A method for manufacturing a printed wiring board which includes: Step (A) of laminating an adhesive sheet including a support and a resin composition layer bonded to the support to an inner layer board so that the resin composition layer is bonded to the inner layer board; Step (B) of thermally curing the resin composition layer to form an insulating layer; and Step (C) of removing the support, in this order, in which the support satisfies a condition (MD1): a maximum expansion coefficient E.sub.MD in an MD direction at 120° C. or more is less than 0.2% and a condition (TD1): a maximum expansion coefficient E.sub.TD in a TD direction at 120° C. or more is less than 0.2% below, when being heated under predetermined heating conditions, does not lower the yield even when the insulating layer is formed by thermally curing the resin composition layer with a support attached to the resin composition layer.

Disclosed herein are relates to a method for compressing a laminate and a method for manufacturing a ceramic electronic component including a laminate. The method for compressing a laminate includes: preparing a laminate; pressurizing the laminate from a first pressure to a second pressure; heating the laminate from a first temperature to a second temperature; maintaining compression of the laminate at the second pressure and the second temperature for a predetermined time; cooling the laminate from the second temperature to a third temperature; and depressurizing the laminate from the second pressure to a third pressure, wherein the second temperature is 70° C. to 150° C.

Methods of manufacturing a conveyor belt (126) include applying a rubber composition (114) to a first side of fabric reinforcement (112) and scattering productive thermoplastic elastomer pellets (106) onto a second side of the fabric reinforcement to produce an uncured belt structure (120). The uncured belt structure (120) is continuous fed into a double belt press (116) to press the productive thermoplastic elastomer pellets (106) together with the fabric reinforcement (112) to produce an uncured belt (128). Uncured belt (128) is then heated in the double belt press (116) to a temperature of at least 300° F. and maintained in the double belt press (116) under a pressure of at least 12 psi and a temperature of at least 300° C. for a residence time of at least 20 minutes to produce a cured conveyor belt (130), which is continuously withdrawn from the double belt press (116).

A method for bonding a plurality of Nd—Fe—B permanent magnets includes a step of curing the layer of insulating adhesive at an initial temperature of between 20° C. and 250° C. and between 0.1 hr and 24 hr prior to the step of sandwiching. A predetermined clamping pressure of between 0.1 MPa and 10 MPa is then applied to the Nd—Fe—B permanent magnets. The stacked Nd—Fe—B permanent magnet is cured at a predetermined temperature of between 150° C. and 350° C. and between 0.1 hr and 12 hr. A clamping tool apparatus includes at least one of three intermediate guides disposed on the lower plate, in the chamber, spaced from the magnet positioning members, and extends to a proximal end defining a second predetermined distance with the second predetermined distance being less than the first predetermined distance of the magnet positioning members. The upper plate defines a plurality of apertures for receiving the magnet positioning members and the intermediate guides.

A method for bonding components is provided. The method includes preparing a surface of a metal component, applying a film adhesive to the prepared surface, forming a thermoplastic component using injection molding such that the film adhesive is positioned between the metal component and the thermoplastic component, and curing the film adhesive.

Printed wiring boards with reduced curing unevenness and the like may be produced by (A) preparing an adhesive sheet having a support and a resin composition layer provided on the support, (B) laminating the adhesive sheet on an internal layer substrate so that the resin composition layer is in contact with the internal layer substrate, and (C) thermally curing the adhesive sheet by heating from T1 (° C.) to T2 (° C.), to form an insulating layer, wherein the adhesive sheet is thermally cured so that a relation of Y>2700X is satisfied in which X is the sum of a difference between a maximum expansion rate of the support in the MD direction during heating from T1 (° C.) to T2 (° C.) and an expansion rate of the support at the end of heating and a difference between a maximum expansion rate of the support in the TD direction during heating from T1 (° C.) to T2 (° C.) and an expansion rate of the support at the end of heating and Y is the lowest melt viscosity of the resin composition layer at 120° C. or higher.

A laminate blank includes at least one rigidifying layer and at least one comfort layer. The rigidifying layer includes a reinforcement preform and a resin. The layers are pressed to form the laminate blank.

In some implementations, an electronic device includes a display stack to display content. The display stack can include a number of substrates coupled using a liquid optically clear adhesive (LOCA). In some implementations, the LOCA can have a modulus of elasticity of no greater than 80,000 Pa. Additionally, the display stack can be formed using a process that includes applying an external force to the display stack by placing the display stack between two fixtures. In an implementation, the external force can be applied while heating the display stack at a temperature of at least 60° C. and cooling the display stack according to a particular cooling rate.

A method for manufacturing a printed wiring board which includes: Step (A) of laminating an adhesive sheet including a support and a resin composition layer bonded to the support to an inner layer board so that the resin composition layer is bonded to the inner layer board; Step (B) of thermally curing the resin composition layer to form an insulating layer; and Step (C) of removing the support, in this order, in which the support satisfies a condition (MD1): a maximum expansion coefficient E.sub.MD in an MD direction at 120° C. or more is less than 0.2% and a condition (TD1): a maximum expansion coefficient E.sub.TD in a TD direction at 120° C. or more is less than 0.2% below, when being heated under predetermined heating conditions, does not lower the yield even when the insulating layer is formed by thermally curing the resin composition layer with a support attached to the resin composition layer.

In a preferred embodiment, a composite panel with a smooth outer surface, ready for painting with or without addition of primer, may be created by constructing a panel layup assembly upon a mold, the panel layup assembly including a composite panel having a core and a resin formulation, and a release film between the mold and the composite panel, where a smooth release surface of the release film is in contact with the composite panel upon construction; initiating curing of the composite panel at a first temperature within a lowermost ten percent of a curing temperature range of the resin formulation; continuing curing of the composite panel at a second temperature above the lowermost ten percent of the curing temperature range; and completing curing of the composite panel at a third temperature below the second temperature.