Patent classifications
B32B13/06
FLEXIBLE POLYUREAS FOR FLEXIBLE PACKAGING ADHESIVE WITHOUT AROMATIC AMINE MIGRATION
Provided is an adhesive comprising a reaction product of (A) an aliphatic polyisocyanate having a molecular weight of from 132 to 700; and (B) a polyaspartate comprising a reaction product of (B1) a polyamine having a molecular weight of at least 240, and (B2) a Michael addition receptor, wherein viscosity @ 23° C. according to ASTM D1084-16, remains below 150 cps after four hours, and wherein the adhesive develops an acceptable bond strength to a substrate, defined as having a minimum of 150 g/in. measured @ 23° C. according to ASTM D 1876-01 or substrate tear, in less than five days after the substrate is laminated with the adhesive. The inventive flexible packaging adhesives are free of aromatic amines and may find use in multilayer laminates for a variety of industries, including the food processing, cosmetics, and detergents industries.
Plaster boards and methods for making them
The present disclosure relates to plaster boards and methods for making them. For example, one aspect of the disclosure is a plaster board comprising one or more continuous layers of material disposed within a body of hardened plaster material, the first side and second side of each continuous layer of material being substantially covered by the hardened plaster material. In certain such embodiments, each continuous layer of material includes a polymer (e.g., a damping polymer) disposed on a carrier sheet. Another aspect of the disclosure relates to a method for making a plaster board that involves drying a wet body of plaster material while a continuous layer of material or precursor therefor is disposed within it.
Command address input buffer bias current reduction
A memory device may include one or more memory banks that store data and one or more input buffers. The input buffers may receive command address signals to access the one or more memory banks. The memory device may operate in one of a first mode of operation or a second mode of operation. The one or more input buffers may operate under a first bias current when the memory device is in the first mode of operation or a second bias current when the memory device is in the second mode of operation, and the first bias current may be greater than the second bias current.
Command address input buffer bias current reduction
A memory device may include one or more memory banks that store data and one or more input buffers. The input buffers may receive command address signals to access the one or more memory banks. The memory device may operate in one of a first mode of operation or a second mode of operation. The one or more input buffers may operate under a first bias current when the memory device is in the first mode of operation or a second bias current when the memory device is in the second mode of operation, and the first bias current may be greater than the second bias current.
Building material device method
A method of forming a building material device utilizing a vehicle tire where the vehicle tire is split into three portions. Two of the vehicle portions are recombined into a subunit which is capable of holding the third portion within a chamber. The subunit containing the second portion is then combined with panels to form a finished unit capable of being used in a building structure.
Building material device method
A method of forming a building material device utilizing a vehicle tire where the vehicle tire is split into three portions. Two of the vehicle portions are recombined into a subunit which is capable of holding the third portion within a chamber. The subunit containing the second portion is then combined with panels to form a finished unit capable of being used in a building structure.
Sheet Material, Mold, and Methods of Making and Using the Sheet Material and Mold
A one-piece component comprising a tetrahedral-octahedral honeycomb lattice is disclosed herein, along with a mold, a system and methods of making the component. A one-piece component comprising a truncated tetrahedral-octahedral honeycomb lattice also is disclosed, along with corresponding molds, systems and methods.
FLOOR ELEMENT FOR FORMING A FLOOR COVERING AND A FLOOR COVERING
A floor element for forming a floor covering, wherein the floor element comprises a decorative layer made of a ceramic material; a support layer arranged below the decorative layer; and a reinforcing layer arranged in between the decorative layer and the support layer, wherein the support layer comprises edges provided with coupling elements configured to realize a mechanical coupling with coupling elements of an adjacent floor element.
Insulating wall panels for building construction and related methods
Wall panels for building construction may include a corrugated sheet including a first series of peaks on a first side of the corrugated sheet configured for positioning to face a room interior. The corrugated sheet may also include a second series of peaks on a second, opposite side of the corrugated sheet configured for positioning to face a room exterior. A radiant barrier including a material reflective to heat may be secured only to the second series of peaks. The corrugated sheet may form pockets of air between the radiant barrier and the corrugated sheet.
Insulating wall panels for building construction and related methods
Wall panels for building construction may include a corrugated sheet including a first series of peaks on a first side of the corrugated sheet configured for positioning to face a room interior. The corrugated sheet may also include a second series of peaks on a second, opposite side of the corrugated sheet configured for positioning to face a room exterior. A radiant barrier including a material reflective to heat may be secured only to the second series of peaks. The corrugated sheet may form pockets of air between the radiant barrier and the corrugated sheet.