B32B37/26

LOCATOR FOR FILM STICKING ON INTELLIGENT AUTOMOBILE CENTRAL CONTROL COMPUTER SCREEN AND FILM STICKING METHOD THEREOF
20230059957 · 2023-02-23 ·

A locator for film sticking on an intelligent automobile central control computer screen and a film sticking method thereof are provided, and generally relate to the technical field of film sticking tools. The locator for film sticking on the intelligent automobile central control computer screen and the film sticking method thereof of the present disclosure comprises the film sticking mechanism, film component, and central control panel module of automobiles. The film sticking mechanism is comprised of a locator with no fewer than two L-shaped central control panel positioning stiffeners which are diagonally arranged on a side to clamp the central control panel. The protective film of the central control panel is limited by the setting of the film sticking mechanism, film component, and the cooperation of the locator with the protective positioning film, so that the protective film of the central control panel is kept in a flat state.

Diode devices based on superconductivity
11502237 · 2022-11-15 · ·

An electronic device (e.g., a diode) is provided that includes a substrate and a patterned layer of superconducting material disposed over the substrate. The patterned layer forms a first electrode, a second electrode, and a loop coupling the first electrode with the second electrode by a first channel and a second channel. The first channel and the second channel have different minimum widths. For a range of current magnitudes, when a magnetic field is applied to the patterned layer of superconducting material, the conductance from the first electrode to the second electrode is greater than the conductance from the second electrode to the first electrode.

Diode devices based on superconductivity
11502237 · 2022-11-15 · ·

An electronic device (e.g., a diode) is provided that includes a substrate and a patterned layer of superconducting material disposed over the substrate. The patterned layer forms a first electrode, a second electrode, and a loop coupling the first electrode with the second electrode by a first channel and a second channel. The first channel and the second channel have different minimum widths. For a range of current magnitudes, when a magnetic field is applied to the patterned layer of superconducting material, the conductance from the first electrode to the second electrode is greater than the conductance from the second electrode to the first electrode.

METHOD FOR THE FORMING AND FINISHING OF AN ACCESSORY CLADDING ELEMENT FOR USE IN ARCHITECTURE AND DESIGN

A method for making an accessory cladding element for use in architecture and design. The method provides preparing an elastically deformable support element, including a first outer surface, in particular a decorated surface, a second outer surface and a plurality of spacer elements placed between the two surfaces. An impermeable and removable layer is applied on the first outer surface to protect at least a part thereof. Then a fluid cement mixture is prepared and introduced into the support element to obtain a cement-based composite structure in a deformable state. The excess fluid cement mixture is removed from the support element. The cement-based composite structure in the deformable state is positioned in a forming device which gives it the desired shape. The composite structure is solidified and after the removable layer is removed.

METHOD FOR THE FORMING AND FINISHING OF AN ACCESSORY CLADDING ELEMENT FOR USE IN ARCHITECTURE AND DESIGN

A method for making an accessory cladding element for use in architecture and design. The method provides preparing an elastically deformable support element, including a first outer surface, in particular a decorated surface, a second outer surface and a plurality of spacer elements placed between the two surfaces. An impermeable and removable layer is applied on the first outer surface to protect at least a part thereof. Then a fluid cement mixture is prepared and introduced into the support element to obtain a cement-based composite structure in a deformable state. The excess fluid cement mixture is removed from the support element. The cement-based composite structure in the deformable state is positioned in a forming device which gives it the desired shape. The composite structure is solidified and after the removable layer is removed.

Substrate bonding method and laminated body production method

A substrate bonding method which enables forming a precision fine space using a method that is simpler and easier than conventional methods; and a laminated body production method that uses the substrate bonding method. This substrate bonding method includes disposing a first substrate on a photoresist pattern formed on a support film so as to bring the first substrate into contact with a surface of the photoresist pattern located on the side opposite to the support film, and pressure-bonding the support film, the photoresist pattern, and the first substrate; releasing the bonded support film after the pressure-bonding; and disposing a second substrate on the photoresist pattern so as to bring the second substrate into contact with the surface of the photoresist pattern located on the side opposite to the first substrate, and pressure-bonding the first substrate, the photoresist pattern, and the second substrate.

Substrate bonding method and laminated body production method

A substrate bonding method which enables forming a precision fine space using a method that is simpler and easier than conventional methods; and a laminated body production method that uses the substrate bonding method. This substrate bonding method includes disposing a first substrate on a photoresist pattern formed on a support film so as to bring the first substrate into contact with a surface of the photoresist pattern located on the side opposite to the support film, and pressure-bonding the support film, the photoresist pattern, and the first substrate; releasing the bonded support film after the pressure-bonding; and disposing a second substrate on the photoresist pattern so as to bring the second substrate into contact with the surface of the photoresist pattern located on the side opposite to the first substrate, and pressure-bonding the first substrate, the photoresist pattern, and the second substrate.

Polarizing plate-carrier film laminate, method for producing same, method for producing polarizing plate using same, and polarizing plate

A polarizing plate-carrier film laminate and a polarizing plate are provided. A method to manufacture the polarizing plate-carrier film laminate and a method to manufacture a polarizing plate using the polarizing plate-carrier film laminate are also provided. The polarizing plate-carrier film laminate includes a polarizer, a bonding agent layer and a protective film sequentially on a first surface of the polarizer and a protective layer and a carrier film sequentially on a second surface of the polarizer.

Transferring nanofiber forests between substrates
11613468 · 2023-03-28 · ·

Techniques are described for transferring nanofiber forests using transfer films that either lack a conventional adhesive at the substrate-nanofiber forest interface or that include a diffusion barrier that prevents diffusion of adhesive molecules (or other polymer molecules mobile at ambient temperatures) into the nanofiber forest. These techniques can be applied to single layer nanofiber forests or stacks of multiple nanofiber forest. By selecting the bond strength between the nanofiber forest and the transfer films, the nanofibers can be aligned in a common direction that includes, but is not limited to, perpendicular to a substrate or transfer film.

METHODS OF MAKING PRINTED STRUCTURES

An example of a method of making a printed structure comprises providing a destination substrate, contact pads disposed on the destination substrate, and a layer of adhesive disposed on the destination substrate. A stamp with a component adhered to the stamp is provided. The component comprises a stamp side in contact with the stamp and a post side opposite the stamp side, a circuit, and connection posts extending from the post side. Each of the connection posts is electrically connected to the circuit. The component is pressed into contact with the adhesive layer to adhere the component to the destination substrate and to form a printed structure having a volume defined between the component and the destination substrate. The stamp is removed and the printed structure is processed to fill or reduce the volume.