A substrate de-bowing mechanism, system and method are described. The mechanism can include a substrate support, one or more stationary contact members, and one or more dynamic or movable contact members that are adapted to contact the substrate and bend the substrate in a desired direction to reduce or eliminate bowing of the substrate. The mechanism is controlled by a CPU or other controller that can adjust the de-bow parameters of the de-bowing mechanism based on input settings that can be dynamic and/or static settings. The mechanism can be used to de-bow a variety of substrates including plastic cards, passports, and passport pages.

A glass and polymer film assembly including a glass film and a polymer film bonded to a surface of the glass film. The polymer film is directly bonded to the glass film by applying the polymer to the glass film when the glass film is above a bonding temperature of the polymer film. The glass film may have a thickness less than about 1 mm and the polymer film may be an oriented semicrystalline homopolymer which is permanently bonded to a major surface of the glass film.

Provided is a method for producing a micro flow channel chip that is used for a treatment or analysis of a liquid sample, the method being capable of producing a micro flow channel chip with high shape accuracy and high efficiency. The method includes a step of forming a groove on one surface of a base material; a lamination step of forming an adhesive resin layer on at least one surface of a resin film, and thereby obtaining a first laminate; and an adhesion step of arranging the surface of the base material where a groove has been formed and the adhesive resin layer of the first laminate to face each other, and bonding the base material and the first laminate such that the adhesive resin layer covers the groove, in which the glass transition temperature of the adhesive resin layer is 25 C. or lower.

Disclosed herein are methods for making asymmetric laminate structures and methods for reducing bow in asymmetric laminate structures, the methods comprising differentially heating the laminate structures during lamination or differentially cooling the laminate structures after lamination. Also disclosed herein are methods for reducing bow in asymmetric laminate structures, the methods comprising subjecting at least one substrate in the laminate structure to asymmetric tempering or annealing prior to lamination. Further disclosed herein are laminate structures made according to such methods.

Metal plates are placed on opposed surfaces of two heating plates, the metal plates are heated. Then, a hollow plate is placed between the two heating plates, and the two heating plates are moved toward each other. The metal plates, which are heated to a high temperature, are bonded to the outer surfaces of the hollow plate by thermal fusion caused by the heat of the metal plates. After the metal plates are brought into planar contact with the hollow plate, the heating plates are moved away from each other. The heating plates sandwich the hollow plate only for a very short time. Thus, the heat of the heating plates is not transferred excessively to the hollow plate.

A bonding method which includes a pressing step of bonding a substrate and a support plate for supporting the substrate to each other through an adhesive layer and pressing the bonded substrate and support plate using a plate member; and, after the pressing step, a pressure adjusting step of placing the substrate and the support plate bonded to each other through the adhesive layer in an environment having higher pressure than pressure of an environment in which the pressing step is performed.

Embodiments of the invention are directed to a transfer lamination process and apparatus that reduces substrate warpage. In some embodiments, the transfer lamination process is performed using a transfer lamination device, which includes a transfer unit, a substrate rotator, and a transfer ribbon having a carrier layer and a transfer layer attached to the carrier layer. In some embodiments of the transfer lamination process, a transfer section of the transfer layer is transferred from the carrier layer to a first surface of a substrate using the transfer unit. In some embodiments of this transferring step, the transfer section is heated and pressed against the first surface of the substrate using the transfer unit, and the carrier layer is detached from the transfer section. The substrate is then inverted using the substrate rotator. At least a portion of a second surface of the substrate that is opposite the first surface is then heated using the transfer unit without transferring the transfer layer to the portion of the second surface.

Panel for forming a floor covering, wherein this panel comprises at least two layers of thermoplastic material, wherein said two layers substantially consist of a strewn and pressed granulate, wherein the respective layers enclose a glass fiber layer.

Panel for forming a floor covering, where this panel has at least two layers of thermoplastic material, where the two layers substantially have a strewn and pressed granulate, where the respective layers enclose a glass fiber layer.

A carpet backing system for applying a coating to a roll of carpet includes elongated upper deck having a first end and a second end. An elongated lower deck is situated below and aligned with the upper deck. The upper deck includes a staging and unrolling station at a first end thereof, a pre-coat applicator for applying a pre-coat to the carpet, and an oven station to cure the pre-coat and allow the carpet to exit a second end of the upper deck. The lower deck includes a polymer applicator at a first end thereof for receiving the carpet and the pre-coat from the second end of the upper deck. The polymer applicator is adapted to apply the coating to the carpet. The lower deck further includes a heating platen conveyor, a plurality of cooling rolls, and optionally a carpet rolling station at a second end of the lower deck.