B32B37/0015

METHOD OF LAMINATING MULTI LAYER STRUCTURE TOGETHER IN A ROLL-TO-ROLL PROCESS TO MAKE A PRE-LAMINATION THAT MAY BE USED IN THE MAKING OF CREDIT AND GIFT CARDS AND MIRROR IMAGE VARIATIONS THEREOF
20190232712 · 2019-08-01 ·

The invention provides a free flowing copolymer between disparate plastic layers to thermally balance between the two differently expanding/contracting materials. The primer layer or thermal balance layer fully encapsulates the PET layer and can absorb the difference between the internal PET layer with any layer bonded to the encapsulated PET without cracking, bending or pitting and can reset into position when the heating/cooling has ended to make planar plastic core sheets for products such as credit cards, gift cards and the like.

Card substrate warpage reduction
10363725 · 2019-07-30 · ·

Embodiments of the invention are directed to a transfer lamination process and apparatus that reduces substrate warpage. In some embodiments, the transfer lamination process is performed using a transfer lamination device, which includes a transfer unit, a substrate rotator, and a transfer ribbon having a carrier layer and a transfer layer attached to the carrier layer. In some embodiments of the transfer lamination process, a transfer section of the transfer layer is transferred from the carrier layer to a first surface of a substrate using the transfer unit. In some embodiments of this transferring step, the transfer section is heated and pressed against the first surface of the substrate using the transfer unit, and the carrier layer is detached from the transfer section. The substrate is then inverted using the substrate rotator. At least a portion of a second surface of the substrate that is opposite the first surface is then heated using the transfer unit without transferring the transfer layer to the portion of the second surface.

PANEL FOR FORMING A FLOOR COVERING AND METHOD FOR MANUFACTURING SUCH PANELS
20190218794 · 2019-07-18 · ·

A panel including at least a substrate of thermoplastic material and a top layer with a printed decor and a translucent or transparent wear layer. The substrate includes three layers, including a lowermost layer, a central layer and an uppermost layer, all made from thermoplastic material, where the thermoplastic material of the central layer is more rigid than the thermoplastic material of the lower most layer and the uppermost layer.

GLASS LAMINATES WITH IMPROVED FLATNESS AND METHODS FOR FORMING THE SAME
20190184683 · 2019-06-20 ·

A glass laminate includes a non-glass substrate with a first surface and a second surface opposite the first surface. A glass sheet is laminated to the first surface of the non-glass substrate. A barrier film is laminated to the second surface of the non-glass substrate and includes a first surface adjacent to the non-glass substrate, a second surface opposite the first surface. A thickness of the barrier film can be at most about 0.5 mm. The second surface of the barrier film can define an outer surface of the glass laminate. The barrier film can be a multi-layer barrier film with a metal layer and a polymer layer. An absolute value of a flatness of the glass laminate determined according to European Standard EN 438 after exposure to 23 C. and 90% relative humidity for 7 days can be at most about 3 mm/m.

METHOD FOR FABRICATING FLEXIBLE ELECTRONIC DEVICE AND SUBSTRATE FOR FABRICATING THE SAME
20190191567 · 2019-06-20 ·

A method for fabricating a flexible electronic device, including the steps of: providing channels on a rigid substrate; adhering a flexible substrate to the rigid substrate with an adhesive; fabricating an electronic device on the flexible substrate; injecting a chemical substance into the channels; and reacting the chemical substance with the adhesive and peeling the flexible substrate from the rigid substrate. The rigid substrate comprises a first surface, a second surface opposite the first surface, and a side wall extending between the first surface and the second surface. The channels are provided on the first surface of the rigid substrate. The channels are in communication with an injection port, the injection port is located on the side wall of the rigid substrate, and a portion of the side wall is located between the injection port and the first surface.

Micro flow channel chip and method for producing flow channel chip

Provided is a method for producing a micro flow channel chip that is used for a treatment or analysis of a liquid sample, the method being capable of producing a micro flow channel chip with high shape accuracy and high efficiency. The method includes a step of forming a groove on one surface of a base material; a lamination step of forming an adhesive resin layer on at least one surface of a resin film, and thereby obtaining a first laminate; and an adhesion step of arranging the surface of the base material where a groove has been formed and the adhesive resin layer of the first laminate to face each other, and bonding the base material and the first laminate such that the adhesive resin layer covers the groove, in which the glass transition temperature of the adhesive resin layer is 25 C. or lower.

CARRIER RELEASE
20190148417 · 2019-05-16 · ·

A technique comprising: providing an assembly temporarily adhered on opposite sides to respective carriers by respective adhesive elements, the assembly including at least one plastic support sheet; heating the assembly while mechanically compressing the assembly between the carriers, wherein the strength of adhesion of one of said adhesive elements to the respective carrier and/or to the assembly is partially reduced during said heating of the assembly under mechanical compression; and wherein the strength of adhesion of the said adhesive element to the carrier and/or to the assembly is further reducible by further heating the said adhesive element after partially or completely relaxing the pressure at which the assembly is mechanically compressed between the two carriers.

COOLING DEVICE OF PHOTOVOLTAIC ASSEMBLY

Disclosed is a photovoltaic assembly, including a cooling platform for supporting the photovoltaic assembly to be cooled; a first high-temperature cloth unit provided on the cooling platform; a vacuum cover for forming a vacuum chamber together with the cooling platform, the vacuum chamber accommodating the photovoltaic assembly to be cooled; a second high-temperature cloth unit provided at a side of the vacuum cover facing the cooling platform; and a lifting bracket for driving the vacuum cover lift or fall. In the above-mentioned photovoltaic assembly, the vacuum cover is driven and lifted by the lifting bracket, and forms a vacuum chamber together with the cooling platform. The vacuum chamber creates a pressure cooling effect for the photovoltaic assembly to be cooled. In turn, the appearance defects may be reduced when the photovoltaic assembly is cooled to the normal temperature.

Glue-free antislip plastic floorboard and manufacturing method thereof
10214919 · 2019-02-26 · ·

A glue-free antislip plastic floorboard and a manufacturing method thereof, comprising from a top to a bottom a wear-resistance layer, a printing layer, a polyvinyl chloride (PVC) medium material layer, a glass fiber, a PVC medium material layer, a PVC bottom layer and a PVC antislip layer. Component composition of PVC medium material: a weight percentage of PVC resin is 13-15.42%, a weight percentage of calcium carbonate is 74-75.55%, a weight percentage of a plasticizer is 10-11%, a weight percentage of a stabilizer is 0.25-0.28%, and a weight percentage of carbon black is 0.2-0.3%. Component composition of PVC bottom material: a weight percentage of the PVC resin is 34.7-40%, a weight percentage of the calcium carbonate is 34-40%, a weight percentage of the plasticizer is 24-24.9%, a weight percentage of the stabilizer is 0.7-0.8%, and a weight percentage of the black carbon is 0.4-0.5%.

Asymmetric processing method for reducing bow in laminate structures

Disclosed herein are methods for making asymmetric laminate structures and methods for reducing bow in asymmetric laminate structures, the methods comprising differentially heating the laminate structures during lamination or differentially cooling the laminate structures after lamination. Also disclosed herein are methods for reducing bow in asymmetric laminate structures, the methods comprising subjecting at least one substrate in the laminate structure to asymmetric tempering or annealing prior to lamination. Further disclosed herein are laminate structures made according to such methods.