A flexible display device includes: a display panel to generate an image; and a window member on the display panel, the window member including: a base film; and a polymer layer including a first part and a plurality of second parts having lower hardness than that of the first part.

A curable epoxy composition comprising a polyvalent epoxy compound (A) having a biphenyl structure and/or condensed polycyclic structure, a phosphorus-containing epoxy compound (B) having a structure shown by the following formula (1) or (2), and a triazine structure-containing phenol resin (C) and a film, laminated film, prepreg, laminate, cured article, and composite article obtained using the same are provided.

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Where, in the formula (1), each of R.sup.1 and R.sup.2 respectively independently represents a hydrocarbon group having 1 to 6 carbon atoms, the pluralities of R.sup.1 and R.sup.2 may be the same or different, and each of “m” and “n” respectively independently represents an integer of 0 to 4, and where, in the formula (2), each of R.sup.1 and R.sup.2 respectively independently represents a hydrocarbon group having 1 to 6 carbon atoms, the pluralities of R.sup.1 and R.sup.2 may be the same or different, and each of “m” and “n” respectively independently represents an integer of 0 to 5.

A hot melt adhesive film, and a preparation method, use, and an organosilicon polymer thereof are provided. The hot melt adhesive film includes: an inner layer, which is a polyolefin elastomer (POE); outer layers, which are an ethylene-vinyl acetate (EVA) copolymer on two surfaces of the inner layer; and intermediate layers, which are an organosilicon polymer between the inner layer and the outer layers. As intermediate layers, the organosilicon polymer plays the role of connection and transition, improves a bonding force between EVA and POE layers, and improves the stability of the hot melt adhesive film during long-term use. The hot melt adhesive film can be used as a packaging material for solar panels, touch screens, and the like.

The present invention provides a magnetic core having insulating properties, and a method for manufacturing the magnetic core. Provided is a magnetic core manufactured by compression molding and subsequent thermal curing of an iron-based soft magnetic powder having a resin coating formed on particle surfaces thereof. The iron-based soft magnetic powder is one in which the particle surfaces have been coated with an inorganic insulator; the resin coating is an uncured resin coating formed by dry blending the powder with a thermosetting resin at a temperature equal to or greater than the softening point of the thermosetting resin and lower than the thermal curing initiation temperature of the resin; the compression molding is carried out by using a mold to produce a compression molded body; and the thermal curing is carried out at a temperature equal to or greater than the thermal curing initiation temperature of the thermosetting resin.

The present invention provides a magnetic core having insulating properties, and a method for manufacturing the magnetic core. Provided is a magnetic core manufactured by compression molding and subsequent thermal curing of an iron-based soft magnetic powder having a resin coating formed on particle surfaces thereof. The iron-based soft magnetic powder is one in which the particle surfaces have been coated with an inorganic insulator; the resin coating is an uncured resin coating formed by dry blending the powder with a thermosetting resin at a temperature equal to or greater than the softening point of the thermosetting resin and lower than the thermal curing initiation temperature of the resin; the compression molding is carried out by using a mold to produce a compression molded body; and the thermal curing is carried out at a temperature equal to or greater than the thermal curing initiation temperature of the thermosetting resin.

The present invention relates to a halogen-free epoxy resin composition, a prepreg, a laminate and a printed circuit board containing the same. The halogen-free epoxy resin composition comprises an epoxy resin and a curing agent. Taking the total equivalent amount of the epoxy groups in the epoxy resin as 1, the active groups in the curing agent which react with the epoxy groups have an equivalent amount of 0.5-0.95. By controlling the equivalent ratio of the epoxy groups in the epoxy resin to the active groups in the curing agent to be 0.5-0.95, the present invention ensures the Df value stability of prepregs under different curing temperature conditions while maintaining a low dielectric constant and a low dielectric loss. The prepregs and laminates prepared from the resin composition have comprehensive performances, such as low dielectric constant, low dielectric loss, excellent flame retardancy, heat resistance, cohesiveness, low water absorption and moisture resistance, and are suitable for use in halogen-free multilayer circuit boards.

A metal-clad laminate includes an insulating layer including a cured product of a resin composition, and a metal foil disposed on a principal surface of the insulating layer. The resin composition includes a polyphenylene ether copolymer and a thermosetting curing agent, the polyphenylene ether copolymer having an intrinsic viscosity measured in methylene chloride at 25° C. of between 0.03 dl/g and 0.12 dl/g, inclusive. And the polyphenylene ether copolymer has, at a molecular terminal, a group represented by formula (1) or formula (2) at an average number of 1.5 to 3 per one molecule. Further, the metal foil has a first surface that is in contact with the insulating layer, the first surface having a 10-point average roughness (Rz) of 2.0 μm or less. And the metal foil includes a barrier layer disposed at a side of the first surface, the barrier layer containing cobalt. ##STR00001##

A metal-clad laminate includes an insulating layer including a cured product of a resin composition, and a metal foil disposed on a principal surface of the insulating layer. The resin composition includes a polyphenylene ether copolymer and a thermosetting curing agent, the polyphenylene ether copolymer having an intrinsic viscosity measured in methylene chloride at 25° C. of between 0.03 dl/g and 0.12 dl/g, inclusive. And the polyphenylene ether copolymer has, at a molecular terminal, a group represented by formula (1) or formula (2) at an average number of 1.5 to 3 per one molecule. Further, the metal foil has a first surface that is in contact with the insulating layer, the first surface having a 10-point average roughness (Rz) of 2.0 μm or less. And the metal foil includes a barrier layer disposed at a side of the first surface, the barrier layer containing cobalt. ##STR00001##

Aluminum alloy foil that, when used for battery packaging material, unlikely to develop pinholes or cracks even during molding of battery packaging material, and can exhibit excellent moldability. Aluminum alloy foil, which is for use in battery packaging material, wherein, with respect to cross section obtained by cutting aluminum alloy foil in vertical direction to rolling direction of aluminum alloy foil, which is a vertical direction to surface of aluminum alloy foil, proportion of total area of a {111} plane in total area of crystal planes of face-centered cubic structure, obtained by performing crystal analysis using EBSD method, is 10% or more; and with respect to cross section, a number average grain diameter R (rpm) of crystals in face-centered cubic structure, obtained by performing crystal analysis using EBSD method, satisfies following equation: number average grain diameter R≤0.056X+2.0, where X=thickness (rpm) of aluminum alloy foil.

A cellulose fiber-based substrate, at least one side of which is coated with an aqueous mixture composed of: a) at least one water-soluble polymer (WSP) containing hydroxyl groups, b) at least one lactone substituted with at least one linear or branched and/or cyclic C.sub.8-C.sub.30 hydrocarbon chain which may contain heteroatoms, c)at least one crosslinking agent. A method of production and use thereof.