The method for producing a microcircuit card including a film having a very low level of shrinkage between two overlay layers, carrying at least one electronic component and an assembly of layers in which a cavity is formed containing the film and the electronic component, involves: forming the assembly to include a central layer 16 made from a material having a very low level of shrinkage between two layers of a plastic material having a substantially higher level of shrinkage, for example PVC, forming, through the assembly, a cavity of which the surface area advantageously equals between 30% and 90% of the surface area of the outer faces of the microcircuit card that is to be produced, embedding the film and the electronic component in a resin so as to occupy the space in the cavity and laminating the two overlay layers.

Metal plates are placed on opposed surfaces of two heating plates, the metal plates are heated. Then, a hollow plate is placed between the two heating plates, and the two heating plates are moved toward each other. The metal plates, which are heated to a high temperature, are bonded to the outer surfaces of the hollow plate by thermal fusion caused by the heat of the metal plates. After the metal plates are brought into planar contact with the hollow plate, the heating plates are moved away from each other. The heating plates sandwich the hollow plate only for a very short time. Thus, the heat of the heating plates is not transferred excessively to the hollow plate.

Metal plates are placed on opposed surfaces of two heating plates, the metal plates are heated. Then, a hollow plate is placed between the two heating plates, and the two heating plates are moved toward each other. The metal plates, which are heated to a high temperature, are bonded to the outer surfaces of the hollow plate by thermal fusion caused by the heat of the metal plates. After the metal plates are brought into planar contact with the hollow plate, the heating plates are moved away from each other. The heating plates sandwich the hollow plate only for a very short time. Thus, the heat of the heating plates is not transferred excessively to the hollow plate.

Embodiments of the present disclosure relate generally to methods of forming a laminate structure. In one or more embodiments, the method includes situating an interlayer between a glass substrate and a non-glass substrate having a softening point to form an assembled stack, heating the assembled stack to a temperature in a range of greater than the T.sub.g of the interlayer to less than the softening point of the non-glass substrate and applying a force to at least one of the laminate glass surface and the laminate non-glass surface to bond that counter-balances thermal stress and polymer cure forces during bonding and prevents warpage, distortion and breakage of the laminate. In some embodiments, the interlayer has a coefficient of thermal expansion (CTE) at least 10 times greater than the CTE of the glass substrate.

Provided is a flooring tile manufacturing apparatus includes: a lower sheet supply unit configured to form and supply a lower sheet; a middle sheet supply unit configured to supply a middle sheet joined to an upper side of the lower sheet; a raw material supply unit configured to supply materials having different contents of a filler to the lower sheet supply unit and the middle sheet supply unit; a main roller configured to join the lower sheet and the middle sheet that have been received; a first sheet supply unit configured to supply a print sheet having a color or a pattern to the main roller; a second sheet supply unit configured to supply a transparent sheet to the main roller; and an ultraviolet (UV) coating unit configured to form a UV coating layer on a surface of the transparent sheet.

The present invention is directed to a floor panel that is processed on roll equipment, whereby a decorative design consisting of elongated striations is printed with the elongated striations oriented in an across-machine direction. The decorative design is printed on a print layer and is subsequently laminated to a substrate layer. The laminated flooring material is then cut such that the elongate sides of the panels are cut in the across machine direction. This results in a floor panel with greater dimensional stability on the elongate side.

A method for producing electronic devices or components therefor comprising providing first and second components for laminating together the first and second components to define active areas. Then, applying adhesive to the first and/or second components, and successively laminating increasingly distal portions of said second component to the first component in a lamination direction. At least a part of the adhesive applied to the first and/or second components in an area downstream of active areas in the lamination direction defines an array of pairs of line sections of adhesive, each pair of line sections converging to a respective meeting point in a direction opposite to said lamination direction. The array of pairs of line sections extends continuously across substantially the whole lateral width of said one or more active areas, without any spaces or lateral line sections between each pair of lines sections in the array.

A method for forming of a building panel with a surface including a thermosetting resin such that tension created during curing of the surface is reduced or eliminated. Method for producing a panel with a wood based core and a surface layer including a thermosetting resin wherein the method including: curing and connecting the surface layer to the core while applying heat and pressure in a first main pressing step, thus raising a temperature of the surface layer above an initial temperature; applying a bending force on the panel after the first main pressing step to bend the panel such that an uppermost surface of the panel is convex an a lowermost surface of the panel is concave while the panel is still above the initial temperature; and releasing the bending force such that the panel springs back to an essentially flat shape.

A lightweight multilayer substrate comprising a thermally compressed nonwoven core having a first surface and an opposed second surface, at least one top layer adhered to the first surface of the thermally compressed nonwoven core, and, optionally, at least one bottom layer adhered to the opposed second surface of the thermally compressed nonwoven core. The lightweight multilayer substrate has a specific modulus greater than 1200 (MPa/(g/cm3)) and a thermal expansion coefficient of less than 3?105 m/(m*? C.). The lightweight multilayer substrate is thermally balanced between 25? C. and 70? C.

A dry adhesive backed flooring for being installed in a flat orientation on a subfloor, the flooring including a sheet flooring material and a double-sided sheet adhesive married to the flooring material. The installed flooring is substantially free of bubbles and wrinkles and the flooring remains substantially flat as initially applied and does not significantly rise from the subfloor, bubble or otherwise detach from the subfloor under normal use conditions for the flooring.