Described are techniques and equipment (apparatus) for processing an electrostatic chuck at controlled process conditions, including, as an example, for processing an electrostatic chuck during a step of curing an adhesive that forms a bond between two layers of the electrostatic chuck.

An apparatus and method for leveling a bonding device and anvil in an assembly via a closed-loop control system is provided. The assembly includes an anvil, a bonding device positioned adjacent the anvil and configured to interact with the anvil to form the bonds on the web, and an actuator that enables adjustment of an orientation between the bonding device and the anvil. The assembly also includes a closed-loop control system configured to control operation of the actuator, with the closed-loop control system configured to monitor an operational parameter of the assembly indicative of interaction of the bonding device with the anvil, determine whether the bonding device is parallel or substantially parallel with the anvil based on the operational parameter, and when the bonding device is not parallel or substantially parallel with the anvil, cause the actuator to adjust the orientation between the bonding device and the anvil.

A method of producing an optical panel assembly including the polarizing film in a continuous manner by laminating a polarizing film to a surface of a rectangular-shaped optical panel, is disclosed. The polarizing film is formed by performing a step of subjecting a laminate including a continuous web of a thermoplastic resin substrate and a PVA type resin layer formed on the substrate, to a 2-stage stretching consisting of a preliminary in-air stretching and an in-boric-acid-solution stretching, to reduce a thickness of the PVA type resin layer to 10 μm or less, and a step of causing a dichroic material to be absorbed in the PVA type resin layer.

A method of producing a plurality of analytical test strips using a reel-to-reel process, comprising providing at least one continuous first layer web, having disposed on a first side at least one first electrode layer, the first layer web having a first layer edge; continuously disposing at least one continuous spacer layer web onto the first side of the first layer web, wherein the spacer layer web has a spacer layer edge, wherein the disposing is position-controlled in a master-slave fashion by using a position of the first layer edge as a master position and a position of the spacer layer edge as a slave position; and continuously disposing at least one continuous second layer web onto the spacer layer web, the second layer web having disposed on a first side at least one second electrode layer, wherein the second layer web has a second layer edge.

An apparatus and method for leveling a bonding device and anvil in an assembly via a closed-loop control system is provided. The assembly includes an anvil, a bonding device positioned adjacent the anvil and configured to interact with the anvil to form the bonds on the web, and an actuator that enables adjustment of an orientation between the bonding device and the anvil. The assembly also includes a closed-loop control system configured to control operation of the actuator, with the closed-loop control system configured to monitor an operational parameter of the assembly indicative of interaction of the bonding device with the anvil, determine whether the bonding device is parallel or substantially parallel with the anvil based on the operational parameter, and when the bonding device is not parallel or substantially parallel with the anvil, cause the actuator to adjust the orientation between the bonding device and the anvil.

Provided is an automatic laminating machine, including a supporting plate assembly, a case, a limiting assembly, a film separation assembly, and an input roller assembly. A lower end of the supporting plate assembly extends into and is rotatably connected inside the case. The limiting assembly and the input roller assembly are rotatably connected inside the case. The film separation assembly is arranged inside the case, and located below the input roller assembly. One end of the limiting assembly is rotatably connected to the supporting plate assembly.

A method for bonding a first wafer onto a second wafer by molecular adhesion where the wafers have an initial radial misalignment between them. The method includes bringing the two wafers into contact so as to initiate the propagation of a bonding wave between the two wafers while a predefined bonding curvature is imposed on at least one of the two wafers during the contacting step as a function of the initial radial misalignment.

A device for manufacturing a membrane-electrode assembly of a fuel cell includes: an electrolyte membrane feeder unwinding an electrolyte membrane and supplying the unwound electrolyte membrane to a preset transfer path; a first catalyst coater installed in the side of the electrolyte membrane feeder and coating a first catalytic material on another surface of the electrolyte membrane every a preset pitch; a film processor installed in a rear side of the first catalyst coater, supplying a second protective film onto a first catalyst electrode layer on the other surface of the electrolyte membrane, and taking off the first protective film from the one surface of the electrolyte membrane; and a second catalyst coater installed in a rear side of the film processor and coating a second catalytic material on the one surface of the electrolyte membrane.

A sealing apparatus 200 for sealing together two film portions 202, 204 may include a heating element 206 positioned in relation to a pair of nip pressure devices 208, 210 for creating a seal 311 between the two film portions 202, 204 and trimming the two film portions 202, 204 at the created seal. A controller 214 is connected to the heating element 206 and is for connection to a power source for applying a variable amount of power to the heating element 206. The amount of power varies based on at least a speed of the two film portions 202, 204 passing the heating element 206.

A method for producing a composite component including a bottom layer, cover layer and honeycomb structure, including applying the honeycomb structure to the bottom layer wherein honeycomb chambers are formed. Honeycomb chambers are filled in a reinforcement region with a granular material and granular material is removed from other honeycomb chambers wherein each honeycomb chamber is filled up to a granular-material filling height and honeycomb chambers outside the reinforcement region are free of granular material. The cover layer is applied to the honeycomb structure wherein the honeycomb chambers are closed. The composite component is heated so the granular material in the honeycomb chambers expands to fill it with granular material and the cover layer, the bottom layer, the honeycomb structure and the expanded granular material harden, the density of the expanded granular material in the honeycomb chambers filled with granular material being dependent on the granular-material filling height.