A printhead module includes: a monolithic substrate having alternate longitudinal slots and longitudinal ink supply channels defined through a thickness of the substrate and extending parallel with each other along a length of the substrate; and a plurality of rows of print chips mounted on a front face of the substrate, each row of print chips receiving ink only from a respective one of the ink supply channels. Each one of the longitudinal slots is configured to supply power and data only to a respective one of the rows of print chips.

In an example, a printhead includes a memristor, in which the memristor may include a first electrode, a second electrode positioned in a crossed relationship with the first electrode to form a junction, and a switching element positioned at the junction between the first electrode and the second electrode, in which the switching layer includes a via formed in the switching element to reduce an area of the switching element.

An element substrate including a liquid discharge element, comprising a memory element capable of storing individual information of the element substrate by a write, the memory element being configured to change an impedance value by the write, a plurality of current supply elements capable of supplying a current to the memory element, and a determination unit configured to determine presence/absence of the write based on a voltage generated in the memory element by the current selectively supplied from the plurality of current supply elements, wherein the plurality of current supply elements constitute a part of a current mirror circuit and each supply the current in an amount according to a size ratio to the memory element.

A system and method for selective heating and/or sintering of a material including first and second substrates, an array of one or more resistive heating elements arranged on a planar surface of a substrate and material to be heated located on the other substrate.

Printheads and techniques for manufacturing printheads are disclosed. An example method includes forming drive circuit components in a circuit layer. The method also includes forming a fluidic device that causes fluid to be ejected from a nozzle. The method also includes forming an interconnect layer that couples the drive circuit components.

A piezoelectric device includes an actuator substrate that includes a plurality of piezoelectric element rows having a plurality of piezoelectric elements, and a wiring substrate that is disposed so as to face the actuator substrate. The piezoelectric element rows include a plurality of individual electrodes disposed for each of the piezoelectric elements, and a common electrodes common to the plurality of piezoelectric elements. The wiring substrate includes a core portion disposed on a surface on the actuator substrate side, an individual wiring portion that partially covers the core portion, a common wiring portion that partially covers the core portion, and an auxiliary wiring disposed in a groove portion disposed on a first principal surface on the side opposite to the actuator substrate or on a second principal surface on the actuator substrate side. The auxiliary wiring is electrically connected to the common wiring portion. The individual electrode and the common electrode are respectively electrically connected to the individual wiring portion and the common wiring portion.

A liquid discharge head includes a piezoelectric element, a piezoelectric element-formed substrate, a drive IC, and a wiring board which has a first side and a second side intersecting each other. The wiring board has two surfaces including a first surface facing the drive IC and a second surface facing the piezoelectric element-formed substrate. The wiring board includes, on the first surface, a first input terminal for a drive signal to the piezoelectric element, a second input terminal for a control signal, a first wire connected to the first input terminal, and a second wire connected to the second input terminal. The first wire has a first connection terminal. The second wire has a second connection terminal. A distance along the second side from the first side to the first connection terminal is longer than a distance along the second side from the first side to the second connection terminal.

A piezoelectric device includes an actuator substrate that includes two rows of piezoelectric element rows piezoelectric elements, and a wiring substrate that is disposed so as to face the actuator substrate. The piezoelectric element rows include individual electrodes disposed for each of the piezoelectric elements, and a common electrode common to the piezoelectric elements. The wiring substrate includes a core portion disposed on a surface on the actuator substrate side, an individual wiring portion disposed for each of the piezoelectric element rows that partially covers the core portion, and a common wiring portion disposed for each of the piezoelectric element rows that partially covers the core portion. The two rows of piezoelectric element rows are respectively disposed so as to interpose the core portion. The individual wiring portion and the common wiring portion are respectively electrically connected to the individual electrode and the common electrode.

A printhead circuit or driving at least two actuating elements has a trim generating circuit for generating a trim signal using a comparator coupled to receive and compare feedback indicative of a present level of a drive voltage, with a configurable reference voltage value. The trim being based on a drive voltage feedback can give a more direct indication of actuating element output than given by timing references. Hence the trim can be more accurate, can be simpler, without accurate digital timing references, and thus costs can be reduced. It can be combined with a cold switch arrangement.

An inkjet head manufacturing method for an inkjet head that includes a head chip including: a nozzle ejecting ink; and a flow path substrate including an ink flow path which communicates with the nozzle and through which the ink flows, the method including: composite substrate manufacturing that is manufacturing a composite substrate including a plurality of regions which forms flow path substrates by being split; first protective film forming that is forming a first protective film on a surface of the composite substrate and an inner wall surface of the ink flow path; splitting that is splitting the composite substrate into the flow path substrates; and second protective film forming that is forming a second protective film on at least an exposed face in a split face of the flow path substrate generated in the splitting, the exposed face being exposed in a surface of the head chip.