An image sensor includes a two-dimensional pixel array in which a plurality of pixels including photoelectric conversion elements are arranged in the form of an array on a substrate, a transparent layer formed on the two-dimensional pixel array, and a two-dimensional spectroscopic element array in which a plurality of spectroscopic elements are arranged in the form of an array inside or on the transparent layer. Each spectroscopic element includes a plurality of microstructures having a higher refractive index than a refractive index of the transparent layer. The plurality of microstructures have a microstructure pattern. Each of the spectroscopic elements splits incident light into first to fourth deflected lights, which have different transmission directions, according to the wavelength region. First to fourth pixels, which are adjacent to each other and are located directly below each of the spectroscopic elements, respectively detect the first to fourth deflected lights.

A method of forming a device, the method including depositing a first photoresist layer over a substrate, forming an array of seed lenses by patterning and reflowing the first photoresist layer, a dimension of the array of seed lenses varying across the substrate, forming a second photoresist layer over the array of seed lenses, and forming a microlens array by patterning and reflowing the second photoresist layer.

Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for eye gesture recognition. In one aspect, a method includes obtaining an electrical signal that represents a measurement, by a photodetector, of an optical signal reflected from an eye and determining a depth map of the eye based on phase differences between the electrical signal generated by the photodetector and a reference signal. Further, the method includes determining gaze information that represents a gaze of the eye based on the depth map and providing output data representing the gaze information.

An image sensor in which a length of a pixel portion in a first direction is longer than a length of the pixel portion in a second direction orthogonal to the first direction. The pixel portion includes: a plurality of microlenses arranged in a matrix in the first direction and the second direction, and a plurality of photoelectric conversion portions provided for each microlens of at least some of the plurality of microlenses and configured to perform photoelectric conversion on light that has entered the photoelectric conversion portions via the each microlens. The plurality of photoelectric conversion portions are arranged in at least one of the first and second directions, and an electric charge crosstalk rate between a plurality of photoelectric conversion portions arranged in the first direction is higher than that between a plurality of photoelectric conversion portions arranged in the second direction.

An electronic device is provided. The electronic device includes a display having a plurality of pixels. The display defines a transparent region positioned between a first pixel of the plurality of pixels and a second pixel of the plurality of pixels. The electronic device includes an image sensor positioned underneath the display. The image sensor is aligned with the transparent region defined by the display. The electronic device further includes an optic positioned on the display and over the transparent region defined by the display. The optic is configured to direct external light into the transparent region of the display.

Forming a back-illuminated type CMOS image sensor, includes process for formation of a registration mark on the wiring side of a silicon substrate during formation of an active region or a gate electrode. A silicide film using an acitve region may also be used for the registration mark. Thereafter, the registration mark is read from the back-side by use of red light or near infrared rays, and registration of the stepper is accomplished. It is also possible to form a registration mark in a silicon oxide film on the back-side (illuminated side) in registry with the registration mark on the wiring side, and to achieve the desired registration by use of the registration mark thus formed.

A structure including a first semiconductor chip with front and rear surfaces and a cavity in the rear surface. A second semiconductor chip is mounted within the cavity. The first chip may have vias extending from the cavity to the front surface and via conductors within these vias serving to connect the additional microelectronic element to the active elements of the first chip. The structure may have a volume comparable to that of the first chip alone and yet provide the functionality of a multi-chip assembly. A composite chip incorporating a body and a layer of semiconductor material mounted on a front surface of the body similarly may have a cavity extending into the body from the rear surface and may have an additional microelectronic element mounted in such cavity.

So as to obtain color parallax images, it has been necessary to prepare an image capturing optical system and an image capturing element that are complex, to capture the parallax images. In view of this, provided is an image processing apparatus including: an image obtaining section that obtains original image data including a pixel having a pixel value of any of primary colors constituting colors of a subject image and a pixel having a pixel value showing at least a parallax of the subject image; and an image generating section that generates, from the original image data, primary color image data made up of pixels having the pixel value of the primary color, and parallax image data made up of pixels having the pixel value showing the parallax.

Methods for glass removal while forming CMOS image sensors. A method for forming a device is provided that includes forming a plurality of pixel arrays on a device wafer; bonding a carrier wafer to a first side of the device wafer; bonding a substrate over a second side of the device wafer; thinning the carrier wafer; forming electrical connections to the first side of the device wafer; subsequently de-bonding the substrate from the second side of the device wafer; and subsequently singulating individuals ones of the plurality of pixel arrays from the device wafer. An apparatus is disclosed.

A curved image sensor chip has a first side and a second side opposite the first side. The second side includes light sensors configured to generate electrical signals in response to receiving light. A substrate is in contact with the first side of the curved image sensor chip and is configured to increase in volume so as to apply a bending force to form the curved image sensor chip.