Patent classifications
B32B2307/308
MULTILAYERED TUBE FOR TRANSPORTING LIQUID MEDICINE AND POLYAMIDE RESIN COMPOSITION
There is provided a multilayered tube for transporting liquid chemicals containing an outermost layer and an innermost layer, the innermost layer containing a polyamide (A), an impact modifier (B), and a carbon nanotube (C), wherein the number of projections each having a height of 5 μm or more and a longitudinal width of 20 μm or more, which are present on the surface of the innermost layer, is 2 or less per 1 mm.sup.2 of surface area; and the number of agglomerates each having a longitudinal width of 5 μm or more, which are present in the cross section of the innermost layer, is 15 or less per 1 mm.sup.2 of cross-sectional area. There is also provided a polyamide resin composition constituting the innermost layer of the multilayered tube for transporting liquid chemicals.
THERMAL RUNAWAY MANAGEMENT SYSTEM
A thermal management system.
Packaging system for radioactive waste
A method of packaging a radioactive waste including the steps of: (a) providing a containment enclosure having (i) an outer polymeric fabric layer and (ii) an inner polymeric fabric layer, wherein the outer and inner polymeric fabric layers are thermally stable to −40° F.; (b) placing a radioactive waste within the inner polymeric fabric layer; and (c) closing an outer closeable flap on the outer polymeric fabric layer.
A FLOOR ELEMENT FOR FORMING A FLOOR COVERING AND A FLOOR COVERING
Floor element for forming a floor covering, wherein the floor element comprises a decorative layer, a support layer, and an intermediate layer disposed between the decorative layer and the support layer, wherein the decorative layer is made of a brittle material, wherein the floor elements comprises edges provided with coupling elements adapted to cooperate with coupling elements of an adjacent similar floor element in said floor covering and wherein the intermediate layer comprises at least one edge that is offset relative to a respective edge of the decorative layer.
FILM AND DECORATIVE FILM CAPABLE OF COVERING ARTICLE HAVING THREE-DIMENSIONAL SHAPE BY HEAT EXPANSION
A film capable of covering an article having a three-dimensional shape by heat expansion provided by one embodiment of the present disclosure comprises an outermost layer disposed on an outermost surface, and a polyurethane thermal adhesive layer, which contains a thermoplastic polyurethane selected from the group consisting of polyester-based polyurethanes and polycarbonate-based polyurethanes and is thermally adhered to the article during the heat expansion, wherein the fracture strength of the polyurethane thermal adhesive layer is not less than 1 MPa at 135° C., and the storage modulus at 150° C. and frequency 1.0 Hz is from 5×10.sup.3 Pa to 5×10.sup.5 Pa, and the coefficient of loss tan δ is not less than 0.1.
FLEXIBLE HOSE
A flexible hose comprising: a flexible conduit for carrying a pressurized fluid; a flexible inner support for supporting the conduit; and a compression layer surrounding the flexible conduit.
METHOD TO PRODUCE A PANEL AND SUCH A PANEL
A method to produce a panel. The method includes providing a core having a first surface, providing a surface layer including a substantially uncured amino resin, applying an hydrolysable adhesive on the first surface of the core and/or on a surface of the surface layer adapted to face the core, arranging the surface layer on the first surface of the core, pressing the surface layer to the core to form a panel by applying heat and pressure in a press, thereby adhering the surface layer to the core by the hydrolysable adhesive and curing the amino resin of the surface layer. Also such a panel.
RESIN COMPOSITION FOR SEMICONDUCTOR PACKAGE, COPPER CLAD LAMINATE AND CIRCUIT BOARD HAVING THE SAME
A resin composition for a semiconductor package according to an embodiment includes a resin composition comprising a resin and a filler provided in the resin, wherein the resin includes a soluble liquid crystal polymer resin, and wherein the filler has a negative coefficient of thermal expansion (negative CTE) and is provided in the soluble liquid crystal polymer resin.
POLYMER FILM
The present disclosure relates to a polymer film comprising a polyvinyl acetal resin and a plasticizer, wherein the polymer film is single-layer or multilayer a smallest value of a loss factor of the polymer film occurs at a temperature ranging from 40° C. to 60° C. The polymer film provided herein exhibits improved fluidity and processability.
Flame resistant composite articles and methods
Described are flame resistant composite articles and methods for making and using. A flame resistant composite article is described comprising a facial layer, a meltable layer, a heat reactive material, and an inner layer that provide lightweight flame resistance and can accommodate printing and a large number of appearance options.