The method for producing a microcircuit card including a film having a very low level of shrinkage between two overlay layers, carrying at least one electronic component and an assembly of layers in which a cavity is formed containing the film and the electronic component, involves: forming the assembly to include a central layer 16 made from a material having a very low level of shrinkage between two layers of a plastic material having a substantially higher level of shrinkage, for example PVC, forming, through the assembly, a cavity of which the surface area advantageously equals between 30% and 90% of the surface area of the outer faces of the microcircuit card that is to be produced, embedding the film and the electronic component in a resin so as to occupy the space in the cavity and laminating the two overlay layers.

An article of footwear can comprise: an upper; and a sole assembly connected to the upper to form a receptacle for a human foot, the sole assembly can comprise: a cushion comprising an exterior wall that forms an enclosure; an antenna disposed within the enclosure; and a microchip connected to the antenna. A method of manufacturing an article of footwear can comprise: positioning an electronic communication device between two plies of polymer laminate; heating the two plies of polymer laminate to form a weld area and a cushion area, wherein the electronic communication device becomes encapsulated between the two plies of polymer laminate; inflating the cushion area with a gas; and sealing the cushion area.

An automated conveyor system extends a continuous layer of plastic onto a moving conveyor. A pair of damming strips may be applied to the continuous layer of plastic as the conveyor advances. A liquid material may be sprayed between the damming strips and electronic assemblies may be robotically picked and placed onto the continuous layer of plastic between the damming strips and on top of the liquid material. Additional liquid material may be sprayed on top of the electronic assemblies as the conveyor moves. A continuous top plastic layer may be extended on top of the electronic assemblies, while a roller compresses the electronic assemblies between the top plastic layer and bottom plastic layer. A transparent clamp holds a portion of the compressed sub-assembly in place while the sub-assembly is cured. A sheering station sheers the sub-assembly as the conveyor indexes.

A component-embedded substrate includes a multilayer body formed by stacking up a plurality of resin layers in a predetermined direction, a component embedded in the multilayer body, the component having a plurality of terminal electrodes, a plurality of joining conductors provided in the multilayer body and joined to the plurality of terminal electrodes, a plurality of wiring conductors provided in the multilayer body and electrically coupled to the plurality of joining conductors and at least one auxiliary member enclosed within an outer boundary of the component provided in the multilayer body. The auxiliary member may be electrically insulated from each of the plurality of wiring conductors and arranged to balance pressures acting on the plurality of terminal electrodes when pressure is applied on the multilayer body.

It is an object of the invention to improve the production efficiency in sealing a thin film integrated circuit and to prevent the damage and break. Further, it is another object of the invention to prevent a thin film integrated circuit from being damaged in shipment and to make it easier to handle the thin film integrated circuit. The invention provides a laminating system in which rollers are used for supplying a substrate for sealing, receiving IC chips, separating, and sealing. The separation, sealing, and reception of a plurality of thin film integrated circuits can be carried out continuously by rotating the rollers; thus, the production efficiency can be extremely improved. Further, the thin film integrated circuits can be easily sealed since a pair of rollers opposite to each other is used.

The disclosure provides a core layer for an information carrying card, resulting information carrying card, and methods of making the same. A core layer for an information carrying card comprises at least one thermoplastic layer having at least one cavity, an inlay layer, and, and a crosslinked polymer composition. At least one portion of the inlayer layer is disposed inside the at least one cavity of the at least one thermoplastic layer. The cross-linked polymer composition is disposed over the at least one thermoplastic layer and contacting the inlayer layer.

A composition contains an inorganic powder, a binder resin, and a glass transition temperature modifier. The glass transition temperature modifier contains a compound having a structure represented by general formula (1) below

##STR00001##

wherein (In general formula (1), R.sup.1 is a hydrogen atom or a C1-C12 hydrocarbon group. In general formula (1), R.sup.2 is a C1-C12 hydrocarbon group. In general formula (1), R.sup.3 is a hydrogen atom or a C1-C12 hydrocarbon group. In general formula (1), R.sup.4 is a hydrogen atom or a C1-C12 hydrocarbon group).