Patent classifications
B
PERFORMING OPERATIONS; TRANSPORTING
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B41
PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
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B41N
PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
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1/00
Printing plates or foils; Materials therefor
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B41N1/24
Stencils; Stencil materials; Carriers therefor
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B41N1/242
Backing sheets; Top sheets; Intercalated sheets, e.g. cushion sheets; Release layers or coatings; Means to obtain a contrasting image, e.g. with a carbon sheet or coating
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B41N1/242

Template that improves solder-paste stenciling and production method thereof
11297719 · 2022-04-05 · ·

A template or stencil with perforations, which improves solder-paste stencilling on an object, includes: a first area treated with precision powder on a bottom laminar face of the template, the treated face covering at least an area where perforations are distributed; a second area treated with precision powder on a top laminar surface of the template, the second treated area encircling the perforations; and a third area treated twice with precision powder on the bottom laminar surface, the third area encircling the perforations of the template. A method for producing a template that improves solder-paste stencilling on an object is also provided, as is and to a method for the improved application of solder-paste on an object, such as a printed circuit board.

TEMPLATE THAT IMPROVES SOLDER-PASTE STENCILLING AND PRODUCTION METHOD THEREOF
20200396844 · 2020-12-17 ·

The invention relates to a template or stencil with perforations, which improves solder-paste stencilling on an object and comprises: a first area treated with precision powder on a bottom laminar face of the template, said treated face covering at least an area where perforations are distributed; a second area treated with precision powder on a top laminar surface of the template, said second treated area encircling the perforations; and a third area treated twice with precision powder on the bottom laminar surface, said third area encircling the perforations of the template. The invention also relates to a method for producing a template that improves solder-paste stencilling on an object, and to a method for the improved application of solder-paste on an object, such as a printed circuit board.