The invention relates to an adhesive dual-component composition based on polyurethane, comprising an —NCO component and an —OH component such that: the —NCO component is a composition comprising A) at least one polyurethane prepolymer comprising at least two NCO terminal groups obtained by polyaddition reaction of at least one aliphatic polyisocyanate selected from aliphatic diisocyanate monomers and mixtures of at least one aliphatic diisocyanate monomer with at least one triisocyanate based on XDI, and at least one polyester diol, and B) at least one triisocyanate based on XDI; and the —OH component is a composition comprising at least one polyester polyol. The invention relates to a method for producing a multilayer structure implementing an adhesive composition according to the invention, as well as to the use of such a structure in the field of flexible packaging.

A resin composition is provided. The resin composition comprises: (A) a polyphenylene ether resin which has an unsaturated functional group; and (B) a first cross-linking agent represented by the following formula (I): ##STR00001##

Insulated paper products are disclosed. Methods of making and using insulated paper products are also disclosed.

A resin composition is provided. The resin composition comprises the following components: (A) a halogen-free epoxy resin; (B) a hardener; and (C) a phosphorus-containing phenolic resin of the following formula (I): ##STR00001##
wherein m, n, l, R.sub.1, and R.sub.2 are as defined in the specification.

A composite molded cargo body panel including a core, an interior skin secured to a first side of the core having a thickness, and exterior skin secured to a second side of the core, and a plurality of recesses. The plurality of recesses are dispersed along a first direction at intervals in the interior skin, with the core thickness at each of the plurality of recesses being reduced compared to a maximum core thickness, and each of the plurality of recesses defines a support surface. A pocket is formed in each of the plurality of recesses, with the core thickness at the pocket being less than the core thickness at each of the plurality of recesses. A plurality of logistics inserts are attached to the respective support surfaces of the plurality of recesses so that, at each of the plurality of recesses, the logistics insert extends across the pocket.

The invention relates to thermal management systems for devices that generate heat, including electronic devices such as portable electronics, for example, cell phones, electronic components, and/or battery systems. A multilayer phase change material composite structure may include multiple layers having different properties. For example, a PCM material composite layer may include a supporting structure having pores and a phase change material. Further, a layer of fire retardant material may be used in the multilayer phase change material. In some embodiments, additional layers such as coatings, thermal interface materials, and/or high thermal conductivity material may be present. A matrix formed from a porous supporting structure and a phase change material may be used to control and/or dissipate heat in a thermal management system. Support elements may provide stability. The thermal management system may mitigate conditions that could lead to a thermal runaway event and/or may influence conditions within the system during a potential thermal runaway event to reduce risk of fire. The thermal management system may include water, flame- and/or fire-retardant materials to control temperatures of an energy storage device and/or system. A housing may be used to surround a portion of a heat generating device such as an energy storage device or system, for example, an individual battery or a group of batteries, respectively. The housing or enclosure may include interior structures that surround and in some cases electrically isolate batteries from a thermal sink that includes a porous flame- and/or fire-retardant material having water in the pores.

The invention relates to a sheet-like composite including as layers of a layer sequence, in a direction from an external side of the sheet-like composite to an internal side of the sheet-like composite, a) a carrier layer, b) a barrier layer, and c) a polymeric internal layer, where a graph of a differential scanning calorimetry of the polymeric internal layer includes a peak A at a temperature T.sub.A and a peak B at a temperature T.sub.B, where the temperature T.sub.B is more than the temperature T.sub.A, where a width of the peak B is less by at least 3° C. than a width of the peak A. The invention further relates to a container precursor and to a closed container including the sheet-like composite, and also to a process by which the sheet-like composite is obtainable, and to a use of the sheet-like composite.

The invention relates to a sheet-like composite including as layers of a layer sequence, in a direction from an external side of the sheet-like composite to an internal side of the sheet-like composite, a) a carrier layer, b) a barrier layer, and c) a polymeric internal layer, where a graph of a differential scanning calorimetry of the polymeric internal layer includes a peak A at a temperature T.sub.A and a peak B at a temperature T.sub.B, where the temperature T.sub.B is more than the temperature T.sub.A, where a width of the peak B is less by at least 3° C. than a width of the peak A. The invention further relates to a container precursor and to a closed container including the sheet-like composite, and also to a process by which the sheet-like composite is obtainable, and to a use of the sheet-like composite.

A surface treated copper foil 1 includes a copper foil 2, and a first surface treatment layer 3 formed on one surface of the copper foil 2. The first surface treatment layer 3 of the surface treated copper foil 1 has L* of a CIE L*a*b* color space of 44.0 to 84.0. A copper clad laminate 10 includes the surface treated copper foil 1 and an insulating substrate 11 adhered to a surface of the surface treated copper foil 1 opposite to the first surface treatment layer 3.

The present invention aims to provide an adhesive composition which exhibits high adhesive property not only to the conventional polyimide and polyester film but also to a metal substrate, can achieve high solder heat resistance and exhibits excellent low-dielectric characteristics. According to the present invention, there is provided an adhesive composition containing an acid-modified polyolefin (a), an oligo-phenylene ether (b) having a number-average molecular weight of 3000 or less, and an epoxy resin (c), wherein the adhesive composition satisfies the following requirement(s) (A) and/or (B): (A) The adhesive composition contains more than 20 parts by mass and 60 parts by mass or less of the epoxy resin (c) to 100 parts by mass of the acid-modified polyolefin (a); (B) The adhesive composition further contains a polycarbodiimide (d).