A liquid discharge head includes a plurality of discharge elements, a plurality of driving elements, a plurality of control circuits, a first ground wiring and a first power supply wiring configured to supply power to the plurality of discharge elements and the plurality of driving elements, and a second ground wiring and a second power supply wiring configured to supply power to the plurality of control circuits. The first ground wiring and the first power supply wiring include, in a first conductive layer of a plurality of conductive layers, a first wiring group extending in a first direction, and in a second conductive layer, a second wiring group extending in a second direction which intersects with the first direction. The second power supply wiring is arranged on one of the first conductive layer and the second conductive layer.

A print element substrate, comprising a plurality of heating elements, a plurality of detection elements, each configured to detect a temperature of a corresponding heating element, a first current generation unit, a second current generation unit, and a signal output unit, wherein one of the first and second current generation units supplies a current to a first detection element, the other supplies a current to a second detection element, and the signal output unit outputs a signal according to a potential difference between one terminal of the first detection element on a side where a potential variation occurs upon supply of the current and one terminal of the second detection element on a side where a potential variation occurs upon supply of the current.

A liquid ejection head including a base substrate, an ejection port to eject a liquid, a heating element formed above the base substrate that heats the liquid to eject the liquid from the ejection port, a temperature detection element formed above the base substrate that detects a temperature of the liquid, a wiring layer connected to the heating element, a protective layer formed on the base substrate that protects the heating element and the wiring layer from the liquid, and a liquid supply port that penetrates the base substrate and supplies the liquid to the ejection port. When viewed in a direction perpendicular to the base substrate, the temperature detection element is disposed between the heating element and the liquid supply port, and the temperature detection element is formed on the protective layer.

A liquid discharge apparatus is provided, including a liquid discharge head including: an upper substrate, a plurality of piezoelectric elements, an intermediate substrate, a lower substrate and a plurality of individual traces arranged on the upper substrate and extending toward the contacts arranged on the one end side in the second direction from the plurality of piezoelectric elements respectively.

A heating device is provided. The heating device includes a substrate, a thin-film transistor disposed on the substrate, a heater disposed on the substrate, and a bridging component. The thin-film transistor includes a gate, a semiconductor layer, a source, and a drain. The bridging component is electrically connected to the heater and either the source or the drain. A method for fabricating the heating device is also provided.

A method of manufacturing a liquid discharge head substrate is provided. The method includes forming a first substrate that includes a semiconductor element and a first wiring structure; forming a second substrate that includes a liquid discharge element and a second wiring structure; and bonding the first wiring structure and the second wiring structure such that the semiconductor element and the liquid discharge element are electrically connected to each other after the forming the first substrate and the second substrate.

A liquid discharge head includes a nozzle member. The nozzle member includes a nozzle, a deformable laminar member, and an electromechanical transducer. The nozzle discharges liquid. The deformable laminar member has an opening forming the nozzle. The electromechanical transducer is disposed around the opening. The nozzle member is warped with respect to a discharge-side plane of the nozzle member in a surrounding area of the nozzle when no voltage is applied to the electromechanical transducer.

An element substrate of multi-layer structure, comprising an electrothermal transducing element formed in a first layer, a protective film covering the electrothermal transducing element, an anti-cavitation film formed on the protective film, a first electrical wire formed in the same layer as the anti-cavitation film, arranged to be separated from the electrothermal transducing element, and electrically connected to at least one end of the electrothermal transducing element, a second electrical wire on an opposite side, in relation to the electrothermal transducing element, to the protective film, and formed in a second layer, and a first connection member that extends between the first and second layers, and that electrically connects the first and second electrical wires.

Provided is an electronic device in which penetrating wires can be formed easily. The electronic device includes a sealing plate 33 having a first surface 41 to which a pressure chamber-forming plate 29 is connected and a second surface 42 which is on a side opposite from the first surface 41 and on which a drive IC 34 is provided; bump electrodes 40 which are arranged in a nozzle row direction on the first surface 41 of the sealing plate 33 and which output signals to piezoelectric elements 32; individual connection terminals 54 which are arranged in the nozzle row direction on the second surface 42 of the sealing plate 33 and to which the signals are inputted, wherein wires each of which connects one of the bump electrodes 40 to one of the individual connection terminals 54 corresponding to the bump electrode 40 each include a penetrating wire 45 formed inside a through hole 45a penetrating the sealing plate 33 and made of a conductor, the penetrating wires 45 are formed at positions away from the bump electrodes 40 or the individual connection terminals 54 in a direction perpendicular to the nozzle row direction, and each two of the penetrating wires 45 adjacent in the nozzle row direction are arranged at different positions in the direction perpendicular to the nozzle row direction.

A MEMS device includes a wire that is formed of a conductive portion embedded into a recess opened in a first face of a substrate and a bump electrode that is electrically connected to the wire. A total width, in a second direction intersecting a first direction along which the wire extends on the first face, of an opening of the recess in a connection region where the wire and the bump electrode are electrically connected to each other is narrower than a width, in the second direction, of an opening of the recess in a region outside the connection region.