An assembly for producing cabinet doors including a CNC machine provided with a porous worktable, means for positioning workpieces thereon, means for applying a vacuum to such porous worktable for adhering such workpieces thereto and means for machining such workpieces adhered to such worktable; and means for thermally deforming a thermally pliable foil to laminate such workpiece.

Provided is an absorbent article which includes a top sheet having extruded protrusions and a second sheet bonded to the top sheet and has adequate softness, satisfactory appearance, and yet prevents wrinkles in the top sheet along the MD. The problem is solved by a method of producing an absorbent article including forming the extruded protrusions through embossing of non-woven fabric to be a top sheet transferred by being drawn from downstream of a production line; and then bonding the non-woven fabric and a material of a second sheet in a bonding pattern formed by aligning the material of the second sheet 40 with the back face of the non-woven fabric having extruded protrusions, forming rows of plurality of top-second bonded portions at intervals in the CD in regions between the extruded protrusions adjacent each other in the MD so as to be provided across the center positions of the regions in the CD, and compressing the non-woven fabric in areas between the top-second bonded portions in the rows in the CD without welding of the non-woven fabric and the material of the second sheet.

A laminated surface covering including a facing material made of vinyl and a backing material comprising a rubber component. The rubber component comprising at least a matrix of bonded rubber granules. A bonding material disposed between the facing material and the backing material. The facing material configured to melt at a temperature between 165° F. and 248° F. infiltrating the backing material thereby essentially encasing the rubber granules of the matrix and providing fire retardation and smoke suppression qualities.

Hot melt adhesive composition comprising: —from 30% to 55% of a composition (A) consisting of 2 copolymers of propylene and ethylene (A1) and (A2), with Mw of less than 100,000 Da, wherein: —(A1) is an essentially amorphous copolymer, with a DSC melt enthalpy of 10 less than 30 J/g; —(A2) is a semicrystalline copolymer with a DSC melt enthalpy of more than 30 J/g; and —the ratio:weight of (A2)/weight of (A1) is from 0.2 to 1.5; —from 20% to 50% of a tackifying resin (B); and 1—from 2% to 25% of a plasticizer (C) consisting of a liquid polybutene oligomer. 2) Process of manufacturing an assembly product, preferably a disposable nonwoven absorbent article, implementing said hot melt adhesive composition.

In a method of laminating a transfer layer to a substrate, a transfer layer is provided on a carrier layer. Portions of the transfer layer are selectively removed from the carrier layer using an adhesive panel by heating portions of the adhesive panel corresponding to the portions of the transfer layer, and transferring the portions of the transfer layer from the carrier layer to the adhesive panel. A transfer section of the transfer layer is then transferred from the carrier layer to a surface of the substrate by fracturing the transfer layer along an edge of the transfer section.

The invention relates to a method for adhering two substrates, namely a first substrate A and a second substrate B, to each other using a latent-reactive adhesive film with at least one latent-reactive adhesive film layer which has a thermoplastic component with a melting temperature T(melt), where 35° C.≦T(melt)≦90° C., said thermoplastic component containing functional groups that can react to isocyanate, and an isocyanate-containing component that is dispersed into the thermoplastic component in a particulate form and is blocked, microencapsulated, or substantially deactivated in the region of the particle surface. The particles have a start temperature T(start) of 40° C.≦T(start)≦120° C., wherein T(start)≧T(melt). A surface of the first substrate A is brought into contact with a first surface of the latent-reactive adhesive film, and a surface of the second substrate B is brought into contact with the second surface of the latent-reactive adhesive film. The adhesion is caused by heating the latent-reactive adhesive film to a temperature which corresponds to or is higher than at least the start temperature T(start). The invention is characterized in that at least the surface of the first substrate A which is brought into contact with the latent-reactive adhesive film is treated with a primer before the first substrate A is brought into contact with the latent-reactive adhesive film, and/or at least the first surface of the latent-reactive adhesive film which is brought into contact with the first substrate A is treated with a primer before the first substrate A is brought into contact with the latent-reactive adhesive film.

A veneered element, including a substrate, a wood veneer layer having a first surface and a second surface, the first surface being opposite to the second surface, an adhesive layer adapted to adhere the first surface of the wood veneer layer to a surface of the substrate, wherein adhesive from the adhesive layer is present in a first portion of the wood veneer layer, extending from the first surface of the wood veneer layer into the wood veneer layer, and wherein the second surface of the wood veneer layer is substantially free from adhesive from the adhesive layer. Also, a method of producing such a veneered element).

Various embodiments concern a method of attaching a microactuator to a flexure, depositing a wet mass of structural adhesive on the flexure, mounting the microactuator on the wet mass of structural adhesive, partially curing the mass of structural adhesive through a first application of curing energy, and depositing a mass of conductive adhesive on the flexure. The mass of conductive adhesive is deposited in contact with the mass of structural adhesive. The state of partial curing of the structural adhesive prevents the conductive adhesive from wicking between the flexure and the underside of the microactuator and displacing the structural adhesive which may otherwise result in shorting to a stainless steel layer of the flexure. The method further comprises fully curing the mass of structural adhesive and the conductive adhesive through a second application of curing energy.

Provided is a method for favorable bonding between an adherend and an adhesive body, which is capable of suppressing an ink layer, which is formed by an ultraviolet-curable ink, from being smudged while increasing convenience of a bonding operation between the adherend and the adhesive body, and the like. The method for bonding a medium to a foil body includes an ink layer formation process of spotting an ultraviolet-curable ink, which is ejected from an inkjet head, to a medium and irradiating ultraviolet ray to the ultraviolet-curable ink to cure the same, thereby forming an ink layer; a lamination process of laminating the medium and a foil body with the ink layer being sandwiched therebetween; and a bonding process of heating the ink layer, enabling the ink layer to function as an adhesive, and bonding the medium to the foil body.

Printed wiring boards with reduced curing unevenness and the like may be produced by (A) preparing an adhesive sheet having a support and a resin composition layer provided on the support, (B) laminating the adhesive sheet on an internal layer substrate so that the resin composition layer is in contact with the internal layer substrate, and (C) thermally curing the adhesive sheet by heating from T1 (° C.) to T2 (° C.), to form an insulating layer, wherein the adhesive sheet is thermally cured so that a relation of Y>2700X is satisfied in which X is the sum of a difference between a maximum expansion rate of the support in the MD direction during heating from T1 (° C.) to T2 (° C.) and an expansion rate of the support at the end of heating and a difference between a maximum expansion rate of the support in the TD direction during heating from T1 (° C.) to T2 (° C.) and an expansion rate of the support at the end of heating and Y is the lowest melt viscosity of the resin composition layer at 120° C. or higher.