An aluminum matrix composite is provided. The aluminum matrix composite comprises at least one reinforcement layer and an aluminum layer. The at least one reinforcement layer comprises a plurality of reinforcement sheets. The plurality of reinforcement sheets are uniformly dispersed in at least a portion of the aluminum layer

A method of manufacturing a two-layer metal wire, in particular in a gold-based alloy and of silver, which comprises a succession of steps which consist in coupling an outer metal tube (2) to an inner metal tube (4) interposing a first binding thickness (3) in low-melting metal material, welding the inner surface (12) of the outer metal tube (2) to the outer surface (13) of the first binding thickness (3) and the inner surface (13″) of the same first binding thickness (3) to the outer surface (141) of the inner metal tube (4), to firmly associate the outer tube (2) with the inner tube (4) together, so as to form a tubular element (7, 107) which has at least three metal layers, and then draw, by final drawing, the tubular element (7, 107) to obtain a compound metal wire (9) from at least three metal layers. The object of the present invention is also a semi-finished tubular element (7, 107), having at least three metal layers, which comprises an outer metal tube (2), an Inner metal tube (4) and a first binding thickness (3) interposed between the outer metal tube (2) and the inner metal tube (4).

A metal strip and a process for manufacturing such a metal strip are disclosed. In order to be able to reproducibly manufacture a durable metal strip, it is proposed for a butt seam to extend essentially between a first cladding layer of a first strip transverse portion and a second strip transverse portion.

In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.

There are provided: an aluminum alloy substrate for a magnetic disk, the aluminum alloy substrate including an aluminum alloy including 0.4 to 3.0 mass % (hereinafter, %) of Fe, less than 0.10% of Si, less than 0.10% of Mg, and the balance of Al and unavoidable impurities, in which an AlFe-based intermetallic compound having a longest diameter of 2 m or more and less than 3 m is dispersed at a distribution density of 1000 particles/mm.sup.2 or more, and a MgSi-based intermetallic compound having a longest diameter of 1 m or more is dispersed at a distribution density of 1 particle/mm.sup.2 or less; a method for producing the same; and a magnetic disk in which an electroless NiP plating treatment layer and a magnetic layer thereon are disposed on a surface of the aluminum alloy substrate for a magnetic disk.

In some aspects, this disclosure relates to improved Z-grade materials, such as those used for shielding, systems incorporating such materials, and processes for making such Z-grade materials. In some examples, the Z-grade material includes a diffusion zone including mixed metallic alloy material with both a high atomic number material and a lower atomic number material. In certain examples, a process for making Z-grade material includes combining a high atomic number material and a low atomic number material, and bonding the high atomic number material and the low atomic number together using diffusion bonding. The processes may include vacuum pressing material at an elevated temperature, such as a temperature near a softening or melting point of the low atomic number material. In another aspect, systems such as a vault or an electronic enclosure are disclosed, where one or more surfaces of Z-grade material make up part or all of the vault/enclosure.

Provided are (i) a solder connection structure having improved solder wettability and including an aluminum base material and (ii) a film forming method for forming, on the aluminum base material, a metal film having high solder wettability. A solder connection structure (50) includes (i) an aluminum substrate (30), (ii) an Ni film (35) formed on the aluminum substrate by a cold spray method, and (iii) a mixed metal film (40) provided on the Ni film, the mixed metal film (40) being formed by the cold spray method with use of a mixed powder material, the mixed powder material being a mixture of Ni powder (41) and Sn powder (42).

A method for forming an aluminum matrix composite is provided. At least one reinforcement layer and an aluminum layer are provided. The at least one reinforcement layer is disposed on at least one surface of the aluminum layer to form a first composite structure. The first composite structure is pressed to form a second composite structure. A process of alternatively folding and pressing the second composite structure is repeated to form the aluminum matrix composite.

A bonded structure, including a Zn-based brazing filler metal and a Cu-based bonding object bonded to each other, wherein the bonded structure includes a joint including a first alloy phase, a second alloy phase and a third alloy phase between the Zn-based brazing filler metal and the Cu-based bonding object, wherein the second alloy phase is formed at an interface between the first alloy phase and the third alloy phase, and wherein, in a cross section parallel to a bonding direction, a ratio of the second alloy phase at the interface between the first alloy phase and the third alloy phase is less than 80%.

An apparatus for localized patterned surface hardening for light-weight alloys to increase wear resistance under lubricated contact is provided. The apparatus includes a first metallic structure and a second metallic structure. The second metallic structure includes a contact surface and is disposed in lubricated contact with the first metallic structure at the contact surface, wherein the second metallic structure is constructed with a lighter-than-steel material and wherein the contact surface includes a localized surface hardened pattern.