A protective garment is constructed with a fibrous material. The fibrous material comprises a first nonwoven layer, a second nonwoven layer, and a nanofiber layer laminated between the first nonwoven layer and the second nonwoven layer. The fibrous material has a mean flow pore size greater than or equal to about 0.02 micron and less than or equal to about 0.5 microns, and a water vapor transmission rate greater than or equal to about 10000 g/m.sup.2/day and less than or equal to about 100000 g/m.sup.2/day. In a method of making a fibrous layer, a first nonwoven layer and a nanofiber layer are provided. A polyurethane reactive resin is applied to the first nonwoven layer in an amount of 2 to 30 g/m.sup.2. The nanofiber layer is then laminated to the first nonwoven layer applied with the polyurethane reactive resin and pressed to form the fibrous layer.

An example of a lamination kit includes a first flexible film substrate, a primer fluid, a fixer fluid, an aqueous inkjet ink, a lamination adhesive, and a second flexible film substrate. The primer fluid includes a first binder. The fixer fluid includes a cationic salt and an organic acid. The aqueous inkjet ink includes a second binder, a pigment, a surfactant, a co-solvent, and a balance of water.

In a preferred embodiment, a composite panel with a smooth outer surface, ready for painting with or without addition of primer, may be created by constructing a panel layup assembly upon a mold, the panel layup assembly including a composite panel having a core and a resin formulation, and a release film between the mold and the composite panel, where a smooth release surface of the release film is in contact with the composite panel upon construction; initiating curing of the composite panel at a first temperature within a lowermost ten percent of a curing temperature range of the resin formulation; continuing curing of the composite panel at a second temperature above the lowermost ten percent of the curing temperature range; and completing curing of the composite panel at a third temperature below the second temperature.

A method for manufacturing a printed wiring board which includes: Step (A) of laminating an adhesive sheet including a support and a resin composition layer bonded to the support to an inner layer board so that the resin composition layer is bonded to the inner layer board; Step (B) of thermally curing the resin composition layer to form an insulating layer; and Step (C) of removing the support, in this order, in which the support satisfies a condition (MD1): a maximum expansion coefficient E.sub.MD in an MD direction at 120° C. or more is less than 0.2% and a condition (TD1): a maximum expansion coefficient E.sub.TD in a TD direction at 120° C. or more is less than 0.2% below, when being heated under predetermined heating conditions, does not lower the yield even when the insulating layer is formed by thermally curing the resin composition layer with a support attached to the resin composition layer.

Resin dissolved or suspended in liquid is applied to a greige fabric formed with finer denier yarns forming surface loops before the fabric is bulked and after the liquid has been removed by low-temperature drying. The dried fabric is then bulked at a higher temperature setting the resin, resulting in superior loop tip resilience, and superior surface durability. Bulking and simultaneous resin setting optionally includes shrinking in area by 10-20%. Print appearance retention is also superior when printing follows bulking and setting of the resin.

A method of attaching a detector onto a substrate that has an array of electrically conducting pads is provided, together with the resulting detector assembly. The method includes pouring a non-conductive adhesive material over a substrate surface, allowing the adhesive to settle between the conducting pads to form dams around the conducting pads, applying a conductive adhesive material onto the conducting pads of the substrate, and placing a surface of the detector on the substrate surface over the conducting and non-conducting adhesives to thereby attach the surface of the detector to the surface of the substrate.

Resin dissolved or suspended in liquid is applied to a greige fabric formed with finer denier yarns forming surface loops before the fabric is bulked and after the liquid has been removed by low-temperature drying. The dried fabric is then bulked at a higher temperature setting the resin, resulting in superior loop tip resilience, and superior surface durability. Bulking and simultaneous resin setting optionally includes shrinking in area by 10-20%. Print appearance retention is also superior when printing follows bulking and setting of the resin.

Methods for forming a fluoropolymer coated component, such as a metal component, comprise applying an adhesion promoter onto a surface of the component; applying an organic material onto the adhesion promoter; and applying a mixture comprising a fluoropolymer and a solvent selected from a furan or a fluorinated solvent onto the organic material. Fluoropolymer coatings have a thickness of from about 5 mil to about 80 mil on a component, an average porosity of from about 20% to about 70% based on the total volume of the layer, and a void density of from about 10.sup.11 to about 10.sup.13 voids per cm.sup.3.

A laminate blank includes at least one rigidifying layer and at least one comfort layer. The rigidifying layer includes a reinforcement preform and a resin. The layers are pressed to form the laminate blank.

The present invention discloses a polyimide-based composite carbon film with high thermal conductivity and a preparation method therefor. The preparation method includes: uniformly coating the surface of a polyimide-based carbon film with an aqueous graphene oxide solution, and then covering the same with another polyimide-based carbon film uniformly coated with an aqueous graphene oxide solution; repeating such operation; after the polyimide-based carbon films are dried, bonding the polyimide-based carbon films by means of graphene oxide so as to form a thick film; bonding the polyimide-based carbon films more tightly by means of further low-temperature hot pressing; and finally, obtaining a thick polyimide-based carbon film with high thermal conductivity by repairing defects by means of low-temperature heating pre-reduction and high-temperature and high-pressure thermal treatment. The thick polyimide-based carbon film with high thermal conductivity has a thickness greater than 100 m and an in-plane thermal conductivity of even reaching 1700 W/mK or above.