A liquid ejecting head includes: a plurality of head chips having nozzles; a holder holding the plurality of head chips; and a planar heater disposed on the holder and heating the holder, in which the heater includes an outer peripheral region along an outer edge of the holder and a middle region positioned inside the outer peripheral region in a plan view, and a heat generation amount per unit time of the outer peripheral region is larger than a heat generation amount per unit time of the middle region.

A liquid ejection head includes a recording element substrate including an energy generating element configured to generate energy for ejecting liquid from an ejection port; an electrical wiring board electrically connected to the recording element substrate to supply an electric signal for driving the energy generating element; a first support member supporting the recording element substrate; and a second support member supporting the first support member and having a greater linear expansion coefficient than the electrical wiring board, wherein the electrical wiring board is bonded to a first surface of the first support member and a second surface of the second support member, and an adhesive that bonds the electrical wiring board to the second surface has a lower elastic modulus than an adhesive that bonds the electrical wiring board to the first surface.

A multi-chip module (MCM) assembly comprising: a graphite substrate having a front surface and a back surface and comprising a plurality of silicon chips mounted on the front surface, a Printed Wiring Board (PWB) attached to the graphite substrate and provided with openings surrounding outer profiles of the silicon chips, the graphite substrate comprises one or more ink channels on the back surface and one or more ink feeding slots passing through the graphite substrate and being in fluidic communication with the respective one or more ink channels, so that each of the silicon chips can be fed with one or more different types of inks, the MCM assembly further comprises a graphite cover plate configured to cover the one or more ink channels of the graphite substrate.

The control section sets, as a first flow rate, a flow rate of the liquid, which is circulated by the circulating mechanism, per unit time, during an ejection operation of ejecting the liquid from the liquid ejecting head. The control section sets, as a second flow rate greater than the first flow rate, a flow rate of the liquid, which is circulated by the circulating mechanism, per unit time, during a recovery operation of recovering a state of the liquid ejecting head.

A liquid ejecting head includes: a plurality of individual flow channels provided with nozzles; a common supply flow channel through which a liquid is supplied to the plurality of individual flow channels; a common discharge flow channel through which the liquid is discharged from the plurality of individual flow channels; and a bypass flow channel that bypasses the plurality of individual flow channels and causes the common supply flow channel and the common discharge flow channel to communicate with each other. A combined flow channel resistance of the bypass flow channel and the plurality of individual flow channels is greater than a flow channel resistance of the common supply flow channel and is greater than a flow channel resistance of the common discharge flow channel.

A liquid ejecting apparatus includes a first liquid ejecting head configured to eject a liquid to an ejection direction, a sub-carriage that holds the first liquid ejecting head, and a carriage that holds the sub-carriage. The sub-carriage includes: a first member that is thermally conductive and holds the first liquid ejecting head; and a heating section provided in the first member. The first liquid ejecting head includes a first side wall facing the first member. The first member is located between the heating section and the first side wall when viewed in the ejection direction.

A multi-chip module (MCM) assembly comprising: a graphite substrate comprising a plurality of silicon chips directly attached to the graphite substrate, and a Printed Wiring Board (PWB) attached to the graphite substrate by means of a solvent-resistant adhesive glue and provided with openings surrounding outer profiles of the silicon chips. A printing bar comprising a plurality of the MCM assemblies is also disclosed.

There is provided a head unit including: a discharge section that includes a piezoelectric element driven by a driving signal and discharges a liquid; a first substrate; a second substrate; and a coupling member that electrically couples the first substrate and the second substrate, in which the coupling member includes a pin header having a plurality of insertion pins including a first insertion pin and a second insertion pin, and a holding section that holds the plurality of insertion pins in a state of being insulated, and a pin socket having the same number of a plurality of insertion holes as the plurality of insertion pins, which are provided corresponding to the plurality of insertion pins, and the coupling member electrically couples the first substrate and the second substrate by inserting the plurality of insertion pins into the corresponding plurality of insertion holes.

A pagewide printhead for printing redundantly in four colors. First and second rows of printhead chips are mounted on a common ink manifold having four ink supply channels for supplying four colors of ink to the first and second rows of printhead chips. Dedicated ink outlets interconnect one ink supply channel of the ink manifold with a pair of redundant nozzle rows in each printhead chip.

A liquid ejecting head that has an ejection surface configured to eject a liquid includes a plurality of head chips that are long in a first direction. The plurality of head chips are arranged inside a virtual parallelogram including a first virtual side and a second virtual side that are in contact with at least one of the plurality of head chips and that extend in the first direction, and a third virtual side and a fourth virtual side that are in contact with at least one of the plurality of head chips and that extend in a second direction intersecting the first direction, and the ejection surface is not overlapped with an acute-angled portion of the virtual parallelogram when the ejection surface is viewed in a normal direction of the ejection surface.