,000 Å.
[0104] However, this is an example, and depending on embodiments, the width of the inner groove positioned inside the auxiliary electrode AE may be less than the height of the auxiliary electrode AE. This can be appropriately adjusted according to the contact area of the auxiliary electrode AE and the second electrode 270 desired in each embodiment.
[0105] In
[0106]
[0107] In
[0108]
[0109] Referring to
[0110] The auxiliary electrode AE includes an undercut structure, and a light emitting element layer 360 and a second electrode 270 are positioned on the auxiliary electrode AE. As previously shown in
[0111] In an embodiment, the auxiliary electrode AE may have a quadrangle shape, but the shape of the auxiliary electrode AE may be varied, such as a polygon and a circle, and the shape of the groove H1 inside the auxiliary electrode AE may also be varied, such as a polygon, a circle, a straight line, and the like.
[0112] Referring to
[0113] Referring to
[0114] Referring to
[0115] While the present invention has been described in connection with what are presently considered to be some practical embodiments, it is to be understood that the invention is not limited to the disclosed embodiments. On the contrary, it is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.