An assembly for producing cabinet doors including a CNC machine provided with a porous worktable, means for positioning workpieces thereon, means for applying a vacuum to such porous worktable for adhering such workpieces thereto and means for machining such workpieces adhered to such worktable; and means for thermally deforming a thermally pliable foil to laminate such workpiece.

To provide a sealing material sheet for a solar-cell module that has high productivity, and can also suppress unevenness in thickness at the time of integration as a solar-cell module. There is provided a sealing material sheet 1 in which there are two inflection point temperatures that are temperatures only around which a change rate of the linear expansion coefficient locally increases, a first inflection point temperature at a low temperature side of two inflection point temperatures is within a range of 55° C. to 70° C., and a second inflection point at a high temperature side of the inflection point temperatures is within a range of 80° C. to 95° C.

A honeycomb structural body includes multiple cores, at least face sheet, and at least one reinforcement sheet. The multiple cores each have a honeycomb structure, and are bonded to each other with foamed adhesive in a direction in which the number of multiple pores formed by the honeycomb structure increases. The at least one face sheet is adhered to the multiple cores so as to cover the multiple pores. The reinforcement sheet is placed between the multiple cores and the at least one face sheet, at a position where the reinforcement sheet covers the foamed adhesive.

A device for stacking a plurality of partially connected labels into a plurality of partially connected pads of labels comprises a robot arm having at least one vacuum source configured to selectively supply a vacuum force. The device also includes a plate coupled to the robot arm and a flexible pad coupled to the plate and including a plurality of apertures configured to direct the majority of the vacuum force through the flexible pad to a surface of the plurality of partially connected labels.

A surface treatment method for a casing is disclosed, the casing being formed by the outer surface and four sidewalls of the casing. The surface treatment method includes a heat transferring film formed on the casing by a vacuum heat transfer process or a paint-drying process and a surface pattern layer formed on a portion of a surface of the heat transferring film opposite to the outer surface by a digital inkjet printer applying three different types of UV-curable ink.

A polymeric film is provided, the film comprising one or more land portions that are substantially coplanar in a base plane and a plurality of distended portions separated from one another by the one or more land portions. The distended portions bow distally outward from the base plane. The polymeric film further comprises a plurality of annular micro-protrusions extending outward from the distal film surface, each protrusion having an apex. A portion of the plurality of annular micro-protrusions extends from each of the one or more land portions of the polymeric film and from each of the distended portions of the polymeric film.

Described are methods of two-dimensionally and three-dimensionally forming an article of wear using vacuum forming in an automated process. In the two-dimensional method, the article of wear comprises a generally flat shape with three-dimensional features molded into the first material layer.

A method of making a lightweight thermal shield that includes obtaining a mold having a shaped support screen with a molding surface configured to allow the passage of air and moisture therethrough, and with the mold being adapted for drawing a vacuum from behind the support screen. The method also includes applying a wet insulation material onto the molding surface of the support screen and drawing a vacuum to withdraw moisture through the support screen and consolidate a layer of insulation material on top the molding surface. The method further includes removing the consolidated layer of insulation material from off the molding surface, installing the consolidated layer of insulation material into an outer shell layer, and drying the consolidated layer of insulation material within the outer shell layer to form a lightweight core insulation layer.

A method and apparatus for compacting composite stringers. In one illustrative embodiment, an apparatus comprises a compacting structure, a compactor vacuum system, and a carrier vacuum system. The compacting structure has a shape configured to contact layers of uncured composite material for a composite stringer. The compactor vacuum system is associated with the compacting structure. The compactor vacuum system is configured to cause the compacting structure to apply a pressure to the layers of uncured composite material when a compactor vacuum is applied to the compactor vacuum system. The carrier vacuum system is associated with the compacting structure. The carrier vacuum system is configured to hold the layers of uncured composite material against the compacting structure when a carrier vacuum is applied to the carrier vacuum system.

Manufacturing a semiconductor apparatus includes preparing a support-base attached encapsulant including a thermosetting resin layer stacked as an encapsulant on a support base, coating a semiconductor-device mounting surface of a substrate on which semiconductor devices are mounted, or a semiconductor-device forming surface of a wafer on which semiconductor devices are formed with the thermosetting resin layer of the support-base attached encapsulant, heating and curing the thermosetting resin layer to collectively encapsulate the semiconductor-device mounting surface of the substrate or the semiconductor-device forming surface of the wafer, and cutting the encapsulated substrate or wafer by dicing. Coating includes surrounding a side face of the support-base attached encapsulant by a frame mechanism, holding the substrate or the wafer with the substrate or the wafer facing and spaced apart from the thermosetting resin layer of the support-base attached encapsulant, and vacuum laminating the support-base attached encapsulant together with the substrate or the wafer.