The present invention relates to a composite container comprising a bottom film layer and a top film layer at least partially adhered to the bottom film layer. The top film layer is scored to form at least one resealable flap and at least one pull tab which is not adhered to the bottom film layer. The bottom film layer comprises at least one cavity opening. A cardboard layer is adhered on its lower surface to the upper surface of the top film layer, wherein the cardboard layer has at least one cavity opening which is substantially aligned with the scoring of the top film layer resealable flap and the cardboard layer is perforated to define a perimeter of at least one pull tab which is substantially aligned with and adhered, on its underside, to the upper surface of the top film layer pull tab.

A Sn-plated steel sheet including a base plated steel sheet having a steel sheet, a Sn-plated layer on at least one surface of the steel sheet, and a film layer containing a zirconium oxide and a tin oxide. An adhesion amount of Sn per surface of the Sn-plated steel sheet is 0.1 g/m.sup.2 or more and 15 g/m.sup.2 or less, an amount of the zirconium oxide in the film layer is in a range of 1 mg/m.sup.2 or more and 30 mg/m.sup.2 or less in terms of an amount of metal Zr, a peak position of a binding energy of Sn3d.sub.5/2 of the tin oxide is 1.4 eV or more and less than 1.6 eV from a peak position of a binding energy of metal Sn, and a quantity of electricity required for reduction of the tin oxide is more than 5.0 mC/cm.sup.2 and 20 mC/cm.sup.2 or less.

A zinc-plated steel sheet for hot stamping according to an aspect of the present invention includes a steel substrate and a plated layer provided on a surface of the steel substrate, in which the steel substrate contains, in % by mass, C: 0.10 to 0.5%, Si: 0.7 to 2.5%, Mn: 1.0 to 3%, and Al: 0.01 to 0.5%, with the balance being iron and inevitable impurities, and the steel substrate has, in the inside thereof, an internal oxide layer consists of an oxide containing at least one of Si and Mn having a thickness of 1 μm or more, and a decarburized layer having a thickness of 20 μm or less from an interface with the plated layer toward an internal direction of the steel substrate.

A composite molded cargo body panel including a core, an interior skin secured to a first side of the core having a thickness, and exterior skin secured to a second side of the core, and a recess. The core thickness at the recess is reduced compared to a maximum core thickness, and the recess defines a support surface. A pocket is formed in the recess, with the core thickness at the pocket being less than the core thickness at the recess. A logistics insert is attached to the support surface of recess so that, at the recess, the logistics insert extends across the pocket.

A plated steel sheet includes: a steel sheet; and a plating layer that is formed on at least a part of a surface of the steel sheet, in which a chemical composition of the plating layer includes, by mass %, Al: more than 5.00% and 35.00% or less, Mg: 3.00% to 15.00%, Si: 0% to 2.00%, Ca: 0% to 2.00%, and a remainder of Zn and impurities, in which in a cross section of the plating layer in a thickness direction, the area ratio of a lamellar structure in which an (Al—Zn) phase and a MgZn.sub.2 phase are arranged in layers is 10% to 90%, a lamellar spacing of the lamellar structure is 2.5 μm or less, and the area ratio of an (Al—Zn) dendrite is 35% or less.

A hot-dip coated steel product including: a steel product; and a coating layer including a Zn—Al—Mg alloy layer disposed on a surface of the steel product, in which the Zn—Al—Mg alloy layer includes a Zn phase, an Al phase, and a MgZn.sub.2 phase, and contains a Mg—Sn intermetallic compound phase in the Zn phase, and the coating layer has a chemical composition satisfying a predetermined average composition, a total area proportion of the Al phase and the MgZn.sub.2 phase is 70% or more, an area proportion of the Zn phase is 30% or less, an average value of cumulative circumferential lengths of the Al phase is less than 88 mm/mm.sup.2, and a total frequency in number of the Al phase having a circumferential length of 50 μm or more is less than 100.

The present disclosure relates to a thermosetting resin composition for a semiconductor package including a modified phenylene ether oligomer or a modified poly(phenylene ether) having ethylenically unsaturated groups at both ends thereof; a thermosetting resin; a predetermined elastic (co)polymer; and an inorganic filler, and a prepreg and a metal clad laminate including the same.

A protection film, a method of manufacturing the protection film are provides, a display panel and a display device. The protection film includes a main portion and at least one cover surrounded by the main portion. The cover is at least partially connected to the main portion. At least part of an edge of the cover is a first edge, and the first edge and the main portion are not fixed.

A coated metal sheet includes a steel substrate and a coating on at least one surface of the steel substrate. The coating includes between 0.2 and 0.7% by weight of Al, with a remainder of the metal coating being Zn and inevitable impurities. The coated metal sheet was subjected to a skin pass operation after coating. An outer surface of the metal coating has a waviness Wa.sub.0.8 of less than or equal to 0.55 μm.

Load-bearing apparatus/systems for location in the vicinity of energized power lines are provided. The apparatus includes a base member. The base member has an upper layer and a backing surface layer. An uppermost surface of the upper layer is adapted to support on it at least power line workers and/or related stringing equipment. At least the uppermost surface of the upper layer is adapted to be electrically conductive. Methods for forming the apparatus are also provided.