An electrical steel sheet adhesive coating composition according to an exemplary embodiment of the present invention includes, based on 100 wt % of the total solids: a resin at 20 to 40 wt % and having an average particle diameter of 10 to 300 nm; an inorganic nanoparticle at 10 to 35 wt % bonded with the resin; a metal phosphoric acid salt at 10 to 30 wt %; and phosphoric acid at 10 to 40 wt %. An electrical steel sheet product according to an exemplary embodiment of the present invention includes a plurality of electrical steel sheets; and an adhesive layer disposed between the plurality of electrical steel sheets, wherein the adhesive layer includes a metal of one or more kinds among Al, Mg, Ca, Co, Zn, Zr, and Fe at 0.5 to 30 wt %, N at 0.1 to 10 wt %, C at 0.1 to 5 wt %, P at 1 to 30 wt %, a metal of one or more kinds among Si and Ti at 10 to 30 wt %, and a balance of O.

Disclosed are an adhesive layer forming apparatus and a display device manufacturing system including the same. The adhesive layer forming apparatus includes a first support chuck configured to move a first panel along a panel movement path in a first direction, a second support chuck provided side by side with the first support chuck in a second direction orthogonal to the first direction and configured to move a second panel along a panel movement path, and a first gantry configured to move a first head, which faces the first support chuck and the second support chuck, in the second direction on the first support chuck and the second support chuck and forms an adhesive layer on any one of the first panel and the second panel by jetting.

An adhesive application device is provided for carrying out a method for producing a lamination stack for rotors and stators of electric motors or generators, wherein a light-activated adhesive is applied to one side of electric steel prior to punching out laminations or to at least one side of already punched-out laminations, wherein the adhesive is irradiated and activated with a light of required wavelength immediately before the adhesive exits from an application unit, and wherein laminations are then punched out from the electric steel and stacked or the already punched-out laminations are stacked to a lamination stack. The adhesive application device has at least one application unit with at least one valve for discharging an adhesive. At least one radiation source is arranged in a region of the valve and emits radiation and directs the radiation to the adhesive provided in the region of the at least one valve.

A method of manufacturing at least a part of a footwear in an automatic manufacturing line includes providing a footwear part in the form of a leather base layer, providing a footwear part in the form of a leather attachment layer, automatically stacking the leather base layer and the leather attachment layer against each other with an intermediate application of adhesive between them, automatically activating the adhesive, automatically forcing the leather base layer and the leather attachment layer against each other under a pressure with the adhesive between them, curing the adhesive and thereby bonding the leather base layer and the leather attachment layer to each other thereby providing at least a part of a footwear upper.

A temporary adhesive material for wafer processing temporarily bonds a support to a wafer having a circuit-forming front and back surface for processing, including a composite temporary adhesive material layer having at least a two-layer structure of first and second temporary adhesive layers, the first layer including a thermoplastic resin layer that is releasably adhered to the wafer's front surface; and the second layer including a photo-curing siloxane polymer layer laminated on the first layer. A wafer processing laminate, a temporary adhesive material for wafer processing, and a method for manufacturing a thin wafer using the same, which suppress wafer warpage at the time of heat-bonding, have excellent delaminatability and cleaning removability, allow layer formation with uniform film thickness on a heavily stepped substrate, are highly compatible with steps of forming TSV, etc., have excellent thermal process resistance, and are capable of increasing productivity of thin wafers.

A method of manufacturing a semiconductor device may include bonding a carrier substrate onto a device wafer using an adhesive member, wherein the adhesive member includes a base film, a device adhesive film disposed on a lower surface of the base film and contacting the device wafer, and a carrier adhesive film disposed on an upper surface of the base film and contacting the carrier substrate. The device adhesive film includes a gas blowing agent, and the carrier adhesive film may not include a gas blowing agent.

A flexible substrate and a manufacturing method thereof and a display device are provided. The flexible substrate has a bending region. The flexible substrate includes a base substrate, and a first organic layer and a second organic layer which are sequentially laminated on the base substrate, and a surface where the first organic layer contacts the second organic layer in the bending region includes a concave-convex structure.

The present invention is an assembly layer for a flexible device. The assembly layer is derived from precursors that include about 0 to about 50 wt % C.sub.1-C.sub.9 alkyl(meth)acrylate, about 40 to about 99 wt % C.sub.10-C.sub.24 (meth)acrylate, about 0 to about 30 wt % hydroxyl (meth)acrylate, about 0 to about 10 wt % of a non-hydroxy functional polar monomer, and about 0 to about 5 wt % crosslinker.

In an embodiment, an adhesive sheet has an expandable adhesive layer 2 on one side or both sides of a base 1, wherein the expandable adhesive layer 2 contains an epoxy resin including a polyfunctional epoxy resin, a phenol resin as a curing agent, an imidazole-based compound as a curing catalyst, and a temperature-sensitive foaming agent. The adhesive sheet has properties in good balance, such as fast curability, heat resistance, and adhesiveness, and also excellent properties such as thermal conductivity attributed to a good filling property.

Apparatus, compositions, and systems for ultraviolet (UV) heat-activated laminating adhesives applied via an inkjet printing process are disclosed. A system includes a first inkjet mechanism configured to deposit ink in a particular pattern onto a surface of a rigid medium. A second inkjet mechanism is configured to deposit a laminating adhesive onto the particular pattern printed on the surface of the rigid medium. A pair of stainless steel plates is configured to receive an overlay film layer and the laminating adhesive deposited onto the particular pattern printed on the surface of the rigid medium. The overlay film layer is positioned such that a surface of the overlay film layer faces the laminating adhesive. Pressure and heat are applied to the overlay film layer and the laminating adhesive to laminate the particular pattern printed on the surface of the rigid medium.