B41F15/0881

METHODS FOR PRINTING SOLDER PASTE AND OTHER VISCOUS MATERIALS AT HIGH RESOLUTION
20220379396 · 2022-12-01 ·

Systems and methods in which dot-like portions of a material (e.g., a viscous material such as a solder paste) are printed or otherwise transferred onto an intermediate substrate at a first printing unit, the intermediate substrate having the dot-like portions of material printed thereon is transferred to a second printing unit, and the dot-like portions of material are transferred from the intermediate substrate to a final substrate at the second printing unit. Optionally, the first printing unit includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred in the individual dot-like portions from the donor substrate onto the intermediate substrate at the first printing unit. Each of the first and second printing units may employ a variety of printing or other transfer technologies. The system may also include material curing and imaging units to aid in the overall process.

PRINTING DEVICE, SOLDER MANAGEMENT SYSTEM, AND PRINTING MANAGING METHOD
20170348786 · 2017-12-07 ·

A printing device includes a storage that stores allowable time for which use of solder supplied to a screen mask can be allowed, a timer that measures time for which the solder is supplied to the screen mask, a determination unit that determines whether or not the solder supplied to the screen mask has exceeded the allowable time based on time measured by the timer, and a notifier that notifies a worker in a case where the determination unit determines that the solder supplied to the screen mask has exceeded the allowable time. The timer measures time by weighting a measurement interval of time for which the solder is moved on the screen mask by a squeegee so as to become greater than a measurement interval of time for which the solder does not move on the screen mask.

PRINTING SYSTEM FOR PRINTING ON A SUBSTANTIALLY PLANAR SURFACE OF A 3D-OBJECT AND A METHOD FOR PRINTING THEREOF
20170355184 · 2017-12-14 · ·

A printing system for printing on a substantially planar surface of a 3D-object includes a printer for printing on the planar surface of the 3D-object and a controller configured to control printing of the printer. The printing system further includes a mask generation module configured to generate a mask having the shape of the planar surface from a 3D-model of the 3D-object and to provide the controller with the mask to prevent printing outside the planar surface according to the mask.

Supply unit, printing device, and method for controlling printing device
11490525 · 2022-11-01 · ·

The supply unit is used in a printing device to perform a print process of a viscous fluid on a printing target to supply the viscous fluid. The supply unit includes an attachment section to and from which a cartridge accommodating the viscous fluid is attachable or detachable, a restricting wall section configured to cover the cartridge and restrict access to an inside of the printing device, and a driving section configured to move the cartridge attached to the attachment section and the restricting wall section in a supply operation direction.

Screen printing machine
11253939 · 2022-02-22 · ·

A screen printing machine configured to print solder onto a surface of a circuit board using a screen mask. The screen printing machine is provided with: a screen mask arranged at a top side of the circuit board; a box member arranged at an underside of the circuit board including a space that is closed by the circuit board; a negative pressure generator connected to the space of the box member and configured to create negative pressure inside the space; a sensor configured to detect a pressure inside the space; and a control device configured to control the negative pressure generator based on the pressure detected by the sensor.

APPARATUS FOR PERFORMING COMPENSATION ASSOCIATED WITH SCREEN PRINTER AND METHOD THEREOF

An apparatus that communicates with a screen printer and a solder inspection device is disclosed. The apparatus according to the present disclosure may include a process that is configured to: obtain first information associated with each of a plurality of pads on the substrate; obtain second information associated with each piece of the solder paste applied to each of the plurality of pads from the solder inspection device; determine a position correction value for the stencil mask with respect to the substrate based on the first information and the second information; and deliver the position correction value to the screen printer.

SCREEN PRINTING STENCIL, LIGHT GUIDE PLATE, DISPLAY DEVICE , AND METHOD FOR MANUFACTURING LIGHT GUIDE PLATE
20170285249 · 2017-10-05 ·

Disclosed are a screen printing stencil, a light guide plate and a display device. The screen printing stencil includes a pattern printing section arranged corresponding to a light guide plate to be printed, and at least one positioning mark hole arranged on the periphery of the pattern printing section. The light guide plate is manufactured using the screen printing stencil according to the embodiment of the invention by firstly aligning in position the pattern printing section of the screen printing stencil with the light guide plate to be printed, using the at least one positioning mark hole, and then printing on the light guide plate to be printed. A corresponding pattern of positioning marks is printed on the light guide plate in addition to the corresponding pattern. As compared with the prior art, the precision of aligning in position the screen printing stencil with the light guide plate to be printed can be improved to thereby improve the displaying quality of the display product.

SOLDER INSPECTION APPARATUS AND METHOD OF GENERATING FEEDBACK INFORMATION OF SOLDER INSPECTION APPARATUS
20170277165 · 2017-09-28 · ·

A feedback information generation method for a solder inspection apparatus includes: receiving an input of information on the number of buffers which are disposed between the solder inspection apparatus and a screen printer for printing solder on printed circuit boards and are configured to support the printed circuit boards to be introduced into the solder inspection apparatus so as to put the printed circuit boards on standby; generating feedback information by using the input information and an inspection result of the printed circuit boards by the solder inspection apparatus; and transmitting the feedback information to the screen printer. Feedback information may be generated in consideration of the number of buffers, thereby preventing the feedback information from being excessively generated as well as ensuring the accuracy of the feedback information.

Stencil Frames
20170245371 · 2017-08-24 ·

Stencil frames for tensioning stencils of an angular shape are provided. The stencil frame comprises corner elements (2), edge elements (1), fastening elements (13) and tensioning devices with a tensioning device being associated with each edge element (1). The corner elements (2) each have two, mutually perpendicular, guiding profiles (12) which joined at an intersection of their axes and the edge elements (1) each have a uniaxial reception profile (11). Each reception profile (11) is connectable to two guiding profiles (12) by loose fit. Each tensioning device has at least one elastic element (5) and connects between two neighbouring corner elements (2). A line of force exerted by each tensioning device is parallel to the axis of its corresponding reception profile (11).

SYSTEM FOR MANUFACTURING ASSEMBLY BOARD AND METHOD FOR INSTALLING UNDERSUPPORTING DEVICE OF THE SYSTEM
20170245406 · 2017-08-24 ·

System for manufacturing an assembly board includes an undersupporting device, a transporter, an undersupporting-device installer attachable to and detachable from the undersupporting device, a board processor, a carry-in side delivering unit having different first and second receiving positions, a board supplier configured to supply the board to the first receiving position, and an undersupporting-device supplier configured to supply the undersupporting device to the second receiving position. The carry-in side delivering unit delivers, to the transporter, the undersupporting device supplied to the second receiving position. The transporter transports, to a working position, the undersupporting device delivered from the carry-in side delivering unit. The undersupporting-device installer fixes, to the undersupporting-device installer, the undersupporting device transported to the working position. The carry-in side delivering unit delivers, to the transporter, the board supplied to the first receiving position. The transporter transports, to the working position, the board delivered from the carry-in side delivering unit.