Method and system for thermal transfer printing are disclosed. The system includes a transfer member having an imaging surface on the front side, a coating station at which a monolayer of particles made of, or coated with, a thermoplastic polymer is applied to the imaging surface, an imaging station at which electromagnetic radiation (EM) is applied via the rear side of the transfer member to selected regions of the particles-coated imaging surface to render the particles thereon tacky within the selected regions, and a transfer station at which only the regions of the particles coating that have been rendered tacky are transferred to a substrate. The transfer member includes on its rear side a body transparent to EM radiation and on its front side an EM radiation absorbing layer, the imaging surface being formed on, or as part of, the absorbing layer.

A drive apparatus includes a light emitting device, a light receiving device configured to receive light emitted by the light emitting device, a comparison circuit configured to compare a light quantity of light detected by the light receiving device with a target value indicating a light quantity of light to be emitted by the light emitting device and generate a control signal corresponding to a comparison result, and a drive circuit configured to supply a drive signal corresponding to the control signal to the light emitting device. The drive circuit includes a gain changing switch configured to change, in accordance with the target value, a gain of the drive circuit.

A drive apparatus includes a light emitting device, a light receiving device configured to receive light emitted by the light emitting device, a comparison circuit configured to compare a light quantity of light detected by the light receiving device with a target value indicating a light quantity of light to be emitted by the light emitting device and generate a control signal corresponding to a comparison result, and a drive circuit configured to supply a drive signal corresponding to the control signal to the light emitting device. The drive circuit includes a gain changing switch configured to change, in accordance with the target value, a gain of the drive circuit.

A system for forming a structure on a print medium 1 includes: a print unit (print device) 10 for printing an electromagnetic wave-heat conversion layer for converting electromagnetic waves into heat, on a medium including an expansion layer that expands by heating; an expansion unit (expansion device) 20 aligned laterally with the print unit 10, for expanding the expansion layer by irradiating the medium with electromagnetic waves; and a top plate 30 covering the print unit 10 and the expansion unit 20 from above.

A system for forming a structure on a print medium 1 includes: a print unit (print device) 10 for printing an electromagnetic wave-heat conversion layer for converting electromagnetic waves into heat, on a medium including an expansion layer that expands by heating; an expansion unit (expansion device) 20 aligned laterally with the print unit 10, for expanding the expansion layer by irradiating the medium with electromagnetic waves; and a top plate 30 covering the print unit 10 and the expansion unit 20 from above.

An exposure unit includes first and second exposure heads. The first exposure head includes: first light emitting devices each emitting a first light beam; a first optical system performing imaging of each of the first light beams; a first coupler; and a first base member. The first coupler is provided at a first position, in the first base member, based on a position at which the imaging performed by the first optical system is performed. The second exposure head includes: second light emitting devices each emitting a second light beam; a second optical system performing imaging of each of the second light beams; a second coupler; and a second base member. The second coupler is provided at a second position, in the second base member, based on a position at which the imaging performed by the second optical system is performed and is fit into the first coupler.

An exposure unit includes first and second exposure heads. The first exposure head includes: first light emitting devices each emitting a first light beam; a first optical system performing imaging of each of the first light beams; a first coupler; and a first base member. The first coupler is provided at a first position, in the first base member, based on a position at which the imaging performed by the first optical system is performed. The second exposure head includes: second light emitting devices each emitting a second light beam; a second optical system performing imaging of each of the second light beams; a second coupler; and a second base member. The second coupler is provided at a second position, in the second base member, based on a position at which the imaging performed by the second optical system is performed and is fit into the first coupler.

A holding member 505 includes a first side wall portion 505a and a second side wall portion 505b, and a part of a surface 803b of a substrate 502 on a side opposite from a mounting surface 803 and a holding member 505 are fixed to each other by an adhesive. In the first side wall portion 505a, an inserting hole 801 opposing a corner portion 502 as of the substrate 502 in a widthwise direction of the substrate 502, and also, in the second side wall portion 505b, an inserting hole 801 opposing a corner portion 502bs of the substrate 502.

According to an aspect of the invention, a wiring structure includes a pair of printed circuit boards, a cable that connects the pair of printed circuit boards, and a grounding member that causes grounding of the cable in a region including a position separated from a connection end between the printed circuit board and the cable by a distance obtained by dividing a radiation mode length of a system including the cable and the pair of printed circuit boards as antennas by 2.

A system and method for selective heating and/or sintering of a material including first and second substrates, an array of one or more resistive heating elements arranged on a planar surface of a substrate and material to be heated located on the other substrate.