A liquid ejecting head supported by a support body includes: a first head chip; a holder having a holding portion holding the first head chip and a flange portion; and a heater heating the holding portion, in which the holding portion has a heat receiving portion receiving heat from the heater, and a shortest path of heat transferred through the holder from the heat receiving portion to the flange portion is bent or curved at two or more points.

A liquid ejecting head includes: head chips including a first-head-chip and a second-head-chip; a holder holding the head chips; and a heater along a direction parallel to a nozzle surface. The first-head-chip and the second-head-chip are disposed to be offset from each other in both a first-direction and a second-direction parallel to the nozzle surface and intersecting with each other. When a first-side is one of the four sides of a virtual rectangle circumscribing the aggregate of the head chips and a second-side and a third-side are coupled to both ends of the first-side, the first-head-chip is in contact with the first-side and the third-side and the second-head chip is in contact with the second-side. The heater overlaps the head chips. A first-region surrounded by the first-side, the second-side, the first-head-chip, and the second-head-chip includes a first-outside-part positioned outside the outer edge of the heater.

A liquid discharge head is provided in which heat of a heat sink is less apt to transfer to a head body. The liquid discharge head includes a head body 2a having a discharge hole for discharging a liquid therethrough, a driver IC 93 configured to control driving of the head body 2a, a casing 91 which is disposed on the head body 2a and has openings 91a and 91b on a side surface of the casing, and a heat sink 90 which is disposed on the openings 91a and 91b of the casing 91 and configured to dissipate heat generated in the driver IC 93, and a thermal insulation part 91e disposed between the heat sink 90 and the head body 2a. This makes it possible to reduce the likelihood that the heat of the heat sink 91e transfers to the head body 2a.

A cooling efficiency is increased. An inkjet head is provided with a head main body for jetting ink, a cooling pipe which has corrosion resistance to the ink, and through which the ink for cooling a drive circuit passes, and a cooling member which has higher thermal conductivity than that of the cooling pipe, in which at least a part of the cooling pipe is embedded, and which has recessed parts in at least a part of a portion surrounding the cooling pipe.

According to one embodiment, a liquid ejection head includes a substrate with a hole, a nozzle plate with a plurality of nozzles, and an actuator on a first surface of the substrate. The actuator has a plurality of pressure chambers aligned to the plurality of nozzles. An electrode has a first portion on the first surface of the substrate and a second portion on a second surface of the substrate. The second surface is on an opposite side of the substrate from the first surface. A manifold has a first liquid hole facing the hole in the substrate and a second liquid hole facing another portion of the substrate other than the hole. A shielding member is between the substrate and the manifold and covers the second liquid hole.

There is provided a head unit including: a substrate on which a first driving circuit is disposed; a heat sink fixed to the substrate; and heat conductive elastic bodies positioned between the substrate and the heat sink, in which the first driving circuit includes a first integrated circuit, a first amplifier circuit including a first transistor, and a first smoothing circuit that outputs the first driving signal, in which a first heat conductive elastic body is in contact with the heat sink and the first integrated circuit, a second heat conductive elastic body is in contact with the heat sink and the first transistor, and the first heat conductive elastic body and the second heat conductive elastic body are in a form of a gel having flame retardancy and electric insulation property.

An electronic device including a substrate, a first electronic component provided on the substrate, a second electronic component provided on the substrate and having a thickness in a normal direction of the substrate smaller than that of the first electronic component, a first heat conductive member in contact with the first electronic component, a second heat conductive member in contact with the second electronic component, and a heat sink attached to the substrate, in which the heat sink includes a base portion provided so as to cover the first electronic component and the second electronic component and attached to the substrate, a first protruding portion that protrudes from the base portion toward the first electronic component and is in contact with the first heat conductive member, and a second protruding portion that protrudes from the base portion toward the second electronic component and is in contact with the second heat conductive member, and a length of the first protruding portion in the normal direction is shorter than a length of the second protruding portion in the normal direction.

A liquid jetting head includes: a nozzle plate having a nozzle surface in which nozzles are open; a channel member having a first surface and a second surface on an opposite side to the first surface, the nozzle plate being joined to the first surface, the channel member being formed with channels communicating with the nozzles respectively and a cavity being different from the channels, the channels including pressure chambers respectively; drive elements provided on the second surface of the channel member to correspond to the pressure chambers respectively, the drive elements having terminals led out to the second surface of the channel member; and a wiring member having wirings, the wirings being joined to the terminals respectively on the second surface of the channel member.

There are provided a head chip, a liquid jet head, and a liquid jet recording device capable of enhancing the reliability. The head chip according to an embodiment of the disclosure includes a first plate having a plurality of pressure chambers adapted to apply pressure to a liquid, a second plate having a plurality of nozzle holes adapted to jet the liquid in response to application of the pressure, and a third plate disposed between the first and second plates, and provided with a plurality of through holes individually communicated with the plurality of pressure chambers and the plurality of nozzle holes, respectively. In the through hole, a second opening region opposed to the second plate is larger than a first opening region opposed to the first plate.

There are provided a liquid jet head and a liquid jet device capable of achieving reduction in size. There are included a first head chip and a second head chip stacked on one another in the Y direction, a first flow channel member disposed on the Y direction side of the first head chip, and having an inflow port communicated with an ink tank, and a first ink flow channel adapted to communicate the inflow port and the first head chip with each other, a second flow channel member disposed on the +Y direction of the second head chip, and having a second ink flow channel communicated with the second head chip, and a communication flow channel located between the first flow channel member and the second flow channel member, and adapted to communicate the first ink flow channel and the second ink flow channel with each other.