A liquid discharge head includes a flow passage forming member, an element substrate including a liquid discharge element and a surface on which a conductive member made from a metallic material is disposed, and an intermediate layer made from a resin material and configured to join the flow passage forming member and the surface of the element substrate to each other. The intermediate layer is disposed in a state, separated from the conductive member, where the conductive member is exposed from the intermediate layer. The conductive member is covered with the flow passage forming member.

A liquid ejection head includes an ejection orifice for ejecting a liquid; a substrate on which an energy-generating element and an insulating layer are formed on a first surface; a liquid inflow path which penetrates the substrate and makes a liquid flow in a flow path disposed between the ejection orifice and the element; and a liquid outflow path which penetrates the substrate and makes the liquid flow out of the flow path. The liquid inflow path and the liquid outflow path have a first opening and a second opening penetrating the insulating layer on the first surface of the substrate, the ejection orifice is disposed between the liquid inflow path and the liquid outflow path, and an ejection orifice side end of the second opening is formed closer to the ejection orifice than an ejection orifice side end of the first opening.

One example provides a fluidic die including a semiconductor substrate, and a nozzle layer disposed on the substrate, the nozzle layer having a top surface opposite the substrate and including a nozzle formed therein, the nozzle including a fluid chamber disposed below the top surface and a nozzle orifice extending through the nozzle layer from the top surface to the fluid chamber, the fluid chamber to hold fluid, and the nozzle to eject fluid drops from the fluid chamber via the nozzle orifice. An electrode is disposed in contact with the nozzle layer about a perimeter of the nozzle orifice, the electrode to carry an electrical charge to adjust movement of electrically charged components of the fluid.

In some examples, a fluid dispensing die includes a plurality of fluid actuators to cause dispensing of a fluid from respective nozzles of the fluid dispensing die, and an electrically conductive layer including electrically conductive ground structures to connect respective fluid actuators of the plurality of fluid actuators to a ground, wherein the electrically conductive layer includes gaps provided between the electrically conductive ground structures of the electrically conductive layer.

A heterogeneous integration chip of a micro fluid actuator is disclosed and includes a first substrate, a first insulation layer, a first conductive layer, a piezoelectric layer, a second conductive layer, a second substrate, a control element, a perforated trench and a conductor. The first substrate includes a first chamber. The first insulation layer is disposed on the first substrate. The first conductive layer is disposed on the first insulation layer and includes an electrode pad. The piezoelectric layer and the second conductive layer are stacked on the first conductive layer sequentially. The second substrate is assembled to the first substrate through a bonding layer to define a second chamber and includes an orifice, a fluid flowing channel and a third chamber. The control element is disposed in the second substrate. The perforated trench filled with the conductor is penetrated from the electrode pad to the second substrate.

A liquid ejection head is provided with a recording element substrate, and the recording element substrate includes an ejection port member, an electric wiring layer including a pressure generating element array and electric connection portions, and a silicon substrate including the ejection port member and the electric wiring layer on a front surface. The silicon substrate includes a first through hole and a second through hole that protrude the electric connection portions. The rear surface of the silicon substrate is a (100) surface. An extension line of a side extending along the [110] direction, out of sides of the opening of the first trough hole and an extension line of a side extending along the [110] direction, out of sides of the opening of the second through hole are displaced from each other in a direction orthogonal to the [110] direction.

A method of manufacturing a MEMS device, the MEMS device comprising a movable Micro-Electro-Mechanical piezoelectric component and a CMOS circuit configured to be in conductive communication with the Micro-Electro-Mechanical component. A plurality of CMOS circuit layers are formed on a substrate to form the CMOS circuit, the plurality of CMOS circuit layers comprising a plurality of CMOS passivation and metallisation layers. A portion of at least one of the plurality of CMOS passivation and metallisation layers is removed in a component region of the device. One or more component region layers are formed in place of the removed portion in the component region to form the movable Micro-Electro-Mechanical piezoelectric component. The one or more component region layers are different from the portion of the at least one of the plurality of CMOS passivation and metallisation layers.

A liquid discharge device in which an inter-wiring region between a first wiring through which a first drive signal, and a second wiring through which a second drive signal propagates includes a wide inter-wiring region in which an inter-wiring distance between the first wiring and the second wiring is larger than a sum of a wire width of a fourth wiring and a minimum diameter of a via wiring, and a narrow inter-wiring region in which the inter-wiring distance is smaller than the sum of the wire width of the fourth wiring and the minimum diameter of the via wiring, and larger than a wire width of the via wiring, and a third wiring is not located in the narrow inter-wiring region between a virtual line coupling a first terminal and a second terminal, and the wide inter-wiring region, in the inter-wiring region of a first wiring layer.

A liquid discharge head includes a nozzle layer including a piezoelectric layer and having a nozzle penetrating through the nozzle layer, a liquid chamber communicating with the nozzle, and a drive circuit to apply a drive waveform to the piezoelectric layer to drive the piezoelectric layer. The drive waveform has a first waveform and a second waveform. The first waveform has a first voltage to discharge a liquid in the liquid chamber from the nozzle. The first voltage has a first rising edge from which the first voltage rises. The second waveform has a second voltage having a second rising edge from which the second voltage rises. The second rising edge is delayed from the first rising edge by (m−0.5)×Tc, where m represents a positive integer, and Tc represents a natural period of vibration of the piezoelectric layer.

A liquid discharging apparatus includes: liquid discharging modules which are arranged in a first direction along a predetermined plane; and a wiring member commonly joined to the liquid discharging modules. The wiring member includes: first parts joined to the liquid discharging modules, respectively, in a state that the first parts are arranged side by side in the first direction along the predetermined plane; second parts; and a sixth part. The second parts include: third parts extending from the first parts, respectively, in a second direction orthogonal to the first direction and along the predetermined plane, fourth parts extending in a third direction away from the predetermined plane, and fifth parts connected to the third parts and the fourth parts, respectively. Width in the first direction of each of the second parts is smaller than width in the first direction of the sixth part.