A manufacturing method of a liquid ejecting head is a manufacturing method of manufacturing a second liquid ejecting head by regenerating a first liquid ejecting head including a first head chip and a relay substrate including a terminal group ? and a terminal group ?, which are electrical coupling terminals to the first head chip. The manufacturing method includes a replacing step of replacing the first head chip with a second head chip compatible with the first head chip. The replacing step includes a first step of electrically separating the terminal group ? from the first head chip, and a second step of electrically coupling the terminal group ? that is compatible with the terminal group ? to the second head chip.

A liquid ejecting head includes a flow path structure having a first coupling flow path, a first head chip having a second coupling flow path that communicates with first nozzles, and a first joint member having a first relay flow path that communicates with the first coupling flow path and the second coupling flow path, in which the first joint member is detachably fixed to the flow path structure so that the first coupling flow path and the first relay flow path are coupled to each other, and the second coupling flow path and the first relay flow path liquid-tightly communicate with each other via an adhesive disposed around an opening of the first relay flow path facing the second coupling flow path.

Provided is a method for manufacturing a liquid ejection head including an ejection orifice for ejecting a liquid, a substrate and a flow path forming member that is joined to the substrate to form a liquid flow path communicating with the ejection orifice, the method including: (1) forming a resin layer having a flow path mold pattern, on the substrate; (2) adding a hydrophilizing material represented by Chemical Formula 1 to an entire surface layer of the resin layer; (3) forming a covering resin layer serving as the flow path forming member, on the resin layer and forming a compatible layer containing the resin layer, the covering resin layer and the hydrophilizing material, at an interface between the resin layer and the covering resin layer; (4) forming the ejection orifice by exposing the covering resin layer; and (5) forming a flow path by removing the resin layer.

Printing apparatus and methods of producing such a device are disclosed. An example printhead die includes a first resistor (404) to cause fluid to be ejected out of a first nozzle (142; 205; 305) and a second resistor (405) to cause fluid to be ejected out of a second nozzle (142, 205, 305). The example printhead die also includes a first cavitation plate (408) to cover the first resistor (404) and a second cavitation plate (412) to cover the second resistor (405), the first cavitation plate (408) spaced from the second cavitation plate (412).

There are provided a conductive base; a plurality of head main bodies which are held by the base and each have a switching element and a pressure generating element for discharging a liquid in a pressure generating chamber; a plurality of covers which are separated from the base, at least one of the pressure generating element and the switching element being sandwiched between the base and each of the covers; and a plurality of conduction portions which each conduct the base and the cover to each other at a plurality of locations.

A method for manufacturing a bonded substrate body in which an end portion of an adhesive is located at a position retreated in a direction to the inside of the bonded substrate body from an end surface of a bonding region of a first substrate and a second substrate includes forming a film on the end portion of the adhesive.

According to one embodiment, an inkjet head includes a plurality of actuators on a substrate in a row and spaced from each other, each actuator extending from the substrate to form a chamber space between each adjacent pair of actuators in the plurality of actuators, a flow passage block including a frame portion surrounding an outer periphery of the plurality of actuators and a blocking portion having protrusions sealing both ends of the chamber spaces between every other adjacent pair of actuators along the row, and a common ink chamber above the flow passage block and in fluid communication with the chamber spaces between any adjacent pairs of actuators not sealed at both ends by the blocking portion with a plurality of chamber spaces.

A liquid ejection head substrate includes a base layer, a heating resistance element provided over the base layer to generate a heat energy for ejecting a liquid, a first insulation layer covering the heating resistance element, and a protective layer having, on the first insulation layer, a first region which overlaps the heating resistance element via the first insulation layer and a second region which does not overlap the heating resistance element and formed of a material including a metal which is eluted by an electrochemical reaction. The liquid ejection head substrate further includes a second insulation layer provided over a region overlying the base layer and not provided with the protective layer and over the second region of the protective layer.

A valve unit includes a flow path member having an opening surface that has a flow path opening of a liquid flow path, a valve having a sealing surface configured to seal the flow path opening, and a sealing member disposed on one of a peripheral portion of the flow path opening in the opening surface and a portion of the sealing surface facing the peripheral portion. The sealing surface is configured to be moved forward and backward relative to the opening surface to open and close the flow path opening. The sealing member is configured to be in contact with the peripheral portion of the flow path opening and the sealing surface when the valve is closed. The sealing member includes a fluorinated polyether.

Channel grooves for a discharge channel and a non-discharge channel are formed in the surface of an actuator plate by cutting. The discharge channel includes an extension portion and a raise-and-cut portion, and the non-discharge channel also includes an extension portion and a raise-and-cut portion. In an embodiment, an electrode clearance groove is formed in advance by cutting with a dicing blade or the like. After the electrode clearance groove is formed, an electrode is formed by plating. Since plating is performed after the electrode clearance groove is formed, a clearance groove electrode is integrally formed with an AP-side common pad in the electrode clearance groove, and thus the clearance groove electrode and the AP-side common pad are short-circuited. Thus, an electrode separation portion is formed by cutting a short-circuited portion of the clearance groove electrode and the AP-side common pad through cutting or irradiation with laser.