To provide a process for producing a package for mounting a semiconductor element by using a mold, said a package for mounting a semiconductor element comprising a substrate having a mounting surface for mounting a semiconductor element and a packaging body formed from a cured product of a curable resin and having a frame-shaped portion surrounding the mounting surface, and the package has a concave portion formed by the mounting surface and the packaging body, which allows it to prevent resin burrs without occurrence of dents or damage of a substrate and failure in releasing from a mold, and to provide a mold release film to be suitably used for the production process. A mold release film having a substantially constant thickness over the film, is disposed on the upper mold having a convex portion of which shape corresponds to the concave portion, the substrate is disposed on the lower portion, the upper mold and the lower mold are closed so as to be in close contact with the convex portion to the mounting portion of the substrate via the mold release film, a space formed between the upper mold and the lower mold is filled with a curable resin, followed by curing the curable resin, and the cured product is released together with the substrate, from the mold.

There is provided a laminate membrane for an implant, comprising: an inner layer having an inner layer thickness; a first covering layer disposed on one side of the inner layer, the first covering layer having a first covering layer thickness; and a second covering layer disposed on another side of the inner layer, the second covering layer having a second covering layer thickness.

An anti-wear composite structure includes an anti-wear layer that has a wear surface opposite an adhesive receiving surface and a thermosetting resin applied to the adhesive receiving surface. The thermosetting resin includes a reactive adhesive configured to bond the anti-wear composite structure to a substrate at an ambient temperature band via pressure-sensitive adhesion. The thermosetting resin has an onset to cure in the ambient temperature band and has a peak cure temperature greater than the ambient temperature band to mechanically and chemically bond the anti-wear composite structure to a substrate.

A method of manufacturing a supported copper product is disclosed. The method includes: providing a thin copper foil and a poly-based film containing polyimide and polytetrafluoroethylene, the poly-based film having an adhesive applied to a surface of the poly-based film; thermally treating the thin copper foil and the poly-based film along their respective lengths, the thermal treatment being adjustable to vary an amount of heat applied to the thin copper foil and the poly-based film; and attaching the thermally treated thin copper foil and the thermally treated poly-based film using the adhesive applied at the surface of the poly-based film.

To provide a dispersion, a laminate, a film and an impregnated woven fabric.

A powder dispersion comprising powder I of polymer I having units based on tetrafluoroethylene and an oxygen-containing polar group, powder II of polymer II containing units based on a fluoroolefin, a dispersing agent, and a liquid dispersion medium, wherein the ratio of the mass content of the polymer I to the mass content of the polymer II is at most 0.7, or such a power dispersion wherein the dispersing agent is a fluorinated surfactant having a hydroxy group. A laminate, a film, and an impregnated woven fabric produced by using such a powder dispersion.

A coated woven fabric including an impregnated woven structure having a woven structure of plain or twill woven yarns of twisted aramid fibers, wherein the impregnated woven structure is impregnated with an organofluorine compound and the fibers have a linear density of 350 to 1000 dtex and a coating layer provided on at least one side of the impregnated woven structure.

A manufacturing method for an acidic gas separation membrane sheet includes: a step of preparing a hydrophilic resin composition liquid for forming a hydrophilic resin composition layer; a step of removing bubbles contained in the hydrophilic resin composition liquid; a step of applying the hydrophilic resin composition liquid onto a first porous layer to form an applied layer on the first porous layer; and a step of laminating a second porous layer on the applied layer to form a laminated body. The step of removing bubbles includes: a step of applying a shear to the hydrophilic resin composition liquid; and a step of leaving the hydrophilic resin composition liquid.

Various embodiments of multilayer polymer films and multilayer structures with enhanced tear strength are provided. Also disclosed are processes and systems for producing the disclosed multilayer polymer films. The disclosed films comprise a first polymer that may be cross-linkable upon exposure to radiation, and a second polymer that is cleaved or broken when exposed to irradiation. Layers comprising the first polymer are referred to as bulk layers, and layers comprising the second polymer are referred to as scission layers. Scission layers are positioned between bulk layers. The bulk and scission layers may comprise one or more sublayers.

The present invention provides a process for preparing a functionalised polymeric chromatography medium, which process comprises (I) providing two or more non-woven sheets stacked one on top of the other, each said sheet comprising one or more polymer nanofibres, (II) simultaneously heating and pressing the stack of sheets to fuse points of contact between the nanofibres of adjacent sheets, and (III) contacting the pressed and heated product with a reagent which functionalises the product of step (II) as a chromatography medium.

A film having a dielectric dissipation factor at a frequency of 1 kHz and 160 C. of 0.02% or lower and a dielectric breakdown strength at 160 C. of 400 V/m or higher. Also disclosed is a film including at least one fluoropolymer selected from a tetrafluoroethylene/perfluoro(alkyl vinyl ether) copolymer and a tetrafluoroethylene/hexafluoropropylene copolymer, the fluoropolymer having a crystallinity of 65% or higher.