The present disclosure relates to an adhesive film, and adhesive film includes: a photothermal conversion layer including a light absorbing agent and a pyrolytic resin; an adhesive base film layer disposed on the photothermal conversion layer; a buffer layer disposed on the adhesive base film layer; and an adhesive layer disposed on the buffer layer, and the buffer layer includes a polysiloxane resin, and the adhesive layer includes a silicon-based adhesive, and the silicon-based adhesive includes a silicon-based tackifier and a polysiloxane resin. The adhesive film according to the present disclosure can simplify a process of processing a substrate, and can prevent a damage of the substrate and a circuit or an element formed on the substrate.

An epoxy resin composition according to the present invention comprises an epoxy compound (A), a block copolymer (B) and a curing agent (C), wherein the block copolymer (B) is composed of a polymer block (a) comprising a (meth)acrylic polymer and a polymer block (b) comprising an acrylic polymer that is different from the polymer block (a), said epoxy resin composition having such a property that a cured resin product produced by curing the epoxy resin composition forms a microphase-separated structure. A cured product of the epoxy resin composition forms a highly ordered phase structure, and therefore has excellent toughness and stiffness.

A surface-treating agent for vulcanized rubber, comprising, based on 100 parts by weight, as solid matters, of isocyanate group-containing 1,2-polybutadiene, an organic solvent solution containing 10 to 160 parts by weight of fluororesin particles and 2.5 to 20 parts by weight of a perfluoroalkyl group-containing oligomer-based, fluorine-containing surfactant as a dispersant. The surface-treating agent for vulcanized rubber improves the solution stability of the organic solvent solution, improves the further hardness of the entire coating film formed from the surface-treating agent, abrasion resistance, and product torque evaluation, and is effectively used as, for example, a coating agent for seal lip parts of oil seals.

A surface-treating agent for vulcanized rubber, comprising, based on 100 parts by weight, as solid matters, of isocyanate group-containing 1,2-polybutadiene, an organic solvent solution containing 10 to 160 parts by weight of fluororesin particles and 2.5 to 20 parts by weight of a perfluoroalkyl group-containing oligomer-based, fluorine-containing surfactant as a dispersant. The surface-treating agent for vulcanized rubber improves the solution stability of the organic solvent solution, improves the further hardness of the entire coating film formed from the surface-treating agent, abrasion resistance, and product torque evaluation, and is effectively used as, for example, a coating agent for seal lip parts of oil seals.

The present invention relates to a halogen-free epoxy resin composition, a prepreg and a laminate containing the same. The halogen-free epoxy resin composition comprises 60 parts by weight of epoxy resin, from 15 to 28 parts by weight of benzoxazine resin, and from 10 to 20 parts by weight of styrene-maleic anhydride. The present invention discloses using from 15 to 28 parts by weight of benzoxazine resin and from 10 to 20 parts by weight of styrene-maleic anhydride to cure 60 parts by weight of epoxy resin, to ensure the Df stability of prepregs at different curing temperature conditions while maintaining low dielectric constant and low dielectric loss. The prepregs and laminates prepared from the resin composition have comprehensive performances, such as low dielectric constant, low dielectric loss, excellent flame retardancy, heat resistance, cohesiveness, low water absorption and moisture resistance, and are suitable for use in halogen-free multilayer circuit boards.

The present disclosure relates to composite materials comprising a resin and at least one sheet that comprise optionally cellulose filaments (CF), fillers and optionally reinforcing fibers as well as methods for the preparation thereof. The methods comprise impregnating the sheets comprising the cellulose filaments, fillers and optionally the reinforcing fibers or a stack thereof with resin. The composite materials can optionally comprise at least one other sheet, the at least one other sheet being different from the at least one sheet and comprising fibers chosen from wood pulp, fiberglass, natural fibers and mixtures thereof. The sheet can also be in the form of a panel of a preform.

Resin sheets which includes a support and a resin composition layer in contact on the support, and which are characterized in that an extracted water conductivity A of a cured product of the resin composition layer when extracted at 120° C. for 20 hours is 50 μS/cm or less and an extracted water conductivity B of the cured product of the resin composition layer when extracted at 160° C. for 20 hours is 200 μS/cm or less, can provide a thin insulating layer having excellent insulating properties.

In an artificial defect material 10 of an FRP structure, a heat-resistant high-linear-expansion material 20 arranged between the layers thermally expands in case of high-temperature shaping of the FRP structure, so that a predetermined shape is shaped between a plurality of layers of the fiber reinforcing base material 14 and the material 20 thermally shrinks at the room temperature after the shaping, so that a space is formed due to the shrinkage difference from the fiber reinforcing base materials 14. The material 20 has a linear expansion coefficient larger than that of the FRP structure by a predetermined value or more, and has the shape keeping property and the heat resistance to endure the shaping temperature.

An inorganic filler-containing epoxy resin cured product contains a magnesium oxide powder and has a maximum thermogravimetric mass loss rate ΔR.sub.max of −0.20 mass percent/° C. or more within a temperature range of 300° C. to 500° C. The filling factor of the magnesium oxide powder in the inorganic filler-containing epoxy resin cured product is 45% to 63% by volume.

The object is to provide a resin composition for a printed circuit board capable of realizing a printed circuit board that not only has heat resistance and flame retardancy but also is excellent in heat resistance after moisture absorption. The resin composition is a resin composition for a printed circuit board containing a cyanate ester compound (A) obtained by cyanation of a naphthol-dihydroxynaphthalene aralkyl resin or a dihydroxynaphthalene aralkyl resin, and an epoxy resin (B).