A mirrored apparatus includes a substrate having a surface and including an additive manufactured aluminum and about 2 to about 30 weight % (wt. %) silicon. The mirrored apparatus also includes a finish layer arranged directly on the surface of the substrate. The finish layer includes a polished surface opposite the substrate. The mirrored apparatus further includes a reflective layer arranged on the polished surface of the finish layer.

A laminate includes a base substrate, and a coating layer formed on the base substrate. The coating layer includes a copper alloy portions derived from precipitation-hardening copper alloy particles and hard particle portions which are harder than the copper alloy portions, the hard particle portions are derived from hard particles, and the parts bond with each other via an interface. Each of the hard particle portions has a non-spherical shape. A sliding member includes the laminate in at least one sliding portion. A method for manufacturing a laminate includes a step of spraying a mixture in a non-molten state including precipitation-hardening copper alloy particles and hard particles having a non-spherical shape and being harder than the copper alloy particles onto a base substrate, to form a coating layer on the base substrate.

A thermoelectric conversion element includes an element body formed of a thermoelectric conversion material of a silicide-based compound, and electrodes each formed on one surface of the element body and the other surface opposite the one surface. The electrodes are formed of a sintered body of a copper silicide, and the electrodes and the element body are directly joined.

A laminate includes a base substrate, and a coating layer formed on the base substrate. The coating layer includes a copper alloy portions derived from precipitation-hardening copper alloy particles and hard particle portions which are harder than the copper alloy portions, the hard particle portions are derived from hard particles, and the parts bond with each other via an interface. Each of the hard particle portions has a non-spherical shape. A sliding member includes the laminate in at least one sliding portion. A method for manufacturing a laminate includes a step of spraying a mixture in a non-molten state including precipitation-hardening copper alloy particles and hard particles having a non-spherical shape and being harder than the copper alloy particles onto a base substrate, to form a coating layer on the base substrate.

Aspects relate to methods of building Z-graded radiation shielding and covers. In one aspect, the method includes: providing a substrate surface having about medium Z-grade; plasma spraying a first metal having higher Z-grade than the substrate surface; and infusing a polymer layer to form a laminate. In another aspect, the method includes electro/electroless plating a first metal having higher Z-grade than the substrate surface. In other aspects, the invention provides methods of improving an existing electronics enclosure to build a Z-graded radiation shield by applying a temperature controller to at least part of the enclosure and affixing at least one layer of a first metal having higher Z-grade than the enclosure.

In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.

A copper-based alloy which includes Cu, Ni, Si, Fe, and Mg, and at least one selected from the group consisting of Mo, W, and V, and in which a content of Mg is 0.02 mass % or more. The copper-based alloy exhibits wear resistance and improved weldability with respect to a substrate.

According to an embodiment, a method for manufacturing a thin plate comprises placing a copper piece on a side of an aluminum piece, forming a heterogeneous metal joined body by performing friction welding on the side of the aluminum piece and a side of the copper piece to thereby form a spread layer of the aluminum piece on the side of the aluminum piece, and a spread layer of the copper piece on the side of the copper piece, the respective spread layers of the aluminum piece and the copper piece being mixed into a mixed layer that is then cured, and forming the thin plate by roll-milling the heterogeneous metal joined body.

A coated component and a method of preparing a coated component are provided. The method comprises providing a substrate; and applying a dual coating system to the substrate. The applying of the dual coating system includes applying a diffusion barrier coating; and applying a corrosion-resistant coating. The corrosion-resistant coating comprises a greater concentration of silicon and aluminum than the diffusion barrier coating, and the dual layer coating system includes an aluminide interdiffusion zone.

Proposed is a laminated anodic oxide film structure in which a plurality of anodic oxide films are stacked. More particularly, proposed is a laminated anodic oxide film structure having a high degree of strength.