A resin composition includes: a vinyl-containing polyphenylene ether resin; a compound of Formula (1); and a compound of Formula (2), a compound of Formula (3), a compound of Formula (4) or a combination thereof. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following improvements can be achieved, including prepreg viscosity variation ratio, prepreg stickiness resistance, amount of void after lamination, multi-layer board thermal resistance, glass transition temperature, ratio of thermal expansion, copper foil peeling strength, dissipation factor and laminate appearance.

A curable composition includes an olefin-aromatic vinyl compound-aromatic polyene copolymer satisfying conditions (1) to (4) and an additive resin, which is at least one of a hydrocarbon-based elastomer, polyphenylene ether, olefin-aromatic vinyl compound-aromatic polyene copolymerized oligomer, and aromatic polyene-based resin. (1) The number average molecular weight of the copolymer is 5000 to 100000. (2) The aromatic vinyl compound monomer has 8 to 20 carbon atoms, and the content of the unit of the monomer is 0 to 70 mass %. (3) The aromatic polyene is selected from polyenes having 5 to 20 carbon atoms and a plurality of vinyl and/or vinylene groups in the molecule, and the content of the groups is 1.5 to 20 pieces per number average molecular weight. (4) The olefin is selected from olefins having 2 to 20 carbon atoms, and the total monomer units of the olefin, aromatic vinyl compound, and aromatic polyene is 100 mass %.

A multi-layered composite insulation material includes a first and second outer layers having one or more of para-aramid, meta-aramid, flame-retarded modacrylic, or pre-oxidized polyacrylonitrile fibers; and an inner layer disposed between the first and second outer layers having one or more of polyacrylonitrile fibers or ceramic fibers. The inner and outer layers are bonded via needle punching, thermal bonding, or stitch bonding. The outer layers further include flame-retardant rayon fibers and a woven or knit fabric having continuous high-temperature glass, silica, or ceramic filaments.

One aspect of the present disclosure provides a composite body including: a nitride sintered body having a porous structure; and a semi-cured product of a thermosetting composition impregnated into the above-described nitride sintered body, in which dielectric breakdown voltage is 4.5 kV or higher.

A multilayer protective covering can protect a surface from lightning strikes. The covering includes a bottom conductive layer affixed to the surface and having a first opening that is aligned with a grounding connection so that the grounding connection is exposed through first opening and not in contact with the bottom conductive layer. The covering also includes a dielectric layer affixed to the bottom conductive layer and having second opening aligned with the grounding connection so that the grounding connection is exposed through second opening and not in contact with the dielectric layer. The covering additionally includes a top conductive layer affixed to the dielectric layer and covering the grounding connection. The top conductive layer directs electrical current from a lightning strike on the surface to the grounding connection.

A polymer composite of dissimilar polymers covalently bonded at the interface is disclosed. A method for bonding dissimilar polymers includes providing a first precursor to a hydrogel polymer network comprising a first coupling agent; providing a second precursor to a second polymer network comprising a second coupling agent, wherein the hydrogel polymer network and the second polymer network are different; initiating polymerization of the first precursor to form a hydrogel polymer network, wherein the first coupling agent is incorporated into the polymer network with a negligible amount of condensation; initiating polymerization of the second precursor to form a second polymer network, wherein the second coupling agent is incorporated into the second polymer network with a negligible amount of condensation; contacting one of the first hydrogel precursor or the hydrogel polymer network with one of the second polymer precursor or second polymer networks and initiating condensation between the first and second coupling agents to form a covalent bond.

This invention provides a material having a low dissipation factor that is suitable for use as an insulating material for a printed wiring board and the like; a resin composition used for the production of the material; and an application using the material. The present invention relates to a resin composition comprising a mono(C.sub.6-C.sub.20 alkyl)diallyl isocyanurate and a polyphenylene ether resin; a cured product of the resin composition; and use of the cured product.

A thermoregulation article includes a metal film, a polymer film disposed on the metal film, and a colorant film disposed on the metal film. The thermoregulation article has at least one side having an average reflectivity greater than 0.5 at a wavelength of 0.3-4 μm and an average emissivity less than 0.4 at a wavelength of 4-20 μm.

A polymer composition comprising a star-branched copolymer having a plurality of arms is disclosed. Each polymer arm has a molecular weight Mp of from 1 kg/mol to 50 kg/mol and comprises polymerized units (i) derived from a first vinyl aromatic monomer comprising a radical-reactive group, wherein from greater than 10 mol % to 100 mol % of the units (i) are unhydrogenated; and optionally, polymerized units (ii) comprising hydrogenated and unhydrogenated forms of polymerized units derived from a high Tg monomer, and hydrogenated form of polymerized units (i) or hydrogenated form of polymerized styrene units; and optionally, polymerized units (iii) comprising (a) hydrogenated form of polymerized units derived from one or more acyclic conjugated dienes, and (b) polymerized units derived from one or more of a second vinyl aromatic monomer; wherein less than 10 wt. % of units (a) are unhydrogenated.

A transparent substrate with a laminated film, which comprises a transparent substrate and a laminated film formed on at least one surface of the transparent substrate, wherein the laminated film has a first dielectric layer, a crystallinity-improving layer, a functional layer and a second dielectric layer in this order from the transparent substrate side, the crystallinity-improving layer contains ZrN.sub.x (wherein x is higher than 1.2 and at most 2.0), the functional layer contains at least one metal nitride selected from the group consisting of titanium nitride, chromium nitride, niobium nitride, molybdenum nitride and hafnium nitride, and the concentration of oxygen atoms at a boundary between the crystallinity-improving layer and the functional layer, is at most 20 atom %.