Patent classifications
B32B15/12
AEROSOL-GENERATING ARTICLE WITH LAMINATED WRAPPER
An aerosol-generating article is provided, including: an aerosol-forming substrate including plant material cut filler and between about 6 percent and about 20 percent of an aerosol-former, the plant material cut filler including at least 25 percent of plant lamina per weight of total plant material; and a laminated wrapper including a heat conductive layer and a heat insulating layer, the laminated wrapper being arranged at least partly wrapped around the aerosol-forming substrate and having a thickness of between 30 micrometers and 100 micrometers, and the heat conductive layer and the heat insulating layer overlapping along an axial direction of the aerosol-generating article.
TAMPER EVIDENT HYBRID RESEALABLE CONTAINER
The present invention relates to a composite container comprising a bottom film layer and a top film layer at least partially adhered to the bottom film layer. The top film layer is scored to form at least one resealable flap and at least one pull tab which is not adhered to the bottom film layer. The bottom film layer comprises at least one cavity opening. A cardboard layer is adhered on its lower surface to the upper surface of the top film layer, wherein the cardboard layer has at least one cavity opening which is substantially aligned with the scoring of the top film layer resealable flap and the cardboard layer is perforated to define a perimeter of at least one pull tab which is substantially aligned with and adhered, on its underside, to the upper surface of the top film layer pull tab.
METHODS OF REPLENISHING A WRITABLE AND CLEANABLE ARTICLE AND KITS
Methods and kits including writable and cleanable articles, wherein in one embodiment, a method of replenishing a hydrophilic surface on a writable and cleanable article is provided. The method comprising: providing a writable and cleanable article that includes a hydrophilic overcoat that has an at least partially depleted (i.e., at least partially exhausted) hydrophilic surface; and applying a cleaning and protecting composition to at least a portion of the hydrophilic overcoat; and drying the cleaning and protecting composition to provide a dried surface having a replenished hydrophilic surface. The writable and cleanable article includes: a base member having a front surface; a facing layer comprising a cured polymeric matrix and a plurality of inorganic nanoparticles dispersed in the polymeric matrix, wherein the facing layer is disposed on at least a portion of the base member front surface; an optional primer layer disposed on at least a portion of the facing layer; and a hydrophilic overcoat bonded to the facing layer and/or the optional primer layer through siloxane bonds, thereby providing a hydrophilic surface that is writable and cleanable. The cleaning and protecting composition includes: a hydrophilic silane; a surfactant; and water.
RESIN COMPOSITION FOR SEALANT, LAMINATE, PACKAGING MATERIAL, AND PACKAGE
A resin composition for a sealant has excellent heat-sealing strength with respect to a substrate, and a reduced elution amount thereof into normal heptane.
A resin composition for a sealant includes: a resin (A) which is an ethylene-(meth)acrylic acid ester copolymer in which a content of a (meth)acrylic acid ester unit is from 10% by mass to 25% by mass; and a tackifying resin (B), in which a content of the resin (A) is more than 45% by mass with respect to a total amount of resin components in the resin composition for a sealant, and a content of the tackifying resin (B) is from 0.1% by mass to 10% by mass with respect to the total amount of the resin components in the resin composition for a sealant.
Acoustic insulator
An acoustic insulator is provided. The acoustic insulator includes a corrugated layer and a facer layer. At least one of the corrugated layer or the facer layer is an acoustic paper having a basis weight of 32 g/m.sup.2 to 540 g/m.sup.2 and an airflow resistance of 500 mks rayls to 2,500 mks rayls. The acoustic insulator is effective for attenuating low frequency noise and exhibits excellent fire resistance.
Acoustic insulator
An acoustic insulator is provided. The acoustic insulator includes a corrugated layer and a facer layer. At least one of the corrugated layer or the facer layer is an acoustic paper having a basis weight of 32 g/m.sup.2 to 540 g/m.sup.2 and an airflow resistance of 500 mks rayls to 2,500 mks rayls. The acoustic insulator is effective for attenuating low frequency noise and exhibits excellent fire resistance.
STRUCTURAL INSULATED SHEATHING PANEL AND METHODS OF USE AND MANUFACTURE THEREOF
Structural insulated wall and roof sheathing systems for use in building construction designed to provide a structural building envelope that is moisture permeable but protects from bulk water, excess air, and thermal transfer.
Heat-seal lid with non-heat sealing layer and hydrophobic overcoat
A lidding film to use in food packaging, or the packaging of suitable non-food products, includes a substrate having an outer major surface on which is disposed at least a 5 heat-sealing layer (HS layer), a non-heat-sealing layer (NTIS layer), and a hydrophobic coating. On a side of the lidding film that corresponds to the outer major surface of the substrate is a peripheral region that encircles a central region. At least a first portion of the HS layer fills the peripheral region, and the NIS layer is absent as a cover on, or does not cover, the HIS layer in the peripheral region. At least a first portion of the NHS layer fills the 10 central region, and the HS layer is absent as a cover on, or does not cover, the NIS layer in the central region.
Heat-seal lid with non-heat sealing layer and hydrophobic overcoat
A lidding film to use in food packaging, or the packaging of suitable non-food products, includes a substrate having an outer major surface on which is disposed at least a 5 heat-sealing layer (HS layer), a non-heat-sealing layer (NTIS layer), and a hydrophobic coating. On a side of the lidding film that corresponds to the outer major surface of the substrate is a peripheral region that encircles a central region. At least a first portion of the HS layer fills the peripheral region, and the NIS layer is absent as a cover on, or does not cover, the HIS layer in the peripheral region. At least a first portion of the NHS layer fills the 10 central region, and the HS layer is absent as a cover on, or does not cover, the NIS layer in the central region.
Thermosetting resin composition for semiconductor package and prepreg using the same
A thermosetting resin composition having improved flowability and stiffness, and a prepreg using the same. Specifically, three kinds of fillers having different average particle diameters are combined with a binder resin system including an epoxy resin, a bismaleimide resin, a diaminodiphenylsulfone resin, and a benzoxazine resin.