A process for making a card includes the steps of forming a core layer having a first surface and a second surface, disposing an uncured decorative ceramic layer of ceramic particles disposed in a resin binder over the first surface of the core layer, such as by spray coating, and curing the uncured decorative ceramic layer to form a cured decorative ceramic layer. Card products of the process may have a core layer of metal, ceramic, or a combination thereof that form a bulk of the card.

Cards made in accordance with the invention include a specially treated thin decorative layer attached to a thick core layer of metal or ceramic material, where the thin decorative layer is designed to provide selected color(s) and/or selected texture(s) to a surface of the metal cards. Decorative layers for use in practicing the invention include: (a) an anodized metal layer; or (b) a layer of material derived from plant or animal matter (e.g., wood, leather); or (c) an assortment of aggregate binder material (e.g., cement, mortar, epoxies) mixed with laser reactive materials (e.g., finely divided carbon); or (d) a ceramic layer; and (e) a layer of crystal fabric material. The cards may be dual interface smart cards which can be read in a contactless manner and/or via contacts.

Disclosed herein is a wafer laminate suitable for production of thin wafers and a method for producing the wafer laminate. The wafer laminate can be formed easily by bonding between the support and the wafer and it can be easily separated from each other. It promotes the productivity of thin wafers. The wafer laminate includes a support, an adhesive layer formed on the support, and a wafer which is laminated on the adhesive layer in such a way that that surface of the wafer which has the circuit surface faces toward the adhesive layer, wherein the adhesive layer is a cured product of an adhesive composition composed of resin A and resin B, the resin A having the light blocking effect and the resin B having the siloxane skeleton.

Methods and systems are provided for fabricating a composite structure. In one example, the composite structure may include a honeycomb core sandwiched between face sheets. An edge of the honeycomb core may be abraded and a top face sheet may be perforated. As such, a likelihood of delamination of the composite structure during a curing step may be reduced.

A planarized core material manufacturing method includes: a core material forming step of forming a core material having a first surface and a second surface opposed to the first surface by impregnating glass cloth with a synthetic resin, and drying the glass cloth; and a core material planarizing step of planarizing the first surface or the second surface of the core material by grinding processing or polishing processing. Preferably, a plurality of pieces of the glass cloth are laminated in the core material.

Among other things a method including releasing a discrete component from an interim handle and depositing a discrete component on a handle substrate, attaching the handle substrate to the discrete component, and removing the handle substrate from the discrete component.

The laminate comprises a porcelain sheet with a thickness of two to three millimetres, adhered to a base or support sheet made of MDF or particleboard or high density foam or polyethylene or polypropylene or ABS or foamed PVC or methacrylate or a metal sheet of aluminium or steel, using as the adhesion means a two-component polyurethane or a PUR adhesive, producing a laminate that encompasses the advantages of the nature of the two materials, the porcelain and the base, as well as saving material, and being lighter, having higher thermal and acoustic insulation levels, improved resistance to bending loads and allowing to add additional layers, such as a metal sheet of thickness from 0.1 to 1 mm in order to obtain a greater flatness, or a combination with rubber or elastomer layers to improve the acoustic insulation level.

A waveguide includes an input area, a multi-layered substrate, and an output area. The multi-layered substrate includes a plurality of layers of at least a substrate and at least one partially reflective layers. The input area in-couples light in a first band into the waveguide. The one or more partially reflective layers are partially reflective to light in the first band. Each of the one or more partially reflective layers are located between respective layers of the plurality of layers of the substrate. The output area out-couples light from the waveguide. The pupil replication density of the out-coupled light is based in part on a number of the one or more partially reflective layers and respective locations of the one or more partially reflective layers in the waveguide.

Among other things a method including releasing a discrete component from an interim handle and depositing a discrete component on a handle substrate, attaching the handle substrate to the discrete component, and removing the handle substrate from the discrete component.

A method is shown for installing a heat tube on a section of pre-insulated piping. A metal carrier pipe is covered with a first layer of foam insulation. Next, a routing device is used to cut a longitudinal slot along the length of the pipe so that the pipe exterior surface is exposed from the insulation. A heat tube is then installed within the longitudinal slot, whereby the heat tube contacts the exterior surface of the metal carrier pipe. A second layer of foam insulation is then sprayed onto the exterior of the metal carrier pipe, covering the previously formed longitudinal slot and installed heat tube. A polyolefin coating is then applied over the insulation to form a protective outer jacket for the insulated pipe.