A flexible pavement structure comprises a surface layer, a base layer, a sub-base layer, and a subgrade layer. Herein, the surface layer is adjacent to and above the base layer, and the sub-base layer is adjacent to and above the subgrade layer. The flexible pavement structure further comprises a layered system composed of first, second, and third materials different from each other, and is disposed as an interface layer between the base layer and the sub-base layer. The first material is a geotextile fabric selected from a group consisting of polypropylene and polyethylene, providing ground stabilization or reinforcement properties. The second material is a waterproof heat insulation material selected from a group consisting of cross-linked polyethylene foam and laminated aluminum foil, providing waterproofing or impermeability properties. The third material is a glass foamed insulation material.

A sound-absorbing material has an excellent sound absorbing property in a low-frequency range, an intermediate-frequency range, and a high-frequency range. The sound-absorbing material is a laminated sound-absorbing material, which includes at least one first layer, and at least one second layer that differs from the first layer. The first layer has a mean flow pore diameter of 2.0 to 60 μm and an air permeability according to the Frazier method of 30 to 200 cc/cm.sup.2.Math.s. The second layer is a layer including at least one kind selected from a foamed resin, a nonwoven fabric and a woven fabric, has a thickness of 3 to 40 mm, and has a density that is lower than the first layer and is 51 to 150 kg/m.sup.3. The first layer is disposed on a sound incidence side of the second layer.

A laminate composite composed of at least two laminations (1, 7) and an imprint located between them (3). The lamination (7) includes at least two layers (4, 5, 6). One layer (5) includes a UV absorber to protect the imprint. This layer (5) is characterized by having a lower density than the other layers (4, 6). The other layers (4, 6) preferably have a density that is higher relative to the one layer (5) by a factor of 1.005, in particular by a factor of 1.01, preferably by a factor of 1.015.

A method for providing container flooring for a container, including: providing a plurality of container flooring boards, each including a plurality of strand layers including strands of wood bonded together, at least a top strand layer and a bottom strand layer of the container flooring board having its strands substantially aligned in a first direction, and a dimension of the container flooring board in a second direction that is perpendicular to the first direction being selected to extend laterally between sides of the container in use; and arranging the container flooring boards inside the container, each container flooring board being positioned so that the strands of the top strand layer and the bottom strand layer are substantially aligned longitudinally relative to the container and the container flooring board extends laterally between the sides of the container, and respective edges of adjacent container flooring boards abut one another.

A method for manufacturing a laminated molded body includes a cutting-out step for cutting out a cushion layer to form a cut-out part; a base material laminating step for forming a first laminated body; an insulating material placing step of attaching an insulating material to the cut-out part; a first thermocompression bonding step for bonding the first laminated body by thermocompression; a removing step for removing the cut-out part to form an opening; a skin laminating step for forming a second laminated body; and a second thermocompression bonding step for bonding the skin at the opening part to the lower layer material by bonding the second laminated body by thermocompression, the lower layer material being arranged below the cushion layer having the opening part.

A cleansing wipe may be formed from a nonwoven and includes a first ethylene/alpha-olefin interpolymer and a second ethylene/alpha-olefin interpolymer. The cleansing wipe may also have a SaMbSc configuration, wherein the M, meltblown layer, is formed from the first ethylene/alpha-olefin interpolymer and the second ethylene/alpha-olefin interpolymer. The cleansing wipe may be formed a nonwoven comprising bicomponent fibers that incorporate the first ethylene/alpha-olefin interpolymer and the second ethylene/alpha-olefin interpolymer.

A laminate for forming a packaging bag including a substrate layer containing a crystalline polyester film, an adhesive layer, and a sealant layer containing the polyester film arranged in this order. The sealant layer has a ratio of a fracture elongation thereof to a thickness thereof which is 13%/um or less. The fracture elongation is a fracture elongation of the sealant layer as measured in a unit of 15mm width thereof in an MD direction.

Laminated film structure including at least one first film having a thin ceramic or metal coating, being laminated to a second film and whereby the laminated film structure is based on polyethylene only, i.e. polymers other than polyethylene are substantially absent and whereby the laminated film structure has good barrier properties.

A soundproofing material including a porous body having a cell structure and including inorganic fibers other than asbestos, wherein an average cell diameter is more than 300 μm and 1000 μm or less, a bulk density is 0.007 to 0.024 g/cm.sup.3, and a flow resistivity is 170,000 to 2,000,000 Ns/m.sup.4.

The present invention discloses a polyimide-based composite carbon film with high thermal conductivity and a preparation method therefor. The preparation method includes: uniformly coating the surface of a polyimide-based carbon film with an aqueous graphene oxide solution, and then covering the same with another polyimide-based carbon film uniformly coated with an aqueous graphene oxide solution; repeating such operation; after the polyimide-based carbon films are dried, bonding the polyimide-based carbon films by means of graphene oxide so as to form a thick film; bonding the polyimide-based carbon films more tightly by means of further low-temperature hot pressing; and finally, obtaining a thick polyimide-based carbon film with high thermal conductivity by repairing defects by means of low-temperature heating pre-reduction and high-temperature and high-pressure thermal treatment. The thick polyimide-based carbon film with high thermal conductivity has a thickness greater than 100 μm and an in-plane thermal conductivity of even reaching 1700 W/mK or above.