A method for producing a plastic composite panel which is provided as a layer structure. The method includes providing a film layer structure comprising an adhesive layer which is arranged between two transparent plastic films. The film layer structure is pre-molded to assume an approximately final shape and is arranged in a molding tool so that a first main surface of the film layer structure is towards the molding surface of the molding tool and so that a cavity is formed between the second main surface of the film layer structure and a surface of the molding tool. The film layer structure is then back-molded in a thermal molding method step while introducing a thermoplastic material into the cavity to provide the layer structure. A pre-molding and back-molding step, a rigidification of the thermoplastic layer, and a demolding of the layer structure is further performed.

The plurality of pieces of low density cellular material, such as foam plastics, form a core panel having opposite side surfaces and with adjacent pieces having opposing edge surfaces extending between the side surfaces. Sheets of flexible material, such as veils or mats or scrim, are adhesively attached to the side surfaces, and portions of one sheet extend between the opposing adjacent edge surfaces for limiting flexing of the panel. The pieces may be tapered, and portions of the one sheet may project between the edge surfaces either partially or fully to form double wall webs. The webs may have flanges adhesively attached to the other sheet on the opposite side. One sheet may also be stretchable in areas not adhesively attached to the pieces to provide for curving the panel from a planar position maintained by the sheet on the opposite side.

A method for producing a Fiber Metal Laminate component of an airplane, using a manipulator system with an end effector and a control, wherein at least one metal layer and at least one unhardened fiber layer are being stacked onto each other in a mould in a stacking sequence, wherein each stacking cycle comprises picking up a metal layer or a fiber layer from a supply stack according to the stacking sequence, transporting the layer to the mould, placement of the layer at a deposition surface in the mould and depositing the so placed layer onto the deposition surface. After being picked up from the supply stack and before being deposited onto the deposition surface the layer to be stacked can be deformed by the end effector as to adapt the form of the layer to the form of the deposition surface.

A method for bonding a first wafer onto a second wafer by molecular adhesion where the wafers have an initial radial misalignment between them. The method includes bringing the two wafers into contact so as to initiate the propagation of a bonding wave between the two wafers while a predefined bonding curvature is imposed on at least one of the two wafers during the contacting step as a function of the initial radial misalignment.

Vacuum lamination methods for forming conformally coated articles having a preformed lamination layer conformally coated to or on an object such as an LED array are provided. These vacuum lamination methods utilize a single heating step to heat a middle portion of the preformed lamination layer to a flowable condition prior to the preformed lamination layer being conformally coated over the article, such as the array of light emitting diodes disposed on an inner portion of a first side of a submount wafer.

A manufacturing apparatus of a display device includes a first jig configured to hold a first member; a second jig located under the first jig and coupled to or separated from the first jig such that the first member is locatable between the first jig and the second jig; fixing parts located at both ends of the second jig and configured to hold a second member between the first member and the second jig, the second jig including a pad; and a stage located under the pad and provided with a groove formed therethrough and having an area smaller than an area of the pad when viewed in a plan view, wherein one portion of the pad, which faces the stage, is configured to be within the groove.

A bonding device for attaching a curved cover plate with an irregular shape to a flexible screen includes: a first attaching half having a first abutting wall, a second half, and a driving component. The first abutting wall includes a first curved wall and a first flat wall. The first curved wall matches with an inner surface of the arc hook area, and the first flat wall is smoothly connected to the first curved wall. The second attaching half has a second abutting wall. The second abutting wall includes a second curved wall and a second flat wall. The second curved wall matches with an inner surface of the arc hook area. The second flat wall is smoothly connected to the second curved wall. The driving component drives the first attaching half and the second attaching half to move relative to each other.

The present application provides a foldable display device, a manufacturing method thereof, and a jig. The foldable display device includes a folding region, a non-folding region, a flexible display panel, and a functional layer attached through an adhesive layer. In a pre-bent state of the foldable display device, an angle between portions of the foldable display device corresponding to the non-folding region on two opposite sides of the folding region is greater than 0 degree and less than 180 degrees. A stress of a portion of the adhesive layer corresponding to the folding region is less than or equal to a first predetermined threshold.

A method for producing a member for a semiconductor manufacturing apparatus includes (a) a step of providing an electrostatic chuck, a supporting substrate, and a metal bonding material, the electrostatic chuck being made of a ceramic and having a form of a flat plate, the supporting substrate including a composite material having a difference in linear thermal expansion coefficient at 40 to 570° C. from the ceramic of 0.2×10.sup.−6/K or less in absolute value, and (b) a step of interposing the metal bonding material between a concave face of the supporting substrate and a face of the electrostatic chuck opposite to a wafer mounting face, and thermocompression bonding the supporting substrate and the electrostatic chuck at a predetermined temperature to deform the electrostatic chuck to the shape of the concave face.

A bonding device includes an upper chamber a pad with which a display substrate is pressable to a substrate; a stage between a lower chamber and the pad and including an opening through which air is introduced; a molding member between an upper chamber and the pad and surrounding the pad and the opening; and a support member connected to the stage The display substrate disposed on the molding member disposes first and second portions of the display substrate overlapping the planar and bending portions of the substrate, respectively, the molding member presses the first portion to the planar portion, and air introduced through the opening, expands the molding member to press the second portion to the bending portion.