The present invention belongs to the field of thermal transfer printing technology, and relates to a side holding structure, comprising: side openings arranged on the opposite sides of the housing, wherein a plurality of snap joints are arranged on the edge of the side openings; holding covers assembled in the side openings, a plurality of hooks detachably connected to the plurality of snap joints are arranged on the inner side of the ring mouth portion, at least one positioning groove is arranged on the top outside of the cover wall; and at least one inserting portion arranged on the top cover of the housing and fitted to the positioning groove. The present invention also provides a thermal transfer printing device using the side holding structure described above.

The present invention belongs to the field of thermal transfer printing technology, and relates to a side holding structure, comprising: side openings arranged on the opposite sides of the housing, wherein a plurality of snap joints are arranged on the edge of the side openings; holding covers assembled in the side openings, a plurality of hooks detachably connected to the plurality of snap joints are arranged on the inner side of the ring mouth portion, at least one positioning groove is arranged on the top outside of the cover wall; and at least one inserting portion arranged on the top cover of the housing and fitted to the positioning groove. The present invention also provides a thermal transfer printing device using the side holding structure described above.

A side holding structure is provided, which includes side openings arranged on opposite sides of a housing, a plurality of snap joints are arranged on edges of the side openings; holding covers assembled in the side openings, a plurality of hooks detachably connected to the plurality of snap joints are arranged on an inner side of a ring mouth portion, at least one positioning groove is arranged on a top outside of a cover wall; and at least one inserting portion arranged on a top cover of the housing and fitted to the positioning groove. A thermal transfer printing device using the side holding structure described above is further provided.

A side holding structure is provided, which includes side openings arranged on opposite sides of a housing, a plurality of snap joints are arranged on edges of the side openings; holding covers assembled in the side openings, a plurality of hooks detachably connected to the plurality of snap joints are arranged on an inner side of a ring mouth portion, at least one positioning groove is arranged on a top outside of a cover wall; and at least one inserting portion arranged on a top cover of the housing and fitted to the positioning groove. A thermal transfer printing device using the side holding structure described above is further provided.

Different transfer material and printing methods may require different heating temperatures, pressing durations, and applied pressure to have a design imprinted optimally on a substrate using a platen system of a heat press. The heat press disclosed herein may allow for the adjustment of applied pressure by the platen system in addition to the adjustment of the heating temperature and pressing duration. A user may be able to select from a plurality of preset pressure configurations the desired amount of pressure that the heat press should apply to the objects between the platen system. The applied pressure may be constant pressure or pressure increasing with time. A user may select from different magnitudes of constant pressure or rates of increasing pressure. Additionally, the heat press may have a pressure distribution system for evening out an upper platen to the lower platen when they are pressed together.

Different transfer material and printing methods may require different heating temperatures, pressing durations, and applied pressure to have a design imprinted optimally on a substrate using a platen system of a heat press. The heat press disclosed herein may allow for the adjustment of applied pressure by the platen system in addition to the adjustment of the heating temperature and pressing duration. A user may be able to select from a plurality of preset pressure configurations the desired amount of pressure that the heat press should apply to the objects between the platen system. The applied pressure may be constant pressure or pressure increasing with time. A user may select from different magnitudes of constant pressure or rates of increasing pressure. Additionally, the heat press may have a pressure distribution system for evening out an upper platen to the lower platen when they are pressed together.