A formaldehyde free adhesive composition and a plywood obtained by the adhesive composition is provided, and the plywood retains desired performances, such as water resistance and workability.

A process of manufacturing a waterproof enclosure and sealing the waterproof enclosure includes the steps of forming a rectangular waterproof upper member and a rectangular waterproof lower member; forming four rectangular adhesive members; securing the adhesive members to the lower member by pressing and heating; securing three edges of the upper member to the lower member by pressing and heating to form a partially open enclosure having an open edge; punching a plurality of positioning holes on a periphery of the partially open enclosure; placing an article in the partially open enclosure by inserting the article through the open edge of the partially open enclosure; sealing the open edge of the partially open enclosure by pressing and heating to form a sealed enclosure; and cutting the periphery having the positioning holes to finish a waterproof enclosure.

A concrete curing blanket includes an absorbent sheet having a wicking layer, super absorbent materials, and a tissue layer, which are laminated together to form the absorbent sheet. The absorbent sheet is sized for being spread over a curing concrete slab. A vapor barrier is bonded to the tissue layer of the absorbent sheet to inhibit evaporation from the concrete curing blanket, and includes a plurality of perforations.

A decorative article includes a base and a decorative portion. The base includes a grained surface formed in a grained manner. The decorative portion includes at least a protective layer, a metal layer, and an adhesive layer. The decorative portion is bonded to at least a part of the grained surface of the base by the adhesive layer.

The present invention provides a laminate obtained by arranging a composition to be in contact with a rubber, wherein the composition is prepared by blending a polythiol compound (A), an isocyanate group-containing compound (B) and a radical generator (C), and wherein the ratio of the total molar number of the isocyanate group contained in the isocyanate-containing compound (B) to the total molar number of the thiol group contained in the polythiol compound (A) (isocyanate group/thiol group) is from 0.2 to 0.78, and provides a method for producing the laminate. The present invention thus provides a laminate, in which the rubber layer is adhered using at least one of an adhesive or an adhesive sheet capable of strongly adhering a rubber member, especially a vulcanized rubber member, and provides a laminate adhering to a rubber article using at least one of a coating agent and a coating sheet.

A display device includes a transparent laminated body 6 formed of transparent substrates 1 that are arranged in layers; an image display body 2 that faces the transparent laminated body 6; and a resin layer 3 that is disposed between the transparent laminated body 6 and the image display body 2 and is made of a photo-curable resin. The transparent substrates 1 are bonded with a thermal adhesive film 5. The thermal adhesive film 5 has optical transmittance of 50% or more at wavelength of 395 nm and optical transmittance of 10% or less at wavelength of 365 nm.

A heat exchange device for heating liquid adhesive material to an application temperature suitable for an adhesive bonding application includes a body having an inlet configured to receive a flow of liquid adhesive material and an outlet configured to provide the liquid adhesive material to a dispensing device for the adhesive bonding application. A fluid passageway in the body connects the inlet and the outlet. The fluid passageway includes a thin slit section in the form of an elongated ring shape, having a length along a fluid flow direction between the inlet and the outlet, the thin slit section further having a first dimension and a second dimension transverse to the fluid flow direction. The first dimension and the length are substantially greater than the second dimension. The heat exchange device further includes a heating element for heating the liquid adhesive material flowing through the thin slit section.

A hot-melt adhesive composition is disclosed. The hot melt adhesive comprises a) 25 to 95 wt %, preferably 50 to 85 wt % of at least one polyolefin-based polymer; b) 1 to 75 wt %, preferably 1 to 40 wt % of at least one tackifying resin; c) 0 to 15 wt % of at least one plasticizer; and d) 0 to 30 wt % of at least one additive and/or adjuvant selected from among stabilizers, adhesion promoters, fillers or pigments, waxes, and/or other polymers or combinations thereof,
characterized in that the at least one polyolefin-based polymer is a mixture of: a1) at least one first polyolefin-based polymer with a molecular weight M.sub.n of <10,000 g/mol in a quantity of 20 to 80 wt % with respect to the total quantity of polyolefin-based polymer, and a2) at least one second polyolefin-based polymer with a molecular weight M.sub.n of >10,000 g/mol in a quantity of 20 to 80 wt % with respect to the total quantity of polyolefin-based polymer. The adhesive is particularly useful for gluing polyolefin films, woven fabrics, or nonwoven fabrics. Also, methods for manufacturing packaging and fabric with the hot-melt adhesive above are disclosed.

A method for attaching and detaching a substrate from a bonded stack is disclosed. A broadband light-absorbing material is combined with an adhesive material to form a broadband light-absorbing adhesive. A layer of the broadband light-absorbing adhesive is then applied on one side of a transparent carrier. A substrate is placed on the broadband light-absorbing adhesive and the transparent carrier to form a bonded stack. The substrate can be a wafer or a polymeric film. At this point, processing steps can be performed on the substrate. After the processing steps have been completed, a light pulse from a flashlamp is utilized to heat up the broadband light-absorbing adhesive in order to loosen the substrate from the bonded stack such that the substrate can be easily detached from the bonded stack.

The present document describes an apparatus for reducing fabric dimpling in electronic devices and associated methods. The apparatus is used during assembly to prevent fabric, which is stretched over a perforated part (e.g., speaker housing), from dimpling into the holes (e.g., perforations) of the perforated part. The apparatus includes protrusions (e.g., pins), which act as a negative of the holes in the perforated part, to support the fabric as it is stretched over the perforated part. In particular, the protrusions are inserted through the perforations via an interior surface of the perforated part such that the protrusions are “proud” (slightly projecting from a surface) with respect to an exterior surface of the perforated part. The proudness of the protrusions may vary based on a degree of curvature of the perforated part at a location corresponding to a respective protrusion.